Semiconductor Die Collet and Method

Abstract

A system comprises a collet is configured for holding a die surface against the bearing surface and for simultaneously pushing outward on the center region of the die so held.

We claim: 
     
         1 - 8 . (canceled) 
     
     
         9 . A system comprising:
 a collet configured for retaining a semiconductor die on a bearing surface using a vacuum force applied to a portion of a first surface of the die, the collet also configured for applying a pushing force in a direction opposite the vacuum force to a portion of the first surface of the retained die.   
     
     
         10 . A system according to  claim 9  whereby the pushing force causes outward flexion of the retained die held by the collet such that a handling tool may bring the outwardly flexed region of the second surface of the die into contact with the die pad before the periphery of the second surface of the die contacts the die pad. 
     
     
         11 . A system according to  claim 9  further comprising means for applying the pushing force using pressurized gas. 
     
     
         12 . A system according to  claim 9  further comprising a flexible skin attached to the bearing surface of the collet.