Inventor · disambiguated record
Dan Okamoto
Also filed as: OKAMOTO DAN
6 granted patents·9 pending applications·10 citations·filing 2003–2020
75Inventor score
Top patents by PatentIndex Score
15 records- 0195US11735435B2Quad flat no lead package and method of makingTEXAS INSTRUMENTS INC·Filed 2020·Granted Aug 22, 2023·6 cites·20 claims
- 0264US10665475B2Quad flat no lead package and method of makingTEXAS INSTRUMENTS INC·Filed 2014·Granted May 26, 2020·1 cites·8 claims
- 0359US8465619B2Semiconductor die colletOKAMOTO DAN·Filed 2010·Granted Jun 18, 2013·2 cites·3 claims
- 0453US9536753B2Circuit substrate interconnectTEXAS INSTRUMENTS INC·Filed 2014·Granted Jan 3, 2017·1 cites·13 claims
- 0553US9379087B2Method of making a QFN packageTEXAS INSTRUMENTS INC·Filed 2014·Granted Jun 28, 2016·0 cites·3 claims
- 0646US2017352609A1Lead frame with solder sidewallsTEXAS INSTRUMENTS INC·Filed 2017·Application pending·0 cites
- 0745US7790507B2Semiconductor die collet and methodTEXAS INSTRUMENTS INC·Filed 2007·Granted Sep 7, 2010·0 cites·11 claims
- 0845US2013264836A1Semiconductor Die Collet and MethodTEXAS INSTRUMENTS INC·Filed 2013·Application pending·0 cites
- 0944US2016307831A1Method of making a qfn packageTEXAS INSTRUMENTS INC·Filed 2016·Application pending·0 cites
- 1043US2017271244A1Lead frame with solder sidewallsTEXAS INSTRUMENTS INC·Filed 2016·Application pending·0 cites
- 1140US2015348881A1Solder Coated Clip And Integrated Circuit Packaging MethodTEXAS INSTRUMENTS INC·Filed 2014·Application pending·0 cites
- 1236US2007037376A1Method and apparatus for fine pitch solder jointTEXAS INSTRUMENTS INC·Filed 2005·Application pending·0 cites
- 1336US2015340324A1Integrated Circuit Die And PackageTEXAS INSTRUMENTS INC·Filed 2014·Application pending·0 cites
- 1434US2005133913A1Stress distribution packageFiled 2003·Application pending·0 cites
- 1531US2016315036A1Dual transistors fabricated on lead frames and method of fabricationTEXAS INSTRUMENTS INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →