Inventor · disambiguated record
Won Bae Bang
Also filed as: BANG WON · BANG WON B · BANG WON BAE
51 granted patents·20 pending applications·1,316 citations·filing 1997–2024
98Inventor score
Files withAPPLIED MATERIALS INC33AMKOR TECH SINGAPORE HOLDING PTE LTD17AMKOR TECHNOLOGY INC15BANG WON B2MASSACHUSETTS INST TECHNOLOGY2
Top patents by PatentIndex Score
71 records- 0196US7758698B2Dual top gas feed through distributor for high density plasma chamberAPPLIED MATERIALS INC·Filed 2006·Granted Jul 20, 2010·450 cites·8 claims
- 0296US7335609B2Gap-fill depositions introducing hydroxyl-containing precursors in the formation of silicon containing dielectric materialsAPPLIED MATERIALS INC·Filed 2005·Granted Feb 26, 2008·70 cites·18 claims
- 0395US9631481B1Semiconductor device including leadframe with a combination of leads and lands and methodAMKOR TECHNOLOGY INC·Filed 2016·Granted Apr 25, 2017·4 cites·20 claims
- 0495US9613829B1Method for fabricating semiconductor package and semiconductor package using the sameAMKOR TECHNOLOGY INC·Filed 2016·Granted Apr 4, 2017·12 cites·20 claims
- 0595US6629559B2Molds for casting with customized internal structure to collapse upon cooling and to facilitate control of heat transferMASSACHUSETTS INST TECHNOLOGY·Filed 2002·Granted Oct 7, 2003·43 cites·84 claims
- 0693US6110556ALid assembly for a process chamber employing asymmetric flow geometriesAPPLIED MATERIALS INC·Filed 1997·Granted Aug 29, 2000·218 cites·20 claims
- 0792US10049954B2Semiconductor package having routable encapsulated conductive substrate and methodAMKOR TECHNOLOGY INC·Filed 2016·Granted Aug 14, 2018·7 cites·14 claims
- 0891US7722719B2Gas baffle and distributor for semiconductor processing chamberAPPLIED MATERIALS INC·Filed 2005·Granted May 25, 2010·22 cites·29 claims
- 0990US11508635B2Semiconductor package having routable encapsulated conductive substrate and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 22, 2022·2 cites·19 claims
- 1089US7456116B2Gap-fill depositions in the formation of silicon containing dielectric materialsAPPLIED MATERIALS INC·Filed 2004·Granted Nov 25, 2008·42 cites·16 claims
- 1189US6117244ADeposition resistant lining for CVD chamberAPPLIED MATERIALS INC·Filed 1998·Granted Sep 12, 2000·93 cites·3 claims
- 1286US11495505B2Semiconductor devices and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 8, 2022·2 cites·19 claims
- 1386US2024404902A1Semiconductor package having routable encapsulated conductive substrate and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 1485US9978695B1Semiconductor device including leadframe with a combination of leads and lands and methodAMKOR TECHNOLOGY INC·Filed 2017·Granted May 22, 2018·1 cites·20 claims
- 1585US9881864B2Method for fabricating semiconductor package and semiconductor package using the sameAMKOR TECHNOLOGY INC·Filed 2017·Granted Jan 30, 2018·3 cites·20 claims
- 1685US7011710B2Concentration profile on demand gas delivery system (individual divert delivery system)APPLIED MATERIALS INC·Filed 2001·Granted Mar 14, 2006·29 cites·10 claims
- 1783US11145588B2Method for fabricating semiconductor package and semiconductor package using the sameAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Oct 12, 2021·2 cites·20 claims
- 1882US10685897B2Semiconductor package having routable encapsulated conductive substrate and methodAMKOR TECHNOLOGY INC·Filed 2018·Granted Jun 16, 2020·2 cites·20 claims
- 1982US6397922B1Molds for casting with customized internal structure to collapse upon cooling and to facilitate control of heat transferMASSACHUSETTS INST TECHNOLOGY·Filed 2000·Granted Jun 4, 2002·85 cites·9 claims
- 2082US2024258225A1Method of forming a molded substrate electronic package and structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 2180US12062588B2Semiconductor package having routable encapsulated conductive substrate and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Aug 13, 2024·0 cites·20 claims
- 2280US9275939B1Semiconductor device including leadframe with a combination of leads and lands and methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Mar 1, 2016·4 cites·20 claims
- 2378US10177117B2Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structureAMKOR TECHNOLOGY INC·Filed 2016·Granted Jan 8, 2019·3 cites·12 claims
- 2477US11569163B2Method for fabricating semiconductor package and semiconductor package using the sameAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 2577US9508631B1Semiconductor device including leadframe with a combination of leads and lands and methodAMKOR TECHNOLOGY INC·Filed 2015·Granted Nov 29, 2016·2 cites·20 claims
- 2677US8648450B1Semiconductor device including leadframe with a combination of leads and landsBAE JAE MIN·Filed 2011·Granted Feb 11, 2014·4 cites·20 claims
- 2776US7204888B2Lift pin assembly for substrate processingAPPLIED MATERIALS INC·Filed 2003·Granted Apr 17, 2007·22 cites·21 claims
- 2876US7192486B2Clog-resistant gas delivery systemAPPLIED MATERIALS INC·Filed 2002·Granted Mar 20, 2007·15 cites·18 claims
- 2974US7806383B2Slit valveAPPLIED MATERIALS INC·Filed 2007·Granted Oct 5, 2010·6 cites·16 claims
- 3074US6090206AThrottle valve providing enhanced cleaningAPPLIED MATERIALS INC·Filed 1997·Granted Jul 18, 2000·34 cites·7 claims
- 3173US11923280B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 3273US10468343B2Method for fabricating semiconductor package and semiconductor package using the sameAMKOR TECHNOLOGY INC·Filed 2018·Granted Nov 5, 2019·1 cites·20 claims
- 3372US11961794B2Method of forming a molded substrate electronic package and structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Apr 16, 2024·0 cites·20 claims
- 3472US11646248B2Semiconductor device having a lead flank and method of manufacturing a semiconductor device having a lead flankAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted May 9, 2023·0 cites·20 claims
- 3572US9552999B2Packaged electronic device having reduced parasitic effects and methodAMKOR TECHNOLOGY INC·Filed 2015·Granted Jan 24, 2017·2 cites·20 claims
- 3672US2023352370A1Semiconductor device and method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 3771US11961775B2Semiconductor devices and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Apr 16, 2024·0 cites·18 claims
- 3870US9922919B2Electronic package structure having insulated substrate with lands and conductive patternsAMKOR TECHNOLOGY INC·Filed 2015·Granted Mar 20, 2018·1 cites·6 claims
- 3969US6063198AHigh pressure release device for semiconductor fabricating equipmentAPPLIED MATERIALS INC·Filed 1998·Granted May 16, 2000·37 cites·12 claims
- 4066US6261374B1Clog resistant gas delivery systemAPPLIED MATERIALS INC·Filed 1998·Granted Jul 17, 2001·27 cites·14 claims
- 4165US11398455B2Semiconductor devices and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Jul 26, 2022·1 cites·19 claims
- 4264US7754282B2Adjusting a spacing between a gas distribution member and a substrate supportAPPLIED MATERIALS INC·Filed 2008·Granted Jul 13, 2010·2 cites·19 claims
- 4362US2009042407A1Dual Top Gas Feed Through Distributor for High Density Plasma ChamberAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 4461US11114369B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Sep 7, 2021·0 cites·20 claims
- 4560US5948958AMethod and apparatus for verifying the calibration of semiconductor processing equipmentAPPLIED MATERIALS INC·Filed 1998·Granted Sep 7, 1999·24 cites·21 claims
- 4659US10910298B2Method of forming a molded substrate electronic package and structureAMKOR TECHNOLOGY INC·Filed 2018·Granted Feb 2, 2021·0 cites·15 claims
- 4759US7413612B2In situ substrate holder leveling method and apparatusAPPLIED MATERIALS INC·Filed 2003·Granted Aug 19, 2008·8 cites·17 claims
- 4858US2008121177A1Dual top gas feed through distributor for high density plasma chamberAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 4958US2010006032A1Chamber components for cvd applicationsAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 5057US6267820B1Clog resistant injection valveAPPLIED MATERIALS INC·Filed 1999·Granted Jul 31, 2001·16 cites·20 claims
Showing the top 50 of 71 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →