Method of making a qfn package

Abstract

A method of making a flat no lead package including attaching a first plurality of leads in spaced apart relationship in a predetermined pattern on a tape and attaching a first die to the tape at a predetermined position within the predetermined lead pattern.

1 . A method of making a plated leadframe comprising:
 providing a first film layer on a first side of a metal plate;   providing a second film layer on a second side of the metal plate opposite the first side; and   photo etching the first film layer in a predetermined pattern that exposes portions of the first side of the metal plate.   
     
     
         2 . The method of  claim 1  further comprising chemical etching the exposed portions of the first side of the metal plate to produce a plurality of leads. 
     
     
         3 . The method of  claim 2 , further comprising:
 removing the first film layer from the plurality of leads; and   plating first side surfaces of the plurality of leads.   
     
     
         4 . The method of  claim 3 , further comprising:
 applying an adhesive tape to the plated first side surfaces of the plurality of leads;   removing the second film layer from the second side surfaces of the plurality of leads; and   plating the second side surfaces of the plurality of leads.   
     
     
         5 - 17 . (canceled) 
     
     
         18 . A QFN comprising:
 an encapsulant block having opposite top and bottom surfaces and a plurality of side surfaces, wherein only said bottom surface comprises exposed metal surfaces.   
     
     
         19 . The QFN of  claim 18  wherein said exposed metal surfaces on said bottom surface of said encapsulant block comprise plated lead surfaces. 
     
     
         20 . The QFN of  claim 18  wherein said exposed metal surfaces on said bottom surface of said encapsulant block comprise a die backside surface. 
     
     
         21 . A QFN comprising:
 an encapsulant block having opposite top and bottom surfaces; and   a die having a backside surface exposed at said bottom surface of said encapsulation block.   
     
     
         22 . The QFN of  claim 21  wherein said encapsulant bottom surface and said die backside surface are coplanar.