Inventor · disambiguated record
Daniel G. Berger
Also filed as: BERGER DANIEL · BERGER DANIEL G · BERGER DANIEL GEORGE
23 granted patents·4 pending applications·1,138 citations·filing 1991–2019
97Inventor score
Top patents by PatentIndex Score
27 records- 0198US6528145B1Polymer and ceramic composite electronic substratesIBM·Filed 2000·Granted Mar 4, 2003·208 cites·30 claims
- 0296US5209817ASelective plating method for forming integral via and wiring layersIBM·Filed 1991·Granted May 11, 1993·297 cites·10 claims
- 0395US9859262B1Thermally enhanced package to reduce thermal interaction between diesGLOBALFOUNDRIES INC·Filed 2016·Granted Jan 2, 2018·11 cites·10 claims
- 0494US10818570B1Stacked semiconductor devices having dissimilar-sized diesGLOBALFOUNDRIES INC·Filed 2019·Granted Oct 27, 2020·11 cites·20 claims
- 0593US7405247B2Conductive adhesive compositionIBM·Filed 2007·Granted Jul 29, 2008·26 cites·1 claims
- 0693US7255153B2High performance integrated MLC cooling device for high power density ICS and method for manufacturingIBM·Filed 2005·Granted Aug 14, 2007·25 cites·17 claims
- 0792US5775569AMethod for building interconnect structures by injection molded solder and structures builtIBM·Filed 1996·Granted Jul 7, 1998·120 cites·16 claims
- 0890US6529021B1Self-scrub buckling beam probeIBM·Filed 2000·Granted Mar 4, 2003·54 cites·16 claims
- 0988US7393419B2Conductive adhesive rework methodIBM·Filed 2007·Granted Jul 1, 2008·14 cites·8 claims
- 1088US5300403ALine width control in a radiation sensitive polyimideIBM·Filed 1992·Granted Apr 5, 1994·85 cites·16 claims
- 1185US6149122AMethod for building interconnect structures by injection molded solder and structures builtIBM·Filed 1998·Granted Nov 21, 2000·61 cites·5 claims
- 1284US6340630B1Method for making interconnect for low temperature chip attachmentIBM·Filed 2000·Granted Jan 22, 2002·28 cites·18 claims
- 1381US7312261B2Thermal interface adhesive and reworkIBM·Filed 2004·Granted Dec 25, 2007·24 cites·1 claims
- 1480US6127735AInterconnect for low temperature chip attachmentIBM·Filed 1996·Granted Oct 3, 2000·41 cites·15 claims
- 1579US6020750AWafer test and burn-in platform using ceramic tile supportsIBM·Filed 1997·Granted Feb 1, 2000·45 cites·18 claims
- 1678US9886193B2Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integrationIBM·Filed 2015·Granted Feb 6, 2018·2 cites·25 claims
- 1778US6133633AMethod for building interconnect structures by injection molded solder and structures builtIBM·Filed 1998·Granted Oct 17, 2000·40 cites·4 claims
- 1872US5310625AProcess for forming negative tone images of polyimides using base treatment of crosslinked polyamic esterIBM·Filed 1993·Granted May 10, 1994·24 cites·4 claims
- 1971US10461067B2Thermally enhanced package to reduce thermal interaction between diesGLOBALFOUNDRIES INC·Filed 2017·Granted Oct 29, 2019·1 cites·7 claims
- 2067US7329439B2UV-curable solvent free compositions and use thereof in ceramic chip defect repairIBM·Filed 2004·Granted Feb 12, 2008·15 cites·17 claims
- 2165US10613754B2Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integrationIBM·Filed 2019·Granted Apr 7, 2020·0 cites·20 claims
- 2257US10503402B2Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integrationIBM·Filed 2017·Granted Dec 10, 2019·0 cites·20 claims
- 2357US2019378829A1Thermally enhanced package to reduce thermal interaction between diesGLOBALFOUNDRIES INC·Filed 2019·Application pending·0 cites
- 2455US6838009B2Rework method for finishing metallurgy on chip carriersIBM·Filed 2001·Granted Jan 4, 2005·6 cites·5 claims
- 2550US2008060792A1High performance integrated mlc cooling device for high power density ics and method for manufacturingIBM·Filed 2007·Application pending·0 cites
- 2638US2006014309A1Temporary chip attach method using reworkable conductive adhesive interconnectionsSACHDEV KRISHNA G·Filed 2004·Application pending·0 cites
- 2730US2002000239A1Removal of cured silicone adhesive for reworking electronic componentsFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →