Inventor · disambiguated record
Jie Diao
Also filed as: DIAO JIE
11 granted patents·11 pending applications·54 citations·filing 2005–2019
88Inventor score
Top patents by PatentIndex Score
22 records- 0191US10350728B2System and process for in situ byproduct removal and platen cooling during CMPAPPLIED MATERIALS INC·Filed 2015·Granted Jul 16, 2019·9 cites·19 claims
- 0289US9800831B2Conveying attention information in virtual conferenceDIAO JIE·Filed 2016·Granted Oct 24, 2017·9 cites·12 claims
- 0386US8439723B2Chemical mechanical polisher with heater and methodMARKS ROBERT A·Filed 2008·Granted May 14, 2013·21 cites·18 claims
- 0484US10322492B2Retaining ring for CMPAPPLIED MATERIALS INC·Filed 2017·Granted Jun 18, 2019·3 cites·18 claims
- 0575US9369667B2Conveying gaze information in virtual conferenceDIAO JIE·Filed 2013·Granted Jun 14, 2016·3 cites·15 claims
- 0672US7422982B2Method and apparatus for electroprocessing a substrate with edge profile controlAPPLIED MATERIALS INC·Filed 2006·Granted Sep 9, 2008·2 cites·11 claims
- 0770US9538133B2Conveying gaze information in virtual conferenceDIAO JIE·Filed 2011·Granted Jan 3, 2017·2 cites·21 claims
- 0866US7344432B2Conductive pad with ion exchange membrane for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Mar 18, 2008·3 cites·30 claims
- 0962US7504018B2Electrochemical method for Ecmp polishing pad conditioningAPPLIED MATERIALS INC·Filed 2006·Granted Mar 17, 2009·1 cites·2 claims
- 1060US11673226B2Retaining ring for CMPAPPLIED MATERIALS INC·Filed 2019·Granted Jun 13, 2023·0 cites·20 claims
- 1159US8211325B2Process sequence to achieve global planarity using a combination of fixed abrasive and high selectivity slurry for pre-metal dielectric CMP applicationsDIAO JIE·Filed 2010·Granted Jul 3, 2012·1 cites·20 claims
- 1254US2008035474A1Apparatus for electroprocessing a substrate with edge profile controlWANG YOU·Filed 2007·Application pending·0 cites
- 1347US2007153453A1Fully conductive pad for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 1446US2006249394A1Process and composition for electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 1544US2007181442A1Method and apparatus for foam removal in an electrochemical mechanical substrate polishing processAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 1644US2006249395A1Process and composition for electrochemical mechanical polishingAPPLIED MATERIAL INC·Filed 2006·Application pending·0 cites
- 1744US2007158207A1Methods for electrochemical processing with pre-biased cellsAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 1843US2007254485A1Abrasive composition for electrochemical mechanical polishingMAO DAXIN·Filed 2007·Application pending·0 cites
- 1942US2007235344A1Process for high copper removal rate with good planarization and surface finishAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 2040US2008020682A1Method for conditioning a polishing padAPPLIED MATERILAS INC·Filed 2006·Application pending·0 cites
- 2140US2007062815A1Method for stabilized polishing processAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 2237US2018139413A1Method and system to accommodate concurrent private sessions in a virtual conferenceDIAO JIE·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →