Inventor · disambiguated record
Koji Soejima
Also filed as: SOEJIMA KOJI
48 granted patents·10 pending applications·666 citations·filing 1997–2020
98Inventor score
Files withRENESAS ELECTRONICS CORP16NEC CORP15NEC ELECTRONICS CORP15KAWANO MASAYA4KOMATSU MFG CO LTD2
Top patents by PatentIndex Score
58 records- 0196US9406602B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Aug 2, 2016·9 cites·10 claims
- 0296US8354340B2Electronic device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2007·Granted Jan 15, 2013·23 cites·21 claims
- 0395US10224318B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Mar 5, 2019·6 cites·16 claims
- 0495US8633591B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2012·Granted Jan 21, 2014·10 cites·10 claims
- 0595US8058165B2Semiconductor device and method of manufacturing the sameKAWANO MASAYA·Filed 2010·Granted Nov 15, 2011·17 cites·8 claims
- 0695US7800233B2Semiconductor device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2006·Granted Sep 21, 2010·32 cites·17 claims
- 0794US7598117B2Method for manufacturing semiconductor module using interconnection structureNEC ELECTRONICS CORP·Filed 2006·Granted Oct 6, 2009·26 cites·19 claims
- 0894US6114864AProbe card with plural probe tips on a unitary flexible tongueNEC CORP·Filed 1997·Granted Sep 5, 2000·152 cites·29 claims
- 0993US8975750B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Mar 10, 2015·7 cites·18 claims
- 1093US8823174B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Sep 2, 2014·7 cites·5 claims
- 1193US7633167B2Semiconductor device and method for manufacturing sameNEC ELECTRONICS CORP·Filed 2006·Granted Dec 15, 2009·21 cites·18 claims
- 1292US8039756B2Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the sameNEC CORP·Filed 2006·Granted Oct 18, 2011·20 cites·15 claims
- 1392US7528068B2Method for manufacturing semiconductor deviceNEC ELECTRONICS CORP·Filed 2005·Granted May 5, 2009·26 cites·20 claims
- 1490US8395269B2Method of stacking semiconductor chips including forming an interconnect member and a through electrodeKAWANO MASAYA·Filed 2010·Granted Mar 12, 2013·10 cites·25 claims
- 1590US7791186B2Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the sameNEC CORP·Filed 2006·Granted Sep 7, 2010·17 cites·32 claims
- 1689US9847325B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Dec 19, 2017·3 cites·16 claims
- 1789US8035231B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2008·Granted Oct 11, 2011·17 cites·4 claims
- 1889US7928001B2Electronic device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2007·Granted Apr 19, 2011·14 cites·8 claims
- 1989US6307392B1Probe card and method of forming a probe cardNEC CORP·Filed 1998·Granted Oct 23, 2001·96 cites·32 claims
- 2086US7892973B2Method for manufacturing a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Feb 22, 2011·9 cites·12 claims
- 2185US12054910B2Work vehicleKOMATSU MFG CO LTD·Filed 2020·Granted Aug 6, 2024·2 cites·6 claims
- 2284US8304915B2Semiconductor device and method for manufacturing the sameMORI KENTARO·Filed 2009·Granted Nov 6, 2012·12 cites·23 claims
- 2384US7880295B2Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the sameNEC CORP·Filed 2009·Granted Feb 1, 2011·9 cites·6 claims
- 2484US7348673B2Semiconductor deviceNEC CORP·Filed 2005·Granted Mar 25, 2008·13 cites·34 claims
- 2579US7538022B2Method of manufacturing electronic circuit deviceNEC ELECTRONICS CORP·Filed 2006·Granted May 26, 2009·8 cites·20 claims
- 2677US8114766B1Method for manufacturing semiconductor deviceSOEJIMA KOJI·Filed 2009·Granted Feb 14, 2012·9 cites·17 claims
- 2776US8102049B2Semiconductor device including through electrode and method of manufacturing the sameTAKAHASHI NOBUAKI·Filed 2007·Granted Jan 24, 2012·6 cites·14 claims
- 2875US7656046B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Granted Feb 2, 2010·6 cites·20 claims
- 2971US9863122B2Cooling device and construction machineKOMATSU MFG CO LTD·Filed 2016·Granted Jan 9, 2018·2 cites·13 claims
- 3071US7759786B2Electronic circuit chip, and electronic circuit device and method for manufacturing the sameNEC ELECTRONICS CORP·Filed 2006·Granted Jul 20, 2010·5 cites·14 claims
- 3170US10879227B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted Dec 29, 2020·0 cites·18 claims
- 3270US6307159B1Bump structure and method for making the sameNEC CORP·Filed 1998·Granted Oct 23, 2001·32 cites·85 claims
- 3369US10580763B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted Mar 3, 2020·0 cites·8 claims
- 3469US8050050B2Wiring board, semiconductor device, and method of manufacturing the sameNEC CORP·Filed 2010·Granted Nov 1, 2011·2 cites·12 claims
- 3569US7242828B2Optical circuit in which fabrication is easyNEC CORP·Filed 2003·Granted Jul 10, 2007·9 cites·10 claims
- 3667US8456019B2Semiconductor deviceKAWANO MASAYA·Filed 2012·Granted Jun 4, 2013·1 cites·16 claims
- 3766US8183685B2Semiconductor deviceKAWANO MASAYA·Filed 2011·Granted May 22, 2012·1 cites·18 claims
- 3866US7927999B2Method of forming metal interconnect layers for flip chip deviceRENESAS ELECTRONICS CORP·Filed 2006·Granted Apr 19, 2011·2 cites·5 claims
- 3960US2016307875A1Electronic deviceRENESAS ELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 4059US7889514B2Wiring board, semiconductor device, and method of manufacturing the sameNEC CORP·Filed 2006·Granted Feb 15, 2011·1 cites·12 claims
- 4154US8030201B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2009·Granted Oct 4, 2011·0 cites·2 claims
- 4254US6670208B2Optical circuit in which fabrication is easyNEC CORP·Filed 2001·Granted Dec 30, 2003·3 cites·40 claims
- 4353US2009273092A1Semiconductor module having an interconnection structureNEC ELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 4451US7652375B2Semiconductor device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2007·Granted Jan 26, 2010·0 cites·9 claims
- 4551US2007126085A1Semiconductor device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 4647US8685796B2Electronic device and method of manufacturing the sameKURITA YOICHIRO·Filed 2007·Granted Apr 1, 2014·0 cites·12 claims
- 4747US6625883B2Method for making a bump structureNEC CORP·Filed 2001·Granted Sep 30, 2003·2 cites·12 claims
- 4847US2012100715A1Method of manufacturing a semiconductor device including through electrodeTAKAHASHI NOBUAKI·Filed 2011·Application pending·0 cites
- 4947US2007080449A1Interconnect substrate and electronic circuit deviceNEC ELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 5046US5936845AIC package and IC probe card with organic substrateNEC CORP·Filed 1997·Granted Aug 10, 1999·13 cites·16 claims
Showing the top 50 of 58 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →