Inventor · disambiguated record
Konosuke Hayashi
Also filed as: HAYASHI KONOSUKE
20 granted patents·9 pending applications·46 citations·filing 2009–2024
92Inventor score
Top patents by PatentIndex Score
29 records- 0190US9964358B2Substrate processing apparatus and substrate processing methodSHIBAURA MECHATRONICS CORP·Filed 2016·Granted May 8, 2018·7 cites·10 claims
- 0290US9811096B2Liquid feeding device and substrate treating deviceSHIBAURA MECHATRONICS CORP·Filed 2015·Granted Nov 7, 2017·9 cites·12 claims
- 0384US9553003B2Substrate processing device and substrate processing methodSHIBAURA MECHATRONICS CORP·Filed 2014·Granted Jan 24, 2017·6 cites·9 claims
- 0482US10460961B2Substrate processing apparatusSHIBAURA MECHATRONICS CORP·Filed 2017·Granted Oct 29, 2019·3 cites·13 claims
- 0579US10281210B2Substrate processing apparatus and substrate processing methodSHIBAURA MECHATRONICS CORP·Filed 2014·Granted May 7, 2019·4 cites·10 claims
- 0679US9586391B2Bonding apparatus and method for manufacturing bonded substrateSHIBAURA MECHATRONICS CORP·Filed 2015·Granted Mar 7, 2017·3 cites·16 claims
- 0772US9795999B2Substrate processing apparatus and substrate processing methodSHIBAURA MECHATRONICS CORP·Filed 2015·Granted Oct 24, 2017·2 cites·10 claims
- 0869US10586727B2Suction stage, lamination device, and method for manufacturing laminated substrateSHIBAURA MECHATRONICS CORP·Filed 2014·Granted Mar 10, 2020·3 cites·14 claims
- 0969US9972513B2Device and method for treating a substrate with hydrofluoric and nitric acidSHIBAURA MECHATRONICS CORP·Filed 2017·Granted May 15, 2018·1 cites·9 claims
- 1069US9607865B2Substrate processing device and substrate processing methodSHIBAURA MECHATRONICS CORP·Filed 2014·Granted Mar 28, 2017·2 cites·7 claims
- 1168US10607863B2Substrate processing apparatusSHIBAURA MECHATRONICS CORP·Filed 2015·Granted Mar 31, 2020·1 cites·11 claims
- 1265US2025091095A1Substrate cleaning apparatus and substrate cleaning methodSHIBAURA MECHATRONICS CORP·Filed 2024·Application pending·0 cites
- 1363US9694371B2Substrate treatment apparatus and substrate treatment methodSHIBAURA MECHATRONICS CORP·Filed 2015·Granted Jul 4, 2017·1 cites·9 claims
- 1462US10325787B2Substrate processing apparatus and substrate processing methodSHIBAURA MECHATRONICS CORP·Filed 2014·Granted Jun 18, 2019·1 cites·6 claims
- 1561US9741596B2Bonding apparatus and bonding process methodSHIBAURA MECHATRONICS CORP·Filed 2013·Granted Aug 22, 2017·1 cites·12 claims
- 1660US2020135504A1Substrate processing apparatusSHIBAURA MECHATRONICS CORP·Filed 2019·Application pending·0 cites
- 1760US2020135505A1Substrate processing apparatusSHIBAURA MECHATRONICS CORP·Filed 2019·Application pending·0 cites
- 1859US9202724B2Substrate treatment apparatus and substrate treatment methodHAYASHI KONOSUKE·Filed 2009·Granted Dec 1, 2015·2 cites·5 claims
- 1957US2023307262A1Substrate processing apparatus and substrate processing methodSHIBAURA MECHATRONICS CORP·Filed 2023·Application pending·0 cites
- 2054US10406566B2Substrate processing device and substrate processing methodSHIBAURA MECHATRONICS CORP·Filed 2017·Granted Sep 10, 2019·0 cites·4 claims
- 2152US2015090297A1Substrate processing device and substrate processing methodSHIBAURA MECHATRONICS CORP·Filed 2014·Application pending·0 cites
- 2244US10276406B2Substrate processing device and substrate processing methodSHIBAURA MECHATRONICS CORP·Filed 2014·Granted Apr 30, 2019·0 cites·12 claims
- 2343US2015090298A1Substrate processing device and substrate processing methodSHIBAURA MECHANTRONICS CORP·Filed 2014·Application pending·0 cites
- 2443US2014041694A1Cleaning solution producing apparatus, cleaning solution producing method, and substrate cleaning apparatusSHIBAURA MECHATRONICS CORP·Filed 2013·Application pending·0 cites
- 2540US2015090296A1Substrate processing device and substrate processing methodSHIBAURA MECHATRONICS CORP·Filed 2014·Application pending·0 cites
- 2639US11670522B2Processing liquid generator and substrate processing apparatus using the sameSHIBAURA MECHATRONICS CORP·Filed 2017·Granted Jun 6, 2023·0 cites·19 claims
- 2739US2016225613A1Substrate treatment device, peeling method for laminated substrate, and method for removing adhesiveSHIBAURA MECHATRONICS CORP·Filed 2014·Application pending·0 cites
- 2837US8377251B2Spin processing apparatus and spin processing methodSHIBAURA MECHATRONICS CORP·Filed 2010·Granted Feb 19, 2013·0 cites·2 claims
- 2935US9966282B2Substrate processing apparatus and substrate processing methodSHIBAURA MECHATRONICS CORP·Filed 2015·Granted May 8, 2018·0 cites·10 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →