Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus

Abstract

A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face; an external connection terminal that is disposed at the first face side; a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and an electronic element that is disposed at a second face side.

What is claimed is: 
     
         1 . A semiconductor device comprising:
 an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face;   an external connection terminal that is disposed at the first face side;   a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal; and   an electronic element that is disposed at a second face side.   
     
     
         2 . The semiconductor device according to  claim 1 , further comprising
 a first insulator that is disposed between the conductive portion and a sidewall of the through hole.   
     
     
         3 . The semiconductor device according to  claim 1 , further comprising
 a second insulator that is disposed between the external connection terminal and the semiconductor substrate.   
     
     
         4 . An electronic component comprising:
 an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a first face and a second face, the second face opposing the first face, the semiconductor substrate having a through hole from the first face to the second face;   an external connection terminal that is disposed at the first face side;   an electronic element that is disposed at a second face side of the semiconductor substrate; and   a conductive portion that is disposed in the through hole, the conductive portion being electrically connected to the external connection terminal and the electronic element.   
     
     
         5 . The electronic component according to  claim 4 , further comprising
 a first insulator that is disposed between the conductive portion and a sidewall of the through hole.   
     
     
         6 . The electronic component according to  claim 4 , further comprising
 a second insulator that is disposed between the external connection terminal and the semiconductor substrate.   
     
     
         7 . A circuit substrate on which the electronic component according to  claim 4  is packaged. 
     
     
         8 . An electronic apparatus comprising the electronic component according to  claim 4 .