Inventor · disambiguated record
Arulkumar Shanmugasundram
Also filed as: SHANMUGASUNDRAM ARULKUMAR · SHANMUGASUNDRAM ARULKUMAR P
40 granted patents·20 pending applications·1,381 citations·filing 1999–2012
98Inventor score
Files withAPPLIED MATERIALS INC49SHANMUGASUNDRAM ARULKUMAR2SHANMUGASUNDRAM ARULKUMAR P2WEIDMAN TIMOTHY W2STEWART MICHAEL P1
Top patents by PatentIndex Score
60 records- 0197US7783375B2Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processingAPPLIED MATERIALS INC·Filed 2007·Granted Aug 24, 2010·42 cites·19 claims
- 0297US7725208B2Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processingAPPLIED MATERIALS INC·Filed 2007·Granted May 25, 2010·40 cites·21 claims
- 0397US7341633B2Apparatus for electroless depositionAPPLIED MATERIALS INC