Assignee
ADVANCED INTERCONNECT SYSTEMS LTD
IE·8 granted patents·1 pending application·5 citations·filing 2018–2021
Top patents by PatentIndex Score
9 records- 0192US10636726B2Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusADVANCED INTERCONNECT SYSTEMS LTD·Filed 2019·Granted Apr 28, 2020·3 cites·30 claims
- 0287US10312182B2Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusADVANCED INTERCONNECT SYSTEMS LTD·Filed 2018·Granted Jun 4, 2019·2 cites·29 claims
- 0379US2022115296A1Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusADVANCED INTERCONNECT SYSTEMS LTD·Filed 2021·Application pending·0 cites
- 0475US11205608B2Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusADVANCED INTERCONNECT SYSTEMS LTD·Filed 2020·Granted Dec 21, 2021·0 cites·20 claims
- 0570US10727166B2Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusADVANCED INTERCONNECT SYSTEMS LTD·Filed 2019·Granted Jul 28, 2020·0 cites·30 claims
- 0669US10424533B1Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusADVANCED INTERCONNECT SYSTEMS LTD·Filed 2019·Granted Sep 24, 2019·0 cites·30 claims
- 0766US10361144B2Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusADVANCED INTERCONNECT SYSTEMS LTD·Filed 2018·Granted Jul 23, 2019·0 cites·28 claims
- 0866US10283438B2Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusADVANCED INTERCONNECT SYSTEMS LTD·Filed 2018·Granted May 7, 2019·0 cites·28 claims
- 0966US10262923B2Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusADVANCED INTERCONNECT SYSTEMS LTD·Filed 2018·Granted Apr 16, 2019·0 cites·28 claims
Join the waitlist — get patent alerts
Get an alert when ADVANCED INTERCONNECT SYSTEMS LTD files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →