Inventor · disambiguated record
Lars Heineck
Also filed as: HEINECK LARS · HEINECK LARS P · HEINECK LARS-PETER
41 granted patents·17 pending applications·270 citations·filing 1998–2025
97Inventor score
Files withMICRON TECHNOLOGY INC21INFINEON TECHNOLOGIES AG11NANYA TECHNOLOGY CORP5HEINECK LARS3HEINECK LARS P3
Top patents by PatentIndex Score
58 records- 0197US9881924B2Semiconductor memory device having coplanar digit line contacts and storage node contacts in memory array and method for fabricating the sameMICRON TECHNOLOGY INC·Filed 2016·Granted Jan 30, 2018·17 cites·41 claims
- 0296US11488981B2Array of vertical transistors and method used in forming an array of vertical transistorsMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 1, 2022·4 cites·22 claims
- 0396US10566332B2Semiconductor devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Feb 18, 2020·11 cites·20 claims
- 0493US8569831B2Integrated circuit arrays and semiconductor constructionsHEINECK LARS P·Filed 2011·Granted Oct 29, 2013·16 cites·10 claims
- 0592US10163909B2Methods for fabricating a semiconductor memory deviceMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 25, 2018·6 cites·22 claims
- 0691US7274060B2Memory cell array and method of forming the sameINFINEON TECHNOLOGIES AG·Filed 2005·Granted Sep 25, 2007·16 cites·19 claims
- 0790US8772848B2Circuit structures, memory circuitry, and methodsZAHURAK JOHN K·Filed 2011·Granted Jul 8, 2014·14 cites·14 claims
- 0889US6342452B1Method of fabricating a Si3N4/polycide structure using a dielectric sacrificial layer as a maskIBM·Filed 2000·Granted Jan 29, 2002·54 cites·10 claims
- 0986US9691773B2Silicon buried digit line access device and method of forming the sameNANYA TECHNOLOGY CORP·Filed 2013·Granted Jun 27, 2017·8 cites·7 claims
- 1082US8361856B2Memory cells, arrays of memory cells, and methods of forming memory cellsMICRON TECHNOLOGY INC·Filed 2010·Granted Jan 29, 2013·6 cites·19 claims
- 1181US2025275249A1Array Of Vertical Transistors And Method Used In Forming An Array Of Vertical TransistorsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1278US9337201B2Memory cells, arrays of memory cells, and methods of forming memory cellsHEINECK LARS·Filed 2012·Granted May 10, 2016·4 cites·38 claims
- 1377US9385132B2Arrays of recessed access devices, methods of forming recessed access gate constructions, and methods of forming isolation gate constructions in the fabrication of recessed access devicesHEINECK LARS P·Filed 2011·Granted Jul 5, 2016·4 cites·38 claims
- 1477US7838928B2Word line to bit line spacing method and apparatusQIMONDA AG·Filed 2008·Granted Nov 23, 2010·7 cites·13 claims
- 1576US2025107204A1Microelectronic devices with active source/drain contacts in trench in symmetrical dual-block structure, and related methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1674US12336288B2Array of vertical transistors and method used in forming an array of vertical transistorsMICRON TECHNOLOGY INC·Filed 2022·Granted Jun 17, 2025·0 cites·19 claims
- 1771US6919255B2Semiconductor trench structureINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jul 19, 2005·16 cites·18 claims
- 1870US9263317B2Method of forming buried word line structureNANYA TECHNOLOGY CORP·Filed 2014·Granted Feb 16, 2016·2 cites·15 claims
- 1969US12506096B2Microelectronic devices, and related memory devices and electronic systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 23, 2025·0 cites·25 claims
- 2069US9012330B2Method for semiconductor cross pitch doubled patterning processNANYA TECHNOLOGY CORP·Filed 2013·Granted Apr 21, 2015·2 cites·8 claims
- 2168US12237259B2Electronic devices comprising multilevel bitlines, and related methods and systemsMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 25, 2025·0 cites·28 claims
- 2267US11514953B2Integrated assemblies, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2021·Granted Nov 29, 2022·0 cites·24 claims
- 2367US9070584B2Buried digitline (BDL) access device and memory arrayNANYA TECHNOLOGY CORP·Filed 2013·Granted Jun 30, 2015·2 cites·11 claims
- 2467US7094674B2Method for production of contacts on a waferINFINEON TECHNOLOGIES AG·Filed 2003·Granted Aug 22, 2006·13 cites·12 claims
- 2567US2025210511A1Electronic devices comprising multilevel bitlines, and related methods and systemsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2667US2023065142A1Integrated Assemblies, and Methods of Forming Integrated AssembliesMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 2766US6916721B2Method for fabricating a trench capacitor with an insulation collarINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jul 12, 2005·11 cites·16 claims
- 2865US9318493B2Memory arrays, semiconductor constructions, and methods of forming semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2014·Granted Apr 19, 2016·1 cites·10 claims
- 2964US12166094B2Microelectronic devices with active source/drain contacts in trench in symmetrical dual-block structure, and related systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Dec 10, 2024·0 cites·29 claims
- 3064US8871589B2Methods of forming semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2013·Granted Oct 28, 2014·1 cites·14 claims
- 3164US8735267B1Buried word line structure and method of forming the samePARK INHO·Filed 2012·Granted May 27, 2014·2 cites·5 claims
- 3259US8450207B2Method of fabricating a cell contact and a digit line for a semiconductor deviceSURTHI SHYAM·Filed 2011·Granted May 28, 2013·1 cites·20 claims
- 3357US9269795B2Circuit structures, memory circuitry, and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Feb 23, 2016·0 cites·14 claims
- 3456US2025254862A1Contact formation via a selective etchMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3554US7018781B2Method for fabricating a contact hole plane in a memory moduleINFINEON TECHNOLOGIES AG·Filed 2004·Granted Mar 28, 2006·9 cites·29 claims
- 3653US8138538B2Interconnect structure for semiconductor devicesMOLL HANS-PETER·Filed 2008·Granted Mar 20, 2012·1 cites·25 claims
- 3753US6423607B1Trench capacitor with insulation collar and corresponding fabrication methodSIEMENS AG·Filed 1999·Granted Jul 23, 2002·13 cites·13 claims
- 3852US10937690B2Selective dielectric depositionMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 2, 2021·0 cites·18 claims
- 3952US9391092B2Circuit structures, memory circuitry, and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Jul 12, 2016·0 cites·18 claims
- 4052US2007290249A1Integrated Circuit Including a Memory Cell ArrayINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 4149US2023032177A1Electronic devices comprising multilevel bitlines, and related methods and systemsMICRON TECHNOLOGY INC·Filed 2021·Application pending·0 cites
- 4248US7087492B2Method for fabricating transistors of different conduction types and having different packing densities in a semiconductor substrateINFINEON TECHNOLOGIES AG·Filed 2004·Granted Aug 8, 2006·3 cites·13 claims
- 4347US7012313B2MOS transistor in a single-transistor memory cell having a locally thickened gate oxideINFINEON TECHNOLOGIES AG·Filed 2001·Granted Mar 14, 2006·4 cites·3 claims
- 4447US6281079B1MOS transistor in a single-transistor memory cell having a locally thickened gate oxide, and production processINFINEON TECHNOLOGIES AG·Filed 1999·Granted Aug 28, 2001·11 cites·8 claims
- 4545US8502294B1Semiconductor process and semiconductor structure for memory array with buried digit lines (BDL)SURTHI SHYAM·Filed 2012·Granted Aug 6, 2013·0 cites·20 claims
- 4644US5998254AMethod for creating a conductive connection between at least two zones of a first conductivity typeSIEMENS AG·Filed 1998·Granted Dec 7, 1999·11 cites·13 claims
- 4744US2006276019A1Method for production of contacts on a waferGRAF WERNER·Filed 2006·Application pending·0 cites
- 4843US2007032033A1Connecting structure and method for manufacturing the sameHEINECK LARS·Filed 2006·Application pending·0 cites
- 4943US2008315326A1Method for forming an integrated circuit having an active semiconductor device and integrated circuitGRAF WERNER·Filed 2007·Application pending·0 cites
- 5043US2014042548A1Dram structure with buried word lines and fabrication thereof, and ic structure and fabrication thereofNANYA TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
Showing the top 50 of 58 patent records by PatentIndex Score.
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