Inventor · disambiguated record
Hougong Wang
Also filed as: WANG HOUGONG
22 granted patents·8 pending applications·457 citations·filing 1996–2023
95Inventor score
Files withAPPLIED MATERIALS INC11BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD8LAVITSKY ILYA3LAM HYMAN W H2APPLIED MATERIAL INC1
Top patents by PatentIndex Score
30 records- 0197US5879523ACeramic coated metallic insulator particularly useful in a plasma sputter reactorAPPLIED MATERIALS INC·Filed 1997·Granted Mar 9, 1999·160 cites·18 claims
- 0295US8293015B2Apparatuses and methods for atomic layer depositionLAM HYMAN W H·Filed 2011·Granted Oct 23, 2012·21 cites·4 claims
- 0395US5976695AThermally sprayable powder materials having an alloyed metal phase and a solid lubricant ceramic phase and abradable seal assemblies manufactured therefromWESTAIM TECHNOLOGIES INC·Filed 1996·Granted Nov 2, 1999·77 cites·63 claims
- 0493US6610189B2Method and associated apparatus to mechanically enhance the deposition of a metal film within a featureAPPLIED MATERIALS INC·Filed 2001·Granted Aug 26, 2003·35 cites·22 claims
- 0588US6672864B2Method and apparatus for processing substrates in a system having high and low pressure areasAPPLIED MATERIALS INC·Filed 2002·Granted Jan 6, 2004·36 cites·20 claims
- 0687US8747556B2Apparatuses and methods for atomic layer depositionLAM HYMAN W H·Filed 2012·Granted Jun 10, 2014·3 cites·15 claims
- 0786US11699541B2Magnetic thin film laminated structure deposition methodBEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD·Filed 2019·Granted Jul 11, 2023·2 cites·15 claims
- 0884US6913680B1Method of application of electrical biasing to enhance metal depositionAPPLIED MATERIALS INC·Filed 2000·Granted Jul 5, 2005·30 cites·17 claims
- 0983US7884032B2Thin film depositionAPPLIED MATERIALS INC·Filed 2005·Granted Feb 8, 2011·10 cites·27 claims
- 1081US12424363B2Magnetic thin film laminated structure and micro-inductive device thereofBEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 1177US6299689B1Reflow chamber and processAPPLIED MATERIALS INC·Filed 2000·Granted Oct 9, 2001·23 cites·3 claims
- 1272US6077402ACentral coil design for ionized metal plasma depositionAPPLIED MATERIALS INC·Filed 1997·Granted Jun 20, 2000·24 cites·52 claims
- 1369US11328940B2Degassing chamber and semiconductor processing apparatusBEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD·Filed 2019·Granted May 10, 2022·1 cites·16 claims
- 1462US7006888B2Semiconductor wafer preheatingAPPLIED MATERIALS INC·Filed 2002·Granted Feb 28, 2006·8 cites·4 claims
- 1561US2008116067A1Physical vapor deposition chamber having an adjustable targetLAVITSKY ILYA·Filed 2007·Application pending·0 cites
- 1660US10287686B2Hot plate and substrate processing equipment using the sameZHAO MENGXIN·Filed 2011·Granted May 14, 2019·2 cites·15 claims
- 1755US10622145B2Magnetic thin film deposition chamber and thin film deposition apparatusBEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD·Filed 2019·Granted Apr 14, 2020·0 cites·17 claims
- 1854US6077404AReflow chamber and processAPPLIED MATERIAL INC·Filed 1998·Granted Jun 20, 2000·17 cites·14 claims
- 1949US2006096851A1Physical vapor deposition chamber having an adjustable targetLAVITSKY ILYA·Filed 2004·Application pending·0 cites
- 2047US6303994B1Method and apparatus for reducing the first wafer effectAPPLIED MATERIALS INC·Filed 2000·Granted Oct 16, 2001·2 cites·19 claims
- 2143US10381202B2Magnetron and magnetron sputtering deviceBEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD·Filed 2014·Granted Aug 13, 2019·0 cites·14 claims
- 2243US2004166697A1Method and apparatus for processing substrates in a system having high and low pressure areasFiled 2003·Application pending·0 cites
- 2342US11309208B2Electrostatic chuck and method for manufacturing protrusions thereofBEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD·Filed 2019·Granted Apr 19, 2022·0 cites·6 claims
- 2440US2012036637A1Rotating Bed to Reduce the Risk of Developing Pressure UlcersWANG HOUGONG·Filed 2010·Application pending·0 cites
- 2540US2006096857A1Physical vapor deposition chamber having a rotatable substrate pedestalLAVITSKY ILYA·Filed 2004·Application pending·0 cites
- 2639US2019218660A1Degassing method, degassing chamber, and semiconductor processing apparatusBEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD·Filed 2019·Application pending·0 cites
- 2738US10886142B2Annealing method, process chamber and annealing apparatusBEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD·Filed 2019·Granted Jan 5, 2021·0 cites·19 claims
- 2838US6139698AMethod and apparatus for reducing the first wafer effectAPPLIED MATERIALS INC·Filed 1997·Granted Oct 31, 2000·6 cites·11 claims
- 2937US2003131458A1Apparatus and method for improving throughput in a cluster tool for semiconductor wafer processingAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 3031US2003013312A1Method of reducing particle density in a cool down chamberFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →