Inventor · disambiguated record
Jun Heyoung Park
Also filed as: PARK JUN H · PARK JUN HEYOUNG
12 granted patents·9 pending applications·90 citations·filing 2004–2019
89Inventor score
Top patents by PatentIndex Score
21 records- 0193US8058558B2Printed circuit board and manufacturing method thereofMOK JEE-SOO·Filed 2007·Granted Nov 15, 2011·42 cites·5 claims
- 0291US7653991B2Method for manufacturing printed circuit board having embedded componentSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 2, 2010·22 cites·8 claims
- 0377US7794820B2Printed circuit board and fabricating method of the sameSAMSUNG ELECTRO MECH·Filed 2007·Granted Sep 14, 2010·8 cites·5 claims
- 0475US10790255B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 29, 2020·2 cites·17 claims
- 0573US7836590B2Manufacturing method for printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Nov 23, 2010·5 cites·11 claims
- 0670US8065798B2Method of manufacturing printed circuit boardKIM DONG SUN·Filed 2010·Granted Nov 29, 2011·2 cites·7 claims
- 0769US10847474B2Semiconductor package and electromagnetic interference shielding structure for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 24, 2020·1 cites·18 claims
- 0869US8377748B2Method of manufacturing cooling fin and package substrate with cooling finSAMSUNG ELECTRO MECH·Filed 2011·Granted Feb 19, 2013·2 cites·13 claims
- 0968US8161634B2Method of fabricating a printed circuit boardMOK JEE SOO·Filed 2008·Granted Apr 24, 2012·3 cites·7 claims
- 1062US8222534B2Printed circuit board and manufacturing method thereofPARK JUN-HEYOUNG·Filed 2008·Granted Jul 17, 2012·3 cites·3 claims
- 1153US2008308315A1Multilayer printed circuit board and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1252US2012080401A1Method of fabricating multilayer printed circuit boardMOK JEE SOO·Filed 2011·Application pending·0 cites
- 1350US2009294956A1Cooling fin and package substrate comprising the cooling fin and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1449US8166647B2Method of manufacturing a printed circuit boardHWANG JUN-OH·Filed 2009·Granted May 1, 2012·0 cites·6 claims
- 1549US7841074B2Method of fabricating paste bump for printed circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Granted Nov 30, 2010·0 cites·13 claims
- 1649US2009308650A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1747US2012175162A1Printed circuit boardMOK JEE SOO·Filed 2012·Application pending·0 cites
- 1846US2008053688A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1946US2012168205A1Method of manufacturing a printed circuit boardHWANG JUN-OH·Filed 2012·Application pending·0 cites
- 2040US2019371737A1Electromagnetic interference shielding structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 2137US2006029726A1Method of fabricating PCB in parallel mannerMOK JEE-SOO·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →