Inventor · disambiguated record
James M. Holden
Also filed as: HOLDEN JAMES M · HOLDEN JAMES MATTHEW
57 granted patents·9 pending applications·2,575 citations·filing 1996–2024
99Inventor score
Top patents by PatentIndex Score
66 records- 0198US6760768B2Method and system for establishing a security perimeter in computer networksMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 6, 2004·169 cites·26 claims
- 0297US8642448B2Wafer dicing using femtosecond-based laser and plasma etchLEI WEI-SHENG·Filed 2011·Granted Feb 4, 2014·23 cites·13 claims
- 0396US9029242B2Damage isolation by shaped beam delivery in laser scribing processHOLDEN JAMES M·Filed 2011·Granted May 12, 2015·25 cites·13 claims
- 0496US7904565B2System for providing security in a network comprising communications devicesROUND ROCK RES LLC·Filed 2007·Granted Mar 8, 2011·27 cites·74 claims
- 0596US7372565B1Spectrometer measurement of diffracting structuresNANOMETRICS INC·Filed 2006·Granted May 13, 2008·46 cites·24 claims
- 0696US6522406B1Correcting the system polarization sensitivity of a metrology tool having a rotatable polarizerNANOMETRICS INC·Filed 2001·Granted Feb 18, 2003·119 cites·16 claims
- 0796US5832228ASystem and method for providing multi-level security in computer devices utilized with non-secure networksITT·Filed 1996·Granted Nov 3, 1998·336 cites·20 claims
- 0895US6272538B1Method and system for establishing a security perimeter in computer networksMICRON TECHNOLOGY INC·Filed 1998·Granted Aug 7, 2001·152 cites·20 claims
- 0994US8883615B1Approaches for cleaning a wafer during hybrid laser scribing and plasma etching wafer dicing processesHOLDEN JAMES MATTHEW·Filed 2014·Granted Nov 11, 2014·33 cites·19 claims
- 1094US8874768B2Methods for providing security over untrusted networksHOLDEN JAMES M·Filed 2010·Granted Oct 28, 2014·14 cites·13 claims
- 1194US8853056B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2014·Granted Oct 7, 2014·9 cites·10 claims
- 1293US8557682B2Multi-layer mask for substrate dicing by laser and plasma etchHOLDEN JAMES M·Filed 2011·Granted Oct 15, 2013·13 cites·15 claims
- 1393US7475137B2Methods of operating portable computerized device with network securityMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 6, 2009·45 cites·95 claims
- 1493US6643698B2Mixed enclave operation in a computer networkMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 4, 2003·46 cites·25 claims
- 1593US5692124ASupport of limited write downs through trustworthy predictions in multilevel security of computer network communicationsITT·Filed 1996·Granted Nov 25, 1997·210 cites·23 claims
- 1692US7115858B1Apparatus and method for the measurement of diffracting structuresNANOMETRICS INC·Filed 2000·Granted Oct 3, 2006·55 cites·16 claims
- 1792US2025022755A1Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1891US8999816B1Pre-patterned dry laminate mask for wafer dicing processesHOLDEN JAMES M·Filed 2014·Granted Apr 7, 2015·12 cites·19 claims
- 1991US5872847AUsing trusted associations to establish trust in a computer networkITT·Filed 1996·Granted Feb 16, 1999·261 cites·9 claims
- 2091US5828832AMixed enclave operation in a computer network with multi-level network securityITT·Filed 1996·Granted Oct 27, 1998·255 cites·20 claims
- 2190US6212636B1Method for establishing trust in a computer network via associationITT MFG ENTPR·Filed 1997·Granted Apr 3, 2001·250 cites·20 claims
- 2289US11621194B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2020·Granted Apr 4, 2023·1 cites·12 claims
- 2389US10566238B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2018·Granted Feb 18, 2020·1 cites·10 claims
- 2488US8759197B2Multi-step and asymmetrically shaped laser beam scribingHOLDEN JAMES M·Filed 2011·Granted Jun 24, 2014·7 cites·14 claims
