Inventor · disambiguated record
Mitsuhiro Nakao
Also filed as: NAKAO MITSUHIRO
21 granted patents·5 pending applications·281 citations·filing 1993–2021
95Inventor score
Files withTOSHIBA KK12MITSUBISHI HEAVY IND LTD5TOPPAN PRINTING CO LTD3NAKAO MITSUHIRO2EGUCHI TSUYOSHI1
Top patents by PatentIndex Score
26 records- 0195US7748954B2Centrifugal fanMITSUBISHI HEAVY IND LTD·Filed 2007·Granted Jul 6, 2010·39 cites·6 claims
- 0291US8043148B2Noise suppressing damperMITSUBISHI HEAVY IND LTD·Filed 2008·Granted Oct 25, 2011·16 cites·3 claims
- 0391US6897552B2Semiconductor device wherein chips are stacked to have a fine pitch structureTOSHIBA KK·Filed 2002·Granted May 24, 2005·73 cites·9 claims
- 0490US6727593B2Semiconductor device with improved bondingTOSHIBA KK·Filed 2002·Granted Apr 27, 2004·48 cites·9 claims
- 0582US7768456B2Antenna device and radio communication deviceTOSHIBA KK·Filed 2007·Granted Aug 3, 2010·11 cites·16 claims
- 0675US8826666B2Nozzle, and gas turbine combustor having the nozzleKAJIMURA SHUHEI·Filed 2012·Granted Sep 9, 2014·7 cites·8 claims
- 0774US7675183B2Semiconductor device including an insulating film and insulating pillars and manufacturing method of the semiconductor deviceTOSHIBA KK·Filed 2008·Granted Mar 9, 2010·4 cites·11 claims
- 0870US5592020ASemiconductor device with smaller package having leads with alternating offset projectionsTOSHIBA KK·Filed 1995·Granted Jan 7, 1997·36 cites·54 claims
- 0966US8308049B2Wire bonding methodNAKAO MITSUHIRO·Filed 2009·Granted Nov 13, 2012·4 cites·10 claims
- 1066US8004028B2Solid state imaging device, manufacturing method of the same, and substrate for solid state imaging deviceTOPPAN PRINTING CO LTD·Filed 2009·Granted Aug 23, 2011·1 cites·8 claims
- 1166US7932122B2Manufacturing method for solid state image pickup deviceTOPPAN PRINTING CO LTD·Filed 2010·Granted Apr 26, 2011·1 cites·5 claims
- 1266US7737044B2Solid state imaging device, manufacturing method of the same, and substrate for solid state imaging deviceTOPPAN PRINTING CO LTD·Filed 2006·Granted Jun 15, 2010·1 cites·9 claims
- 1362US8105026B2Centrifugal blowerEGUCHI TSUYOSHI·Filed 2008·Granted Jan 31, 2012·8 cites·9 claims
- 1457US8097485B2Solid state image pickup device and manufacturing method thereofOGATA KEISUKE·Filed 2007·Granted Jan 17, 2012·1 cites·2 claims
- 1555US2010163209A1Air Conditioning Unit and Vehicle Air Conditioning ApparatusMITSUBISHI HEAVY IND LTD·Filed 2008·Application pending·0 cites
- 1649US11346556B2Combustor having inner and outer tubular oxygen nozzles about a tubular fuel supply unitMITSUBISHI HEAVY IND LTD·Filed 2019·Granted May 31, 2022·0 cites·5 claims
- 1749US2006113674A1Semiconductor device and manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2006·Application pending·0 cites
- 1847US8231046B2Wire bonding apparatus and wire bonding methodNAKAO MITSUHIRO·Filed 2009·Granted Jul 31, 2012·0 cites·4 claims
- 1946US2008099532A1Wire bonding apparatus and wire bonding methodTOSHIBA KK·Filed 2007·Application pending·0 cites
- 2045US7849897B2Apparatus and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2007·Granted Dec 14, 2010·0 cites·10 claims
- 2145US5395035AWire bonding apparatusTOSHIBA KK·Filed 1993·Granted Mar 7, 1995·15 cites·2 claims
- 2244US12247740B2Fuel injector, combustor including the fuel injector, and gas turbine including the combustorMITSUBISHI HEAVY IND LTD·Filed 2021·Granted Mar 11, 2025·0 cites·12 claims
- 2343US5763849AWire bonding apparatusTOSHIBA KK·Filed 1996·Granted Jun 9, 1998·11 cites·4 claims
- 2442US2004159951A1Semiconductor device and manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2004·Application pending·0 cites
- 2536US5801433ASemiconductor device with smaller packageTOSHIBA KK·Filed 1996·Granted Sep 1, 1998·5 cites·24 claims
- 2632US2012193784A1Method for joining bonding wire, semiconductor device, and method for manufacturing semiconductor deviceTOGASAKI NORIHIRO·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →