Inventor · disambiguated record
Min-Chih Hsuan
Also filed as: HSUAN MIN-CHIH · HSUAN MIN-CHIH JOHN
30 granted patents·15 pending applications·1,447 citations·filing 1991–2021
97Inventor score
Files withUNITED MICROELECTRONICS CORP26HSUAN MIN-CHIH9APTOS CORP1INT COMMUNICATION SYSTEMS CORP1LAI KELVIN YI TSE1
Top patents by PatentIndex Score
45 records- 0196US6461956B1Method of forming packageUNITED MICROELECTRONICS CORP·Filed 2000·Granted Oct 8, 2002·107 cites·12 claims
- 0296US6239367B1Multi-chip chip scale packageUNITED MICROELECTRONICS CORP·Filed 1999·Granted May 29, 2001·243 cites·23 claims
- 0394US6323546B2Direct contact through hole type wafer structureUNITED MICROELECTRONICS CORP·Filed 2001·Granted Nov 27, 2001·83 cites·7 claims
- 0493US6429509B1Integrated circuit with improved interconnect structure and process for making sameUNITED MICROELECTRONICS CORP·Filed 1999·Granted Aug 6, 2002·117 cites·45 claims
- 0593US6252300B1Direct contact through hole type wafer structureUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jun 26, 2001·128 cites·12 claims
- 0692US7179740B1Integrated circuit with improved interconnect structure and process for making sameUNITED MICROELECTRONICS CORP·Filed 2005·Granted Feb 20, 2007·27 cites·10 claims
- 0791US6239366B1Face-to-face multi-chip packageUNITED MICROELECTRONICS CORP·Filed 1999·Granted May 29, 2001·124 cites·11 claims
- 0891US6236109B1Multi-chip chip scale packageUNITED MICROELECTRONICS CORP·Filed 1999·Granted May 22, 2001·127 cites·19 claims
- 0987US6031293APackage-free bonding pad structureUNITED MICROELECTRONICS CORP·Filed 1999·Granted Feb 29, 2000·88 cites·19 claims
- 1085US6352923B1Method of fabricating direct contact through hole typeUNITED MICROELECTRONICS CORP·Filed 1999·Granted Mar 5, 2002·69 cites·14 claims
- 1184US6214630B1Wafer level integrated circuit structure and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 1999·Granted Apr 10, 2001·79 cites·22 claims
- 1280US6268642B1Wafer level packageUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jul 31, 2001·60 cites·21 claims
- 1378US7030466B1Intermediate structure for making integrated circuit device and waferUNITED MICROELECTRONICS CORP·Filed 2003·Granted Apr 18, 2006·25 cites·12 claims
- 1477US6838310B1Integrated circuit with improved interconnect structure and process for making sameUNITED MICROELECTRONICS CORP·Filed 2002·Granted Jan 4, 2005·19 cites·3 claims
- 1577US5159630AFacsimile message encryption systemINT COMMUNICATION SYSTEMS CORP·Filed 1991·Granted Oct 27, 1992·57 cites·13 claims
- 1673US8546739B2Manufacturing method of wafer level chip scale package of image-sensing moduleHSUAN MIN-CHIH·Filed 2009·Granted Oct 1, 2013·8 cites·15 claims
- 1773US6166444ACascade-type chip moduleUNITED MICROELECTRONICS CORP·Filed 1999·Granted Dec 26, 2000·43 cites·17 claims
- 1872US7534653B2Chip packaging processUNITED MICROELECTRONICS CORP·Filed 2006·Granted May 19, 2009·4 cites·10 claims
- 1970US7192847B2Ultra-thin wafer level stack packaging methodUNITED MICROELECTRONICS CORP·Filed 2005·Granted Mar 20, 2007·4 cites·22 claims
- 2058US7170167B2Method for manufacturing wafer level chip scale package structureUNITED MICROELECTRONICS CORP·Filed 2004·Granted Jan 30, 2007·8 cites·9 claims
- 2157US6512708B1Placement and routing for wafer scale memoryUNITED MICROELECTRONIC CORP·Filed 2001·Granted Jan 28, 2003·8 cites·12 claims
- 2254US2009218679A1Chip package and process thereofUNITED MICROELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 2352US2008185710A1Chip package and process thereofUNITED MICROELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 2449US7659501B2Image-sensing module of image capture apparatus and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2007·Granted Feb 9, 2010·0 cites·35 claims
- 2549US2012242567A1Hand-held displaying deviceHSUAN MIN-CHIH·Filed 2011·Application pending·0 cites
- 2649US2009206759A1Controlling system for illumination of a golf course and controlling method thereofWANG BILY·Filed 2008·Application pending·0 cites
- 2749US2022067341A1Writing pen, signature recognition method and signature recognition systemWALTOP INT CORP·Filed 2021·Application pending·0 cites
- 2848US2007045806A1Structure of an ultra-thin wafer level stack packageUNITED MICROELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 2947US7450150B2Integrated audio/video sensorUNITED MICROELECTRONICS CORP·Filed 2003·Granted Nov 11, 2008·0 cites·17 claims
- 3047US7141875B2Flexible multi-chip module and method of making the sameAPTOS CORP·Filed 2004·Granted Nov 28, 2006·3 cites·59 claims
- 3146US8976018B2Local detection processing device and systemHSUAN MIN-CHIH·Filed 2012·Granted Mar 10, 2015·0 cites·33 claims
- 3246US2006017878A1Method for repairing white spots in liquid crystal display panelHSUAN MIN-CHIH·Filed 2005·Application pending·0 cites
- 3345US8786427B2Portable information detection and processing device and systemHSUAN MIN-CHIH·Filed 2012·Granted Jul 22, 2014·0 cites·28 claims
- 3445US2005101322A1Digital cellular phone system and cellular phone applied theretoFiled 2003·Application pending·0 cites
- 3544US10292546B2Urinal cartridge and urinal having the sameLAI KELVIN YI TSE·Filed 2017·Granted May 21, 2019·0 cites·10 claims
- 3644US2005050347A1System, method and chip for hardware detection of illegal software user, computer system having hardware detection chip thereof and a software registration centerFiled 2003·Application pending·0 cites
- 3743US10165693B2Attachment device for micro devices and wearable micro devices having the attachment deviceHSUAN MIN CHIH·Filed 2016·Granted Dec 25, 2018·0 cites·13 claims
- 3841US2009113211A1Processing unit including a wireless module and method thereofLIU CHUN-HUNG·Filed 2007·Application pending·0 cites
- 3941US2005099587A1Method for repairing white spots in liquid crystal display panelFiled 2003·Application pending·0 cites
- 4040US2002166890A1Universal power supply systemUNITED MICROELECTRONICS CORP·Filed 2001·Application pending·0 cites
- 4140US2012242514A1Hybrid keyboardHSUAN MIN-CHIH·Filed 2011·Application pending·0 cites
- 4239US6279141B1Preburn-in dynamic random access memory module and preburn-in circuit board thereofUNITED MICROELECTRONICS CORP·Filed 1997·Granted Aug 21, 2001·9 cites·14 claims
- 4339US2005212132A1Chip package and process thereofHSUAN MIN-CHIH·Filed 2004·Application pending·0 cites
- 4437US5875136ARepairable memory module and method of repairing memory modulesUNITED MICROELECTRONICS CORP·Filed 1997·Granted Feb 23, 1999·7 cites·10 claims
- 4537US2005269680A1System-in-package (SIP) structure and fabrication thereofHSUAN MIN-CHIH·Filed 2004·Application pending·0 cites
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