Inventor · disambiguated record
Zhengquan Tan
Also filed as: TAN ZHENGQUAN
22 granted patents·10 pending applications·1,329 citations·filing 1999–2024
96Inventor score
Top patents by PatentIndex Score
32 records- 0198US6929700B2Hydrogen assisted undoped silicon oxide deposition process for HDP-CVDAPPLIED MATERIALS INC·Filed 2003·Granted Aug 16, 2005·482 cites·18 claims
- 0298US6596653B2Hydrogen assisted undoped silicon oxide deposition process for HDP-CVDAPPLIED MATERIALS INC·Filed 2001·Granted Jul 22, 2003·542 cites·29 claims
- 0397US10013518B2Model building and analysis engine for combined X-ray and optical metrologyKLA TENCOR CORP·Filed 2013·Granted Jul 3, 2018·29 cites·20 claims
- 0496US11555689B2Measuring thin films on grating and bandgap on gratingKLA TENCOR CORP·Filed 2020·Granted Jan 17, 2023·4 cites·19 claims
- 0595US11573077B2Scatterometry based methods and systems for measurement of strain in semiconductor structuresKLA CORP·Filed 2021·Granted Feb 7, 2023·4 cites·7 claims
- 0694US6740601B2HDP-CVD deposition process for filling high aspect ratio gapsAPPLIED MATERIALS INC·Filed 2001·Granted May 25, 2004·53 cites·39 claims
- 0793US10458912B2Model based optical measurements of semiconductor structures with anisotropic dielectric permittivityKLA TENCOR CORP·Filed 2017·Granted Oct 29, 2019·6 cites·27 claims
- 0887US7349079B2Methods for measurement or analysis of a nitrogen concentration of a specimenKLA TENCOR TECH CORP·Filed 2004·Granted Mar 25, 2008·37 cites·17 claims
- 0986US11378451B2Bandgap measurements of patterned film stacks using spectroscopic metrologyKLA TENCOR CORP·Filed 2017·Granted Jul 5, 2022·3 cites·44 claims
- 1086US7196021B2HDP-CVD deposition process for filling high aspect ratio gapsAPPLIED MATERIALS INC·Filed 2005·Granted Mar 27, 2007·5 cites·14 claims
- 1184US6423384B1HDP-CVD deposition of low dielectric constant amorphous carbon filmAPPLIED MATERIALS INC·Filed 1999·Granted Jul 23, 2002·76 cites·11 claims
- 1276US6682603B2Substrate support with extended radio frequency electrode upper surfaceAPPLIED MATERIALS INC·Filed 2002·Granted Jan 27, 2004·21 cites·17 claims
- 1373US6596123B1Method and apparatus for cleaning a semiconductor wafer processing systemAPPLIED MATERIALS INC·Filed 2000·Granted Jul 22, 2003·15 cites·13 claims
- 1472US6812153B2Method for high aspect ratio HDP CVD gapfillAPPLIED MATERIALS INC·Filed 2002·Granted Nov 2, 2004·13 cites·7 claims
- 1571US11796390B2Bandgap measurements of patterned film stacks using spectroscopic metrologyKLA CORP·Filed 2022·Granted Oct 24, 2023·0 cites·14 claims
- 1671US6914016B2HDP-CVD deposition process for filling high aspect ratio gapsAPPLIED MATERIALS INC·Filed 2004·Granted Jul 5, 2005·8 cites·31 claims
- 1768US6715496B2Method and apparatus for cleaning a semiconductor wafer processing systemAPPLIED MATERIALS INC·Filed 2003·Granted Apr 6, 2004·10 cites·12 claims
- 1868US2025053098A1Spatially-varying spectral metrology for local variation detectionKLA CORP·Filed 2024·Application pending·0 cites
- 1968US2025110042A1Spectroscopic Ellipsometry With Detector Resolved Numerical Aperture For Deep Structure MetrologyKLA CORP·Filed 2024·Application pending·0 cites
- 2064US7159597B2Multistep remote plasma clean processAPPLIED MATERIALS INC·Filed 2002·Granted Jan 9, 2007·19 cites·23 claims
- 2164US2025198942A1Measurements Of Complex Semiconductor Structures Based On Component Measurement SignalsKLA CORP·Filed 2024·Application pending·0 cites
- 2263US2025105064A1Electrical Performance Prediction Based On Structural Measurements Of Partially Fabricated Semiconductor DevicesKLA CORP·Filed 2024·Application pending·0 cites
- 2362US2025238690A1Machine Learning Based Semiconductor Measurement Models Trained Using Historical DataKLA CORP·Filed 2024·Application pending·0 cites
- 2460US2024151770A1Methods And Systems For Measurement Of Semiconductor Structures Based On Derivative Measurement SignalsKLA CORP·Filed 2023·Application pending·0 cites
- 2559US12379672B2Metrology of nanosheet surface roughness and profileKLA CORP·Filed 2023·Granted Aug 5, 2025·0 cites·40 claims
- 2659US11060846B2Scatterometry based methods and systems for measurement of strain in semiconductor structuresKLA CORP·Filed 2019·Granted Jul 13, 2021·0 cites·21 claims
- 2759US2025146893A1Transistor channel stress and mobility metrology using multipass spectroscopic ellipsometry and raman joint measurementKLA CORP·Filed 2024·Application pending·0 cites
- 2858US2025224344A1Measurements Of Semiconductor Structures Based On Data Collected At Prior Process StepsKLA CORP·Filed 2024·Application pending·0 cites
- 2958US2025123225A1Spectra delta metrologyKLA CORP·Filed 2024·Application pending·0 cites
- 3056US10663286B2Measuring thin films on grating and bandgap on gratingKLA TENCOR CORP·Filed 2017·Granted May 26, 2020·0 cites·22 claims
- 3156US2025012734A1Multiple Pass Optical Measurements Of Semiconductor StructuresKLA CORP·Filed 2024·Application pending·0 cites
- 3250US7064077B2Method for high aspect ratio HDP CVD gapfillAPPLIED MATERIALS INC·Filed 2004·Granted Jun 20, 2006·2 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Zhengquan Tan files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →