USD600660SActiveUtility

Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers

82
Assignee: TOKYO ELECTRON LTDPriority: Mar 28, 2008Filed: Sep 26, 2008Granted: Sep 22, 2009
Est. expiryMar 28, 2028(~1.7 yrs left)· nominal 20-yr term from priority
Inventors:Izumi Sato
82
PatentIndex Score
27
Cited by
11
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.

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