Inventor · disambiguated record
Junya Sagara
Also filed as: SAGARA JUNYA
7 granted patents·5 pending applications·51 citations·filing 2006–2011
82Inventor score
Top patents by PatentIndex Score
12 records- 0192US7675153B2Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereofTOSHIBA KK·Filed 2006·Granted Mar 9, 2010·30 cites·13 claims
- 0281US7892890B2Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereofTOSHIBA KK·Filed 2010·Granted Feb 22, 2011·6 cites·8 claims
- 0380US7932162B2Method for manufacturing a stacked semiconductor package, and stacked semiconductor packageTOSHIBA KK·Filed 2008·Granted Apr 26, 2011·7 cites·15 claims
- 0468US8294282B2Semiconductor device and adhesive sheetHAYASHI HIDEKAZU·Filed 2010·Granted Oct 23, 2012·3 cites·8 claims
- 0566US7569921B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2006·Granted Aug 4, 2009·5 cites·19 claims
- 0647US8231046B2Wire bonding apparatus and wire bonding methodNAKAO MITSUHIRO·Filed 2009·Granted Jul 31, 2012·0 cites·4 claims
- 0746US2008099532A1Wire bonding apparatus and wire bonding methodTOSHIBA KK·Filed 2007·Application pending·0 cites
- 0845US7849897B2Apparatus and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2007·Granted Dec 14, 2010·0 cites·10 claims
- 0944US2011163459A1Method for manufacturing a stacked semiconductor package, and stacked semiconductor packageTOSHIBA KK·Filed 2011·Application pending·0 cites
- 1039US2007023875A1Semiconductor package and manufacturing method thereofTOSHIBA KK·Filed 2006·Application pending·0 cites
- 1138US2007023922A1Semiconductor packageTOSHIBA KK·Filed 2006·Application pending·0 cites
- 1233US2010311224A1Manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →