Inventor · disambiguated record
Murali Abburi
Also filed as: ABBURI MURALI
8 granted patents·2 pending applications·233 citations·filing 1998–2002
89Inventor score
Top patents by PatentIndex Score
10 records- 0189US6139701ACopper target for sputter depositionAPPLIED MATERIALS INC·Filed 1999·Granted Oct 31, 2000·85 cites·40 claims
- 0288US6391163B1Method of enhancing hardness of sputter deposited copper filmsAPPLIED MATERIALS INC·Filed 2000·Granted May 21, 2002·37 cites·20 claims
- 0383US6086725ATarget for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through lifeAPPLIED MATERIALS INC·Filed 1998·Granted Jul 11, 2000·48 cites·31 claims
- 0476US6660135B2Staged aluminum deposition process for filling viasAPPLIED MATERIALS INC·Filed 2001·Granted Dec 9, 2003·21 cites·35 claims
- 0570US6521107B2Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through lifeAPPLIED MATERIALS INC·Filed 2001·Granted Feb 18, 2003·8 cites·12 claims
- 0665US6352620B2Staged aluminum deposition process for filling viasAPPLIED MATERIALS INC·Filed 1999·Granted Mar 5, 2002·27 cites·28 claims
- 0764US6436207B1Manufacture of target for use in magnetron sputtering of nickel and like magnetic metals for forming metallization films having consistent uniformity through lifeAPPLIED MATERIAL INC·Filed 2000·Granted Aug 20, 2002·4 cites·28 claims
- 0857US6472867B1Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through lifeAPPLIED MATERIALS INC·Filed 2001·Granted Oct 29, 2002·3 cites·19 claims
- 0940US2002088716A1Method of enhancing hardness of sputter deposited copper filmsFiled 2002·Application pending·0 cites
- 1035US2002093101A1Method of metallization using a nickel-vanadium layerFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →