Inventor · disambiguated record
Izumi Sato
Also filed as: SATO IZUMI
33 granted patents·6 pending applications·1,336 citations·filing 1988–2022
98Inventor score
Files withTOKYO ELECTRON LTD21ISHIKAWAJIMA HARIMA HEAVY IND3NIHON PLAST CO LTD3MOROZUMI YUICHIRO2PANASONIC I PRO SENSING SOLUTIONS CO LTD2
Top patents by PatentIndex Score
39 records- 0199USD616390SQuartz cover for manufacturing semiconductor wafersTOKYO ELECTRON LTD·Filed 2009·Granted May 25, 2010·419 cites·1 claims
- 0299USD616394SSupport of wafer boat for manufacturing semiconductor wafersTOKYO ELECTRON LTD·Filed 2009·Granted May 25, 2010·446 cites·1 claims
- 0385USD600222SWafer boatTOKYO ELECTRON LTD·Filed 2008·Granted Sep 15, 2009·31 cites·1 claims
- 0484USD570308SWafer boatTOKYO ELECTRON LTD·Filed 2006·Granted Jun 3, 2008·30 cites·1 claims
- 0583US10341563B2Camera device and shake correction methodPANASONIC IP MAN CO LTD·Filed 2018·Granted Jul 2, 2019·4 cites·8 claims
- 0683USD600221SWafer boatTOKYO ELECTRON LTD·Filed 2008·Granted Sep 15, 2009·28 cites·1 claims
- 0783USD580894SWafer boatTOKYO ELECTRON LTD·Filed 2006·Granted Nov 18, 2008·29 cites·1 claims
- 0882US10593489B2Pressing switch mechanism and wearable cameraPANASONIC I PRO SENSING SOLUTIONS CO LTD·Filed 2018·Granted Mar 17, 2020·3 cites·16 claims
- 0982USD616395SSupport of wafer boat for manufacturing semiconductor wafersTOKYO ELECTRON LTD·Filed 2009·Granted May 25, 2010·27 cites·1 claims
- 1082USD600660SHeat radiation fin of heat insulating cylinder for manufacturing semiconductor wafersTOKYO ELECTRON LTD·Filed 2008·Granted Sep 22, 2009·27 cites·1 claims
- 1181USD570309SWafer boatTOKYO ELECTRON LTD·Filed 2007·Granted Jun 3, 2008·27 cites·1 claims
- 1280US4995505ATransfer method and device and driving system therefor for transfer pressesISHIKAWAJIMA HARIMA HEAVY IND·Filed 1988·Granted Feb 26, 1991·20 cites·2 claims
- 1378USD616396SPedestal of heat insulating cylinder for manufacturing semiconductor wafersTOKYO ELECTRON LTD·Filed 2009·Granted May 25, 2010·22 cites·1 claims
- 1477US5072823ATransfer method and device and driving system therefor for transfer pressesISHIKAWAJIMA HARIMA HEAVY IND·Filed 1990·Granted Dec 17, 1991·19 cites·4 claims
- 1571US5103965ATransfer method and device and driving system therefor for transfer pressesISHIKAWAJIMA HARIMA HEAVY IND·Filed 1990·Granted Apr 14, 1992·16 cites·1 claims
- 1669US7762809B2Heat treatment apparatusTOKYO ELECTRON LTD·Filed 2007·Granted Jul 27, 2010·3 cites·8 claims
- 1768USD615937SHeat radiation fin of heat insulating cylinder for manufacturing semiconductor wafersTOKYO ELECTRON LTD·Filed 2009·Granted May 18, 2010·15 cites·1 claims
- 1867USD579885SUpper heat insulating cylinder for manufacturing semiconductor wafersTOKYO ELECTRON LTD·Filed 2007·Granted Nov 4, 2008·15 cites·1 claims
- 1966US5563608APosition measuring system and method thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Oct 8, 1996·40 cites·21 claims
- 2064US9103029B2Processing apparatus and film forming methodWAMURA YU·Filed 2011·Granted Aug 11, 2015·2 cites·10 claims
- 2163USD616392SHeat radiation fin of heat insulating cylinder for manufacturing semiconductor wafersTOKYO ELECTRON LTD·Filed 2009·Granted May 25, 2010·12 cites·1 claims
- 2263US5009103AUltrasonic thickness measuring method and apparatusTOKYO KEIKI KK·Filed 1989·Granted Apr 23, 1991·19 cites·8 claims
- 2362USD600220SHeat radiation fin of heat insulating cylinder for manufacturing semiconductor wafersTOKYO ELECTRON LTD·Filed 2008·Granted Sep 15, 2009·12 cites·1 claims
- 2459US8833298B2Film forming apparatusSATO IZUMI·Filed 2012·Granted Sep 16, 2014·2 cites·6 claims
- 2558USD616391SPedestal of heat insulating cylinder for manufacturing semiconductor wafersTOKYO ELECTRON LTD·Filed 2009·Granted May 25, 2010·10 cites·1 claims
- 2655USD601979SPedestal base of a heat insulating cylinder for manufacturing semiconductor wafersTOKYO ELECTRON LTD·Filed 2008·Granted Oct 13, 2009·9 cites·1 claims
- 2755USD574792SLower heat insulating cylinder for manufacturing semiconductor wafersTOKYO ELECTRON LTD·Filed 2007·Granted Aug 12, 2008·9 cites·1 claims
- 2850US10616485B2Camera device and gravity compensation methodPANASONIC I PRO SENSING SOLUTIONS CO LTD·Filed 2018·Granted Apr 7, 2020·0 cites·11 claims
- 2949US5383681AOccupant restraint systemNIHON PLAST CO LTD·Filed 1993·Granted Jan 24, 1995·14 cites·19 claims
- 3048USD616393SHeat radiation fin of heat insulating cylinder for manufacturing semiconductor wafersTOKYO ELECTRON LTD·Filed 2009·Granted May 25, 2010·6 cites·1 claims
- 3147US2013328306A1Joint member, joint, substrate processing apparatus and limit memberTOKYO ELECTRON LTD·Filed 2013·Application pending·0 cites
- 3245US6210797B1Airbag storing casingNIHON PLAST CO LTD·Filed 1999·Granted Apr 3, 2001·10 cites·18 claims
- 3339USD615936SPedestal of heat insulating cylinder for manufacturing semiconductor wafersTOKYO ELECTRON LTD·Filed 2009·Granted May 18, 2010·3 cites·1 claims
- 3438US2024273999A1Sensor device, system, and transmission methodSIGNTLE INC·Filed 2022·Application pending·0 cites
- 3537USRE36003EOccupant restraint systemNIHON PLAST CO LTD·Filed 1997·Granted Dec 22, 1998·7 cites·20 claims
- 3636US2011303152A1Support structure, processing container structure and processing apparatusASARI SHINJI·Filed 2011·Application pending·0 cites
- 3735US2012240857A1Vertical heat treatment apparatusMOROZUMI YUICHIRO·Filed 2011·Application pending·0 cites
- 3835US2002023517A1Steering wheelFiled 2001·Application pending·0 cites
- 3934US2012199067A1Film-forming apparatusMOROZUMI YUICHIRO·Filed 2012·Application pending·0 cites
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