Wire bonding apparatus and wire bonding method

Abstract

A wire bonding apparatus comprising: a capillary configured to have inserted therethrough a wire; a damper provided above the capillary and able to clamp hold the wire; and a load sensor configured to measure load incurred on the wire.

1 . A wire bonding apparatus comprising:
 a capillary configured to have inserted therethrough a wire;   a damper provided above the capillary and able to clamp hold the wire; and   a load sensor configured to measure load incurred on the wire.   
     
     
         2 . The wire bonding apparatus of  claim 1  further comprising:
 a transducer horn configured at one end to hold in place the capillary;   a damper supporting portion onto which the load sensor is mounted and which supports the damper at one end; and   a capillary moving portion to which other ends of the transducer horn and the damper supporting portion are fixed and which is configured to move the transducer horn and the damper supporting portion as one.   
     
     
         3 . The wire bonding apparatus of  claim 2  further comprising:
 a memory portion that stores control parameters;   a control portion that performs drive control of the capillary moving portion and the damper based on the control parameters; and   an arithmetic processing portion configured to perform detection of whether or not a load at a time of cutting of the wire measured by the load sensor is within an optimum breaking load range, and send an apparatus stop signal to the control portion based on a result of the detection.   
     
     
         4 . The wire bonding apparatus according to  claim 3  wherein the memory portion stores wire diameter information of the wire, and the arithmetic processing portion calculates the optimum breaking load range based on the wire diameter information of the wire. 
     
     
         5 . A wire bonding apparatus comprising:
 a capillary configured to have inserted therethrough a wire;   a transducer horn configured at one end to hold in place the capillary;   a damper provided above the capillary and able to clamp hold the wire;   a damper supporting portion that supports the damper at one end;   a capillary moving portion to which the other ends of the transducer horn and the damper supporting portion are fixed and which is configured to move the transducer horn and the damper supporting portion as one; and   a control apparatus that performs drive control of the capillary moving portion and the clamper, monitors an electric current value on the capillary moving portion at a time of cutting of the wire, and calculates load at a time of cutting of the wire based on the electric current value.   
     
     
         6 . The wire bonding apparatus of  claim 5  wherein the capillary moving portion comprises a horizontal direction drive portion configured to move the transducer horn and the damper supporting portion in a horizontal direction, and a vertical direction drive portion configured to move the transducer horn and the damper supporting portion in a vertical direction, and the transducer horn is connected to the vertical direction drive portion, and the control apparatus monitors an electric current value of the vertical direction drive portion at a time of cutting of the wire. 
     
     
         7 . The wire bonding apparatus of  claim 5  wherein the control apparatus comprises:
 a memory portion that stores control parameters;   a control portion that performs drive control of the capillary moving portion and the damper based on the control parameters, and monitors an electric current value on the capillary moving portion at a time of cutting of the wire; and   an arithmetic processing portion configured to perform calculation of a load at a time of cutting of the wire based on the electric current value, detection of whether or not the load is within an optimum breaking load range, and sending of an apparatus stop signal to the control portion based on a result of the detection.   
     
     
         8 . The wire bonding apparatus according to  claim 7  wherein the memory portion stores wire diameter information of the wire, and the arithmetic processing portion calculates the optimum breaking load range based on the wire diameter information of the wire. 
     
     
         9 . A wire bonding method comprising:
 bonding a wire in order at a first bonding point and a second bonding point;   raising a capillary, through which the wire is inserted, on the second bonding point;   cutting the wire by closing a damper provided above the capillary at a time when the capillary has reached a prescribed height;   measuring a load incurred on the wire at a time of cutting of the wire;   detecting whether the measured load is within a prescribed optimum breaking load range; and   determining whether or not to continue bonding based on the detection result.   
     
     
         10 . The wire bonding method of  claim 9  wherein the load incurred on the wire is measured by a load sensor mounted on a damper supporting portion that supports the damper at one end. 
     
     
         11 . The wire bonding method of  claim 9  wherein an electric current value of a capillary moving portion that moves a transducer horn that supports the capillary at one end is measured, and a load incurred on the wire is calculated based on the electric current value. 
     
     
         12 . The wire bonding method of  claim 9  wherein the prescribed optimum breaking load range is determined based on a wire diameter of the wire.