Inventor · disambiguated record
Oliver Eichinger
Also filed as: EICHINGER OLIVER
9 granted patents·2 pending applications·12 citations·filing 2010–2023
82Inventor score
Technology areasH10W
Top patents by PatentIndex Score
11 records- 0183US12255168B2Electronic device with multi-layer contact and systemINFINEON TECHNOLOGIES AG·Filed 2023·Granted Mar 18, 2025·0 cites·10 claims
- 0283US11842975B2Electronic device with multi-layer contact and systemINFINEON TECHNOLOGIES AG·Filed 2019·Granted Dec 12, 2023·2 cites·8 claims
- 0379US9490193B2Electronic device with multi-layer contactHEINRICH ALEXANDER·Filed 2011·Granted Nov 8, 2016·4 cites·6 claims
- 0471US8802553B2Method for mounting a semiconductor chip on a carrierHEINRICH ALEXANDER·Filed 2011·Granted Aug 12, 2014·3 cites·24 claims
- 0566US8531014B2Method and system for minimizing carrier stress of a semiconductor deviceMENGEL MANFRED·Filed 2010·Granted Sep 10, 2013·2 cites·24 claims
- 0663US9034751B2Method for mounting a semiconductor chip on a carrierINFINEON TECHNOLOGIES AG·Filed 2014·Granted May 19, 2015·1 cites·20 claims
- 0761US2021167034A1Chip arrangementsINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 0859US10475761B2Method for producing electronic device with multi-layer contactINFINEON TECHNOLOGIES AG·Filed 2018·Granted Nov 12, 2019·0 cites·20 claims
- 0954US2017025375A1Electronic Device with Multi-Layer ContactINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
- 1053US10930614B2Chip arrangementsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 23, 2021·0 cites·16 claims
- 1148US9735126B2Solder alloys and arrangementsMENGEL MANFRED·Filed 2011·Granted Aug 15, 2017·0 cites·25 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →