High performance integrated mlc cooling device for high power density ics and method for manufacturing

Abstract

A manifold apparatus, system and method for thermally controlling a substrate whereby a manifold body having a microjet array and a drain array traversing there-through in a direction orthogonal to a substrate surface and parallel to each other is attached to the substrate surface for heating or cooling thereof. A cavity of the manifold body resides over the substrate surface such that liquid is emitted from the liquid microjets into the cavity for contact with the substrate surface, while the drains orthogonally remove spent liquid from the cavity. The manifold body is designed and configured into a plurality of cooling cells, whereby each cooling cell has a liquid microjet surrounded by at least three drains for preventing interactions between adjacent liquid microjets within adjacent cooling cells. Gas microjets may also traverse through the manifold body to form an atomized liquid spray for contact with the substrate surface.

1 . A liquid impingement manifold apparatus for thermal control of a substrate comprising: 
 a manifold body comprising an inlet manifold and a drain manifold intertwined with each other for attachment to a substrate surface;    a microjet array residing within said inlet manifold, said microjet array traversing through said inlet manifold in a direction orthogonal to said substrate surface;    a drain array residing within said drain manifold, said drain array traversing through said drain manifold adjacent to and parallel to said microjet array; and    a cavity of said manifold body over said substrate surface,    whereby said microjet array emits a liquid into said cavity for contact with said substrate surface for thermal control thereof while said drain array removes spent liquid from said cavity in said direction orthogonal to said substrate surface.    
   
   
       2 . The apparatus of  claim 1  wherein said manifold body comprises a material selected from the group consisting of glass-ceramic material, silicon, AlN, SiC, Cu, Ni, alloys thereof, and combinations thereof.  
   
   
       3 . The apparatus of  claim 1  wherein said manifold body and said substrate comprise materials having compatible thermal coefficients of expansion.  
   
   
       4 . (canceled)  
   
   
       5 . The apparatus of  claim 1  further including a plurality of cooling cells within said manifold body, each cooling cell having a microjet of said microjet array substantially at a center thereof surrounded by at least three drains of said drain array.  
   
   
       6 . The apparatus of  claim 5  wherein said plurality of cooling cells are uniformly shaped within said manifold body.  
   
   
       7 . The apparatus of  claim 5  wherein said plurality of cooling cells are non-uniformly shaped within said manifold body.  
   
   
       8 . The apparatus of  claim 5  wherein said plurality of cooling cells comprise an array of triangular cooling cells, each said triangular cooling cell having said microjet substantially at said center thereof and a drain centered at each of said three vertices such that said microjet is surrounded by at least one half an uptake power of a single drain.  
   
   
       9 . The apparatus of  claim 5  wherein said plurality of cooling cells comprise an array of square cooling cells, each said square cooling cell having said microjet substantially at said center thereof and a drain centered at each of said four vertices such that said microjet is surrounded by an uptake power of an entire drain.  
   
   
       10 . The apparatus of  claim 1  further including at least one lateral drain within said manifold body.  
   
   
       11 .- 12 . (canceled)  
   
   
       13 . The apparatus of  claim 1  further including a first predetermined dimensionless geometric parameter comprising a dimensionless minimum microjet pitch ranging from about 3 to about 4 dimensionless units, and a second predetermined dimensionless geometric parameter comprising a dimensionless gap height ranging from about 2 to about 3 dimensionless units.  
   
   
       14 - 17 . (canceled)  
   
   
       18 . The apparatus of  claim 1  wherein said cavity comprises a first cavity in communication with a second cavity.  
   
   
       19 . A system for thermal transfer comprising: 
 a substrate having a temperature in need of modulating;    a manifold body comprising an inlet manifold and a drain manifold intertwined with each other attached to a surface of said substrate, said manifold at least comprising, 
 a microjet array residing within said inlet manifold, said microjet array traversing through said inlet manifold in a direction orthogonal to said substrate surface;  
 a drain array residing within said drain manifold, said drain array traversing through said drain manifold adjacent to and parallel to said microjet array; and  
 a cavity of said manifold body over said substrate surface,  
   whereby said microjet array emits a liquid into said cavity for contact with said substrate surface for thermal control thereof while said drain array removes spent thermal liquid from said cavity in said direction orthoganl to said substrate surface.    
   
   
       20 . A method for thermally controlling a substrate temperature comprising: 
 providing a manifold body comprising an inlet manifold and a drain manifold intertwined with each other, said inlet manifold having a microjet array and said drain manifold having a drain array both traversing through said manifold body in a direction parallel to each other and orthogonal to a surface of a substrate;    attaching said manifold body to said substrate surface whereupon a cavity is formed between said manifold body and said substrate surface;    emitting a liquid from said microjet array into said cavity;    contacting said liquid to said substrate surface for controlling a temperature thereof; and    removing spent said liquid from said cavity in a direction orthogonal to said substrate surface via said drain array,    whereby each said microjet is surrounded by at least three drains to prevent interaction between adjacent microjets.    
   
   
       21 . The method of  claim 20  wherein said manifold body further includes a plurality of cooling cells, each cooling cell having at least three vertices and a microjet of said microjet array that is surrounded by said at least three drains which are centered on said vertices for substantially eliminating lateral drain flows between adjacent cooling cells.  
   
   
       22 . The method of  claim 20  wherein said plurality of cooling cells comprise a plurality of varying cooling cells residing throughout said manifold for controlling a variety of different temperatures across said substrate surface.  
   
   
       23 . The method of  claim 21  wherein said plurality of cooling cells have geometrical shapes selected from the group consisting of triangular cooling cells, square cooling cells, uniformly shaped cooling cells, non-uniformly shaped cooling cells and combinations thereof.  
   
   
       24 . The method of  claim 20  wherein said liquid comprises a cooling liquid for controlling said temperature by cooling said substrate.  
   
   
       25 . The method of  claim 20  wherein said liquid comprises a heating liquid for controlling said temperature by heating said substrate.  
   
   
       26 . The method of  claim 20  wherein said manifold body is capable of controlling said temperature at a rate above about 100 W/cm 2  while maintaining a total internal liquid pressure drop below about 10 psig.  
   
   
       27 . The method of  claim 20  further including at least one lateral drain within said manifold body for removing undesirable matter from said cavity.  
   
   
       28 .- 30 . (canceled)