Inventor · disambiguated record
Hidetami Yaegashi
Also filed as: YAEGASHI HIDETAMI
40 granted patents·14 pending applications·1,305 citations·filing 1994–2019
98Inventor score
Top patents by PatentIndex Score
54 records- 0196US5518542ADouble-sided substrate cleaning apparatusTOKYO ELECTRON LTD·Filed 1994·Granted May 21, 1996·265 cites·23 claims
- 0295US6565928B2Film forming method and film forming apparatusTOKYO ELECTRON LTD·Filed 2001·Granted May 20, 2003·91 cites·4 claims
- 0395US6287023B1Processing apparatus and methodTOKYO ELECTRON LTD·Filed 1998·Granted Sep 11, 2001·60 cites·41 claims
- 0495US5565034AApparatus for processing substrates having a film formed on a surface of the substrateTOKYO ELECTRON LTD·Filed 1994·Granted Oct 15, 1996·216 cites·38 claims
- 0593US9418860B2Use of topography to direct assembly of block copolymers in grapho-epitaxial applicationsTOKYO ELECTRON LTD·Filed 2014·Granted Aug 16, 2016·12 cites·20 claims
- 0693US5964954ADouble-sided substrate cleaning apparatus and cleaning method using the sameTOKYO ELECTRON LTD·Filed 1997·Granted Oct 12, 1999·119 cites·4 claims
- 0791US6518199B2Method and system for coating and developingTOKYO ELECTRON LTD·Filed 2001·Granted Feb 11, 2003·31 cites·8 claims
- 0891US6054181AMethod of substrate processing to form a film on multiple target objectsTOKYO ELECTRON LTD·Filed 1996·Granted Apr 25, 2000·106 cites·18 claims
- 0989US5725664ASemiconductor wafer processing apparatus including localized humidification between coating and heat treatment sectionsTOKYO ELECTRON LTD·Filed 1996·Granted Mar 10, 1998·87 cites·23 claims
- 1087US6284044B1Film forming method and film forming apparatusTOKYO ELECTRON LTD·Filed 2000·Granted Sep 4, 2001·38 cites·10 claims
- 1186US5876280ASubstrate treating system and substrate treating methodTOKYO ELECTRON LTD·Filed 1997·Granted Mar 2, 1999·91 cites·26 claims
- 1285US9690185B2Substrate processing method, program, computer-readable storage medium, and substrate processing systemTOKYO ELECTRON LTD·Filed 2015·Granted Jun 27, 2017·4 cites·20 claims
- 1383US10366888B2Pattern forming methodTOKYO ELECTRON LTD·Filed 2018·Granted Jul 30, 2019·3 cites·17 claims
- 1475US8283253B2Pattern forming method, semiconductor device manufacturing method and semiconductor device manufacturing apparatusYAEGASHI HIDETAMI·Filed 2009·Granted Oct 9, 2012·4 cites·12 claims
- 1574US8551691B2Method of forming mask patternYAEGASHI HIDETAMI·Filed 2012·Granted Oct 8, 2013·3 cites·10 claims
- 1674US5928390AVertical processing apparatusTOKYO ELECTRON LTD·Filed 1997·Granted Jul 27, 1999·45 cites·49 claims
- 1771US9023225B2Pattern forming methodTOKYO ELECTRON LTD·Filed 2013·Granted May 5, 2015·2 cites·11 claims
- 1871US8273661B2Pattern forming method, semiconductor device manufacturing method and semiconductor device manufacturing apparatusYAEGASHI HIDETAMI·Filed 2009·Granted Sep 25, 2012·3 cites·12 claims
- 1971US5686143AResist treating methodTOKYO ELECTRON LTD·Filed 1996·Granted Nov 11, 1997·31 cites·6 claims
- 2069US10211050B2Method for photo-lithographic processing in semiconductor device manufacturingTOKYO ELECTRON LTD·Filed 2016·Granted Feb 19, 2019·1 cites·4 claims
- 2168US7846648B2Substrate developing method, substrate processing method and developing solution supply nozzleTOKYO ELECTRON LTD·Filed 2008·Granted Dec 7, 2010·2 cites·1 claims
- 2268US5932380AMethod of processing resist utilizing alkaline component monitoringTOKYO ELECTRON LTD·Filed 1997·Granted Aug 3, 1999·29 cites·26 claims
- 2366US6884298B2Method and system for coating and developingTOKYO ELECTRON LTD·Filed 2002·Granted Apr 26, 2005·6 cites·5 claims
- 2465US6017663AMethod of processing resist utilizing alkaline component monitoringTOKYO ELECTRON LTD·Filed 1999·Granted Jan 25, 2000·25 cites·28 claims
- 2564US6097469AMethod of processing resist onto substrate and resist processing apparatusTOKYO ELECTRON LTD·Filed 1999·Granted Aug 1, 2000·24 cites·17 claims
- 2662US7367710B2Developing solution supply nozzle with stirrerTOKYO ELECTRON LTD·Filed 2004·Granted May 6, 2008·7 cites·8 claims
- 2751US11205571B2Mask forming methodTOKYO ELECTRON LTD·Filed 2019·Granted Dec 21, 2021·0 cites·7 claims
- 2849US2012305183A1Semiconductor device manufacturing apparatusYAEGASHI HIDETAMI·Filed 2012·Application pending·0 cites
- 2948US11467497B2Method of forming maskTOKYO ELECTRON LTD·Filed 2019·Granted Oct 11, 2022·0 cites·13 claims
- 3048US2011220609A1Plasma etching method and plasma etching apparatusTOKYO ELECTRON LTD·Filed 2011·Application pending·0 cites
- 3148US2012312472A1Semiconductor device manufacturing apparatusYAEGASHI HIDETAMI·Filed 2012·Application pending·0 cites
- 3246US10539876B2Pattern forming methodTOKYO ELECTRON LTD·Filed 2016·Granted Jan 21, 2020·0 cites·7 claims
- 3345US12197129B2Substrate treatment method and substrate treatment systemTOKYO ELECTRON LTD·Filed 2019·Granted Jan 14, 2025·0 cites·13 claims
- 3445US10741444B2Method of forming filmTOKYO ELECTRON LTD·Filed 2019·Granted Aug 11, 2020·0 cites·3 claims
- 3545US2016049292A1Semiconductor Device Manufacturing MethodTOKYO ELECTRON LTD·Filed 2015·Application pending·0 cites
- 3644US10573530B2Pattern forming methodTOKYO ELECTRON LTD·Filed 2017·Granted Feb 25, 2020·0 cites·8 claims
- 3744US2021325780A1Method for producing resist filmTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
- 3843US10317797B2Pattern forming method for forming a patternTOKYO ELECTRON LTD·Filed 2017·Granted Jun 11, 2019·0 cites·6 claims
- 3943US10074557B2Pattern forming methodTOKYO ELECTRON LTD·Filed 2017·Granted Sep 11, 2018·0 cites·5 claims
- 4043US8415092B2Substrate developing method, substrate processing method and developing solution supply nozzleSHIZUKUISHI MOMOKO·Filed 2010·Granted Apr 9, 2013·0 cites·13 claims
- 4143US2014083972A1Pattern forming methodTOKYO ELECTRON LTD·Filed 2013·Application pending·0 cites
- 4243US2014235065A1Method of manufacturing semiconductor device and semiconductor manufacturing apparatusTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 4342US2003119333A1Method and system for coating and developingTOKYO ELECTRON LTD·Filed 2003·Application pending·0 cites
- 4441US9818612B2Method for manufacturing semiconductor deviceTOKYO ELECTRON LTD·Filed 2016·Granted Nov 14, 2017·0 cites·6 claims
- 4541US9459535B2Method of forming patternTOKYO OHKA KOGYO CO LTD·Filed 2013·Granted Oct 4, 2016·0 cites·7 claims
- 4641US8263320B2Method, program and system for processing substrateYAEGASHI HIDETAMI·Filed 2010·Granted Sep 11, 2012·0 cites·15 claims
- 4739US2012211873A1Method for forming a pattern and semiconductor deviceOYAMA KENICHI·Filed 2012·Application pending·0 cites
- 4838US2011065280A1Mask pattern forming method and semiconductor device manufacturing methodTOKYO ELECTRON LTD·Filed 2010·Application pending·0 cites
- 4938US2007148972A1Method of repairing seed layer for damascene interconnectsHARA KENICHI·Filed 2006·Application pending·0 cites
- 5037US9653293B2Semiconductor device manufacturing method and semiconductor device manufacturing apparatusTOKYO ELECTRON LTD·Filed 2015·Granted May 16, 2017·0 cites·7 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
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