Semiconductor device manufacturing apparatus

Abstract

A semiconductor device manufacturing apparatus includes: a first pattern forming unit for forming a first pattern by patterning a first mask material layer; a trimming unit for reducing a width of the first pattern to a predetermined width; a boundary layer forming unit for forming a boundary layer, on a surface of the first pattern; a second mask material layer forming unit for forming a second mask material layer on a surface of the boundary layer; a second mask material removing unit for removing a part of the second mask material layer to expose top portions of the boundary layer; and a boundary layer etching unit for exposing the first pattern and forming a second pattern having the second mask material layer at a top portion thereof by etching the boundary layer.

1 . A semiconductor device manufacturing apparatus for forming a mask for etching an etching target layer on a substrate, the apparatus comprising:
 a first pattern forming unit for forming a first pattern by patterning a first mask material layer made of a photoresist;   a trimming unit for reducing a width of the first pattern to a predetermined width;   a boundary layer forming unit for forming a boundary layer, which is made of a material selectively removable with respect to the photoresist, on a surface of the first pattern;   a second mask material layer forming unit for forming a second mask material layer, which is made of a material that allows the boundary layer to be selectively removed, on a surface of the boundary layer;   a second mask material removing unit for removing a part of the second mask material layer to expose top portions of the boundary layer; and   a boundary layer etching unit for exposing the first pattern and forming a second pattern having the second mask material layer at a top portion thereof by etching the boundary layer.   
     
     
         2 . The semiconductor device manufacturing apparatus of  claim 1 , further comprising:
 a first pattern surface treating unit for modifying or hardening a surface of the first pattern; and   a second pattern trimming unit for reducing a width of the second pattern to a predetermined width.