USD616393SActiveUtility

Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers

48
Assignee: TOKYO ELECTRON LTDPriority: Mar 6, 2009Filed: Sep 2, 2009Granted: May 25, 2010
Est. expiryMar 6, 2029(~2.6 yrs left)· nominal 20-yr term from priority
Inventors:Izumi Sato
48
PatentIndex Score
6
Cited by
8
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.

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