- 2587US9130056B1Bi-layer wafer-level underfill mask for wafer dicing and approaches for performing wafer dicingHOLDEN JAMES M·Filed 2014·Granted Sep 8, 2015·7 cites·30 claims
- 2687US6993582B2Mixed enclave operation in a computer networkMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 31, 2006·41 cites·44 claims
- 2786US12131952B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2023·Granted Oct 29, 2024·0 cites·9 claims
- 2886US8557683B2Multi-step and asymmetrically shaped laser beam scribingLEI WEI-SHENG·Filed 2011·Granted Oct 15, 2013·6 cites·13 claims
- 2986US6067620AStand alone security device for computer networksFiled 1998·Granted May 23, 2000·164 cites·23 claims
- 3085US7797423B2Computerized access device with network securityROUND ROCK RES LLC·Filed 2007·Granted Sep 14, 2010·6 cites·98 claims
- 3184US7917630B2Portable computerized device adapted for ad hoc security associationsROUND ROCK RES LLC·Filed 2007·Granted Mar 29, 2011·6 cites·60 claims
- 3282US9054176B2Multi-step and asymmetrically shaped laser beam scribingAPPLIED MATERIALS INC·Filed 2013·Granted Jun 9, 2015·4 cites·6 claims
- 3382US5802178AStand alone device for providing security within computer networksITT·Filed 1996·Granted Sep 1, 1998·133 cites·19 claims
- 3481US7970900B2Method and system for establishing a security perimeter in computer networksROUND ROCK RES LLC·Filed 2007·Granted Jun 28, 2011·4 cites·54 claims
- 3578US7831722B2Portable communications device with enhanced securityROUND ROCK RES LLC·Filed 2007·Granted Nov 9, 2010·3 cites·61 claims
- 3677US10163713B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2016·Granted Dec 25, 2018·1 cites·13 claims
- 3777US9245802B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2014·Granted Jan 26, 2016·1 cites·15 claims
- 3876US10910271B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2020·Granted Feb 2, 2021·0 cites·20 claims
- 3974US7827291B2System for providing security for ad hoc networked computerized devicesROUND ROCK RES LLC·Filed 2007·Granted Nov 2, 2010·2 cites·65 claims
- 4073US10714390B2Wafer dicing using femtosecond-based laser and plasma etchAPPLIED MATERIALS INC·Filed 2019·Granted Jul 14, 2020·0 cites·10 claims
- 4173US8346925B2Apparatus for providing security over untrusted networksROUND ROCK RES LLC·Filed 2010·Granted Jan 1, 2013·1 cites·22 claims
- 4273US7624180B2Mixed enclave operation in a computer networkMICRON TECHNOLOGY INC·Filed 2005·Granted Nov 24, 2009·4 cites·20 claims
- 4373US6272639B1Mixed enclave operation in a computer networkMICRON TECHNOLOGY INC·Filed 1998·Granted Aug 7, 2001·64 cites·20 claims
- 4472US6842251B1Configurable metrology device that operates in reflectance mode, transmittance mode, or mixed modeNANOMETRICS INC·Filed 2001·Granted Jan 11, 2005·9 cites·25 claims
- 4571US8912077B2Hybrid laser and plasma etch wafer dicing using substrate carrierSINGH SARAVJEET·Filed 2011·Granted Dec 16, 2014·2 cites·19 claims
- 4667US10692765B2Transfer arm for film frame substrate handling during plasma singulation of wafersAPPLIED MATERIALS INC·Filed 2014·Granted Jun 23, 2020·1 cites·5 claims
- 4767US9218992B2Hybrid laser and plasma etch wafer dicing using substrate carrierAPPLIED MATERIALS INC·Filed 2014·Granted Dec 22, 2015·1 cites·16 claims
- 4867US7917631B2System for providing security in a network comprising computerized devicesROUND ROCK RES LLC·Filed 2007·Granted Mar 29, 2011·1 cites·64 claims
- 4966US9299614B2Method and carrier for dicing a waferHOLDEN JAMES M·Filed 2014·Granted Mar 29, 2016·1 cites·9 claims
- 5064US8028067B2Methods of operating a portable communications device with enhanced securityROUND ROCK RES LLP·Filed 2007·Granted Sep 27, 2011·1 cites·64 claims
Showing the top 50 of 66 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →