Inventor · disambiguated record
Mei Lan Guo
Also filed as: Guo mei lan
9 granted patents·4 pending applications·23 citations·filing 2018–2025
84Inventor score
Files withYANGTZE MEMORY TECH CO LTD13
Top patents by PatentIndex Score
13 records- 0196US10566336B1Three-dimensional memory devices having through array contacts and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Feb 18, 2020·11 cites·17 claims
- 0293US2025359048A1Three-dimensional memory devices having through array contacts and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 0392US10658378B2Through array contact (TAC) for three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted May 19, 2020·9 cites·20 claims
- 0487US10937806B2Through array contact (TAC) for three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Mar 2, 2021·2 cites·20 claims
- 0586US11532636B2Three-dimensional memory devices having through array contacts and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Dec 20, 2022·1 cites·20 claims
- 0685US2024032293A1Three-dimensional memory devices having through array contacts and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 0783US2023255025A1Three-dimensional memory devices having through array contacts and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 0876US11690219B2Three-dimensional memory devices having through array contacts and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·20 claims
- 0975US11581322B2Three-dimensional memory devices having through array contacts and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·20 claims
- 1073US11049866B2Three-dimensional memory devices having through array contacts and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jun 29, 2021·0 cites·20 claims
- 1173US10879254B2Three-dimensional memory devices having through array contacts and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Dec 29, 2020·0 cites·20 claims
- 1264US11889686B2Vertical memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jan 30, 2024·0 cites·16 claims
- 1352US2020119031A1Vertical memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →