Inventor · disambiguated record
Rajendra C. Dias
Also filed as: DIAS RAJENDRA · DIAS RAJENDRA C
27 granted patents·10 pending applications·63 citations·filing 2006–2019
94Inventor score
Top patents by PatentIndex Score
37 records- 0192US10192810B2Underfill material flow control for reduced die-to-die spacing in semiconductor packagesINTEL CORP·Filed 2013·Granted Jan 29, 2019·13 cites·9 claims
- 0291US10461007B2Semiconductor package with electromagnetic interference shieldingINTEL CORP·Filed 2015·Granted Oct 29, 2019·8 cites·19 claims
- 0391US9685413B1Semiconductor package having an EMI shielding layerINTEL CORP·Filed 2016·Granted Jun 20, 2017·12 cites·16 claims
- 0485US10685949B2Flexible electronic system with wire bondsINTEL CORP·Filed 2017·Granted Jun 16, 2020·4 cites·18 claims
- 0579US9591758B2Flexible electronic system with wire bondsINTEL CORP·Filed 2014·Granted Mar 7, 2017·4 cites·4 claims
- 0678US9953929B2Systems and methods for electromagnetic interference shieldingINTEL CORP·Filed 2016·Granted Apr 24, 2018·2 cites·7 claims
- 0774US9991211B2Semiconductor package having an EMI shielding layerINTEL CORP·Filed 2017·Granted Jun 5, 2018·2 cites·14 claims
- 0873US10535615B2Electronic package that includes multi-layer stiffenerINTEL CORP·Filed 2016·Granted Jan 14, 2020·2 cites·14 claims
- 0972US9721906B2Electronic package with corner supportsINTEL CORP·Filed 2015·Granted Aug 1, 2017·2 cites·12 claims
- 1070US10634594B2Membrane test for mechanical testing of stretchable electronicsINTEL CORP·Filed 2016·Granted Apr 28, 2020·1 cites·23 claims
- 1170US10224290B2Electromagnetically shielded electronic devices and related systems and methodsINTEL CORP·Filed 2015·Granted Mar 5, 2019·2 cites·20 claims
- 1268US9431274B2Method for reducing underfill filler settling in integrated circuit packagesINTEL CORP·Filed 2012·Granted Aug 30, 2016·2 cites·7 claims
- 1367US10229887B2Systems and methods for electromagnetic interference shieldingINTEL CORP·Filed 2016·Granted Mar 12, 2019·1 cites·6 claims
- 1466US9887104B2Electronic package and method of connecting a first die to a second die to form an electronic packageINTEL CORP·Filed 2014·Granted Feb 6, 2018·2 cites·7 claims
- 1565US7280190B1Electro-optic time domain reflectometryINTEL CORP·Filed 2006·Granted Oct 9, 2007·4 cites·19 claims
- 1662US8999765B2Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structuresINTEL CORP·Filed 2013·Granted Apr 7, 2015·1 cites·16 claims
- 1761US10468357B2Stretchable electronics fabrication method with strain redistribution layerINTEL CORP·Filed 2015·Granted Nov 5, 2019·1 cites·21 claims
- 1858US10763220B2Systems and methods for electromagnetic interference shieldingINTEL CORP·Filed 2019·Granted Sep 1, 2020·0 cites·20 claims
- 1958US10615128B2Systems and methods for electromagnetic interference shieldingINTEL CORP·Filed 2018·Granted Apr 7, 2020·0 cites·17 claims
- 2055US11854945B2Underfill material flow control for reduced die-to-die spacing in semiconductor packagesTAHOE RES LTD·Filed 2018·Granted Dec 26, 2023·0 cites·28 claims
- 2154US10325866B2Electronic device packages with conformal EMI shielding and related methodsINTEL CORP·Filed 2017·Granted Jun 18, 2019·0 cites·14 claims
- 2252US9704811B1Perforated conductive material for EMI shielding of semiconductor device and componentsINTEL CORP·Filed 2015·Granted Jul 11, 2017·0 cites·20 claims
- 2351US9847304B2Electronic device packages with conformal EMI shielding and related methodsINTEL CORP·Filed 2015·Granted Dec 19, 2017·0 cites·9 claims
- 2450US2017250145A1Perforated conductive material for emi shielding of semiconductor device and componentsINTEL CORP·Filed 2017·Application pending·0 cites
- 2547US9230833B2Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structuresINTEL CORP·Filed 2015·Granted Jan 5, 2016·0 cites·16 claims
- 2645US2016343591A1Reduction of underfill filler settling in integrated circuit packagesINTEL CORP·Filed 2016·Application pending·0 cites
- 2744US2008272481A1Pin grid array package substrate including slotted pinsDIAS RAJENDRA·Filed 2007·Application pending·0 cites
- 2839US10206277B2Gradient encapsulant protection of devices in stretchable electronicsINTEL CORP·Filed 2015·Granted Feb 12, 2019·0 cites·15 claims
- 2939US2017269017A1Inflatable Bladder Based Mechanical Testing for Stretchable ElectronicsINTEL CORP·Filed 2016·Application pending·0 cites
- 3038US2018089984A1Device, system and method for detecting degradation of a flexible circuitINTEL CORP·Filed 2016·Application pending·0 cites
- 3138US2017268972A1Lateral Expansion Apparatus for Mechanical Testing of Stretchable ElectronicsINTEL CORP·Filed 2016·Application pending·0 cites
- 3237US2017018525A1Method and process for emib chip interconnectionsINTEL CORP·Filed 2014·Application pending·0 cites
- 3335US9786517B2Ablation method and recipe for wafer level underfill material patterning and removalDIAS RAJENDRA C·Filed 2013·Granted Oct 10, 2017·0 cites·13 claims
- 3435US2017179041A1Semiconductor package with trenched molding-based electromagnetic interference shieldingINTEL CORP·Filed 2015·Application pending·0 cites
- 3534US9508660B2Microelectronic die having chamfered cornersINTEL CORP·Filed 2015·Granted Nov 29, 2016·0 cites·24 claims
- 3631US2015072515A1Laser ablation method and recipe for sacrificial material patterning and removalDIAS RAJENDRA C·Filed 2013·Application pending·0 cites
- 3729US2017287847A1Integrated circuit package having integrated emi shieldDIAS RAJENDRA C·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →