Inventor · disambiguated record
Haruki Ito
Also filed as: ITO HARUKI
53 granted patents·7 pending applications·1,141 citations·filing 1990–2021
98Inventor score
Files withSEIKO EPSON CORP38ADVANCED INTERCONNECT SYSTEMS LTD9ITO HARUKI4NIPPON OILS & FATS CO LTD4AISIN SEIKI2
Top patents by PatentIndex Score
60 records- 0198US6667551B2Semiconductor device and manufacturing thereof, including a through-hole with a wider intermediate cavitySEIKO EPSON CORP·Filed 2001·Granted Dec 23, 2003·233 cites·29 claims
- 0297US7246432B2Method of manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2006·Granted Jul 24, 2007·67 cites·6 claims
- 0397US7098127B2Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipmentSEIKO EPSON CORP·Filed 2003·Granted Aug 29, 2006·108 cites·4 claims
- 0497US6608371B2Semiconductor device and method of manufacturing the same, circuit board, and electronic equipmentSEIKO EPSON CORP·Filed 2001·Granted Aug 19, 2003·243 cites·37 claims
- 0595US6852621B2Semiconductor device and manufacturing method therefor, circuit board, and electronic equipmentSEIKO EPSON CORP·Filed 2003·Granted Feb 8, 2005·82 cites·19 claims
- 0694US8294260B2Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusITO HARUKI·Filed 2011·Granted Oct 23, 2012·12 cites·11 claims
- 0794US7495331B2Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusSEIKO EPSON CORP·Filed 2006·Granted Feb 24, 2009·16 cites·11 claims
- 0892US10636726B2Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusADVANCED INTERCONNECT SYSTEMS LTD·Filed 2019·Granted Apr 28, 2020·3 cites·30 claims
- 0990US5439896AThermosetting powdery coating compositionNIPPON OILS & FATS CO LTD·Filed 1993·Granted Aug 8, 1995·67 cites·10 claims
- 1089US7276792B2Semiconductor device, circuit substrate, electro-optic device and electronic applianceSEIKO EPSON CORP·Filed 2005·Granted Oct 2, 2007·8 cites·12 claims
- 1189US6707153B2Semiconductor chip with plural resin layers on a surface thereof and method of manufacturing sameSEIKO EPSON CORP·Filed 2001·Granted Mar 16, 2004·75 cites·20 claims
- 1288US6325431B1Roll-formed product and vehicle bumper using the sameAISIN SEIKI·Filed 2000·Granted Dec 4, 2001·45 cites·8 claims
- 1387US10312182B2Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusADVANCED INTERCONNECT SYSTEMS LTD·Filed 2018·Granted Jun 4, 2019·2 cites·29 claims
- 1486US7982310B2Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatusSEIKO EPSON CORP·Filed 2009·Granted Jul 19, 2011·8 cites·10 claims
- 1584US7851265B2Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatusSEIKO EPSON CORP·Filed 2007·Granted Dec 14, 2010·7 cites·8 claims
- 1684US7528476B2Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2005·Granted May 5, 2009·13 cites·9 claims
- 1784US6940160B1Semiconductor device and method of manufacture thereof, circuit board, and electronic instrumentSEIKO EPSON CORP·Filed 2000·Granted Sep 6, 2005·42 cites·18 claims
- 1883US7679153B2Sealed surface acoustic wave element packageSEIKO EPSON CORP·Filed 2005·Granted Mar 16, 2010·10 cites·5 claims
- 1982US5147934AThermosetting powdery coating compositionNIPPON OILS & FATS CO LTD·Filed 1990·Granted Sep 15, 1992·25 cites·14 claims
- 2079US9863828B2Physical quantity sensor, electronic device, altimeter, electronic apparatus, and mobile objectSEIKO EPSON CORP·Filed 2015·Granted Jan 9, 2018·3 cites·19 claims
- 2179US2022115296A1Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusADVANCED INTERCONNECT SYSTEMS LTD·Filed 2021·Application pending·0 cites
- 2278US7566584B2Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing methodSEIKO EPSON CORP·Filed 2006·Granted Jul 28, 2009·8 cites·15 claims
- 2378US7365561B2Test probe and tester, method for manufacturing the test probeSEIKO EPSON CORP·Filed 2005·Granted Apr 29, 2008·8 cites·9 claims
- 2478US7132749B2Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipmentSEIKO EPSON CORP·Filed 2005·Granted Nov 7, 2006·5 cites·3 claims
- 2577US9105534B2Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatusSEIKO EPSON CORP·Filed 2014·Granted Aug 11, 2015·2 cites·12 claims
- 2677US8847406B2Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatusSEIKO EPSON CORP·Filed 2013·Granted Sep 30, 2014·2 cites·6 claims
- 2777US7888799B2Semiconductor device, circuit substrate, electro-optic device and electronic applianceSEIKO EPSON CORP·Filed 2010·Granted Feb 15, 2011·2 cites·15 claims
- 2876US7830007B2Electronic device, method of producing the same, and semiconductor deviceSEIKO EPSON CORP·Filed 2008·Granted Nov 9, 2010·6 cites·9 claims
- 2975US11205608B2Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusADVANCED INTERCONNECT SYSTEMS LTD·Filed 2020·Granted Dec 21, 2021·0 cites·20 claims
- 3075US8482121B2Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatusITO HARUKI·Filed 2011·Granted Jul 9, 2013·2 cites·9 claims
- 3175US7741712B2Semiconductor device, circuit substrate, electro-optic device and electronic applianceSEIKO EPSON CORP·Filed 2007·Granted Jun 22, 2010·2 cites·18 claims
- 3274US6488788B2Flat plate member with a gear portion and a process for making the sameAISIN SEIKI·Filed 2001·Granted Dec 3, 2002·8 cites·6 claims
- 3371US7482541B2Panel for electro-optical apparatus, method of manufacture thereof, electro-optical apparatus and electronic apparatusSEIKO EPSON CORP·Filed 2005·Granted Jan 27, 2009·3 cites·26 claims
- 3470US10727166B2Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusADVANCED INTERCONNECT SYSTEMS LTD·Filed 2019·Granted Jul 28, 2020·0 cites·30 claims
- 3569US10424533B1Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusADVANCED INTERCONNECT SYSTEMS LTD·Filed 2019·Granted Sep 24, 2019·0 cites·30 claims
- 3668US7795129B2Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipmentSEIKO EPSON CORP·Filed 2006·Granted Sep 14, 2010·2 cites·1 claims
- 3766US12031267B2Synthetic leatherSEIREN CO LTD·Filed 2020·Granted Jul 9, 2024·0 cites·17 claims
- 3866US10361144B2Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusADVANCED INTERCONNECT SYSTEMS LTD·Filed 2018·Granted Jul 23, 2019·0 cites·28 claims
- 3966US10283438B2Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusADVANCED INTERCONNECT SYSTEMS LTD·Filed 2018·Granted May 7, 2019·0 cites·28 claims
- 4066US10262923B2Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusADVANCED INTERCONNECT SYSTEMS LTD·Filed 2018·Granted Apr 16, 2019·0 cites·28 claims
- 4163US8896104B2Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusSEIKO EPSON CORP·Filed 2014·Granted Nov 25, 2014·0 cites·11 claims
- 4263US2015041992A1Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusSEIKO EPSON CORP·Filed 2014·Application pending·0 cites
- 4361US8673767B2Manufacturing method for semiconductor deviceSEIKO EPSON CORP·Filed 2012·Granted Mar 18, 2014·0 cites·4 claims
- 4461US7129581B2Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatusSEIKO EPSON CORP·Filed 2004·Granted Oct 31, 2006·9 cites·11 claims
- 4559US8227878B2Sealed surface acoustic wave element packageITO HARUKI·Filed 2010·Granted Jul 24, 2012·1 cites·7 claims
- 4658US8012864B2Manufacturing method for interconnection having stress-absorbing layer between the semiconductor substrate and the external connection terminalSEIKO EPSON CORP·Filed 2008·Granted Sep 6, 2011·0 cites·4 claims
- 4757US9589886B2Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatusSEIKO EPSON CORP·Filed 2015·Granted Mar 7, 2017·0 cites·8 claims
- 4857US8004077B2Interconnection of land section to wiring layers at center of external connection terminals in semiconductor device and manufacturing thereofSEIKO EPSON CORP·Filed 2010·Granted Aug 23, 2011·0 cites·7 claims
- 4956US2007013393A1Test probe and tester, method for manufacturing the test probeSEIKO EPSON CORP·Filed 2006·Application pending·0 cites
- 5055US9362246B2Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipmentSEIKO EPSON CORP·Filed 2015·Granted Jun 7, 2016·0 cites·4 claims
Showing the top 50 of 60 patent records by PatentIndex Score.
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