Assignee
HOLDEN JAMES M
US·7 granted patents·2 pending applications·79 citations·filing 2010–2014
Top patents by PatentIndex Score
9 records- 0196US9029242B2Damage isolation by shaped beam delivery in laser scribing processHOLDEN JAMES M·Filed 2011·Granted May 12, 2015·25 cites·13 claims
- 0294US8874768B2Methods for providing security over untrusted networksHOLDEN JAMES M·Filed 2010·Granted Oct 28, 2014·14 cites·13 claims
- 0393US8557682B2Multi-layer mask for substrate dicing by laser and plasma etchHOLDEN JAMES M·Filed 2011·Granted Oct 15, 2013·13 cites·15 claims
- 0491US8999816B1Pre-patterned dry laminate mask for wafer dicing processesHOLDEN JAMES M·Filed 2014·Granted Apr 7, 2015·12 cites·19 claims
- 0588US8759197B2Multi-step and asymmetrically shaped laser beam scribingHOLDEN JAMES M·Filed 2011·Granted Jun 24, 2014·7 cites·14 claims
- 0687US9130056B1Bi-layer wafer-level underfill mask for wafer dicing and approaches for performing wafer dicingHOLDEN JAMES M·Filed 2014·Granted Sep 8, 2015·7 cites·30 claims
- 0766US9299614B2Method and carrier for dicing a waferHOLDEN JAMES M·Filed 2014·Granted Mar 29, 2016·1 cites·9 claims
- 0854US2014246153A1Multi-step and asymmetrically shaped laser beam scribingHOLDEN JAMES M·Filed 2014·Application pending·0 cites
- 0952US2014011337A1Multi-layer mask for substrate dicing by laser and plasma etchHOLDEN JAMES M·Filed 2013·Application pending·0 cites
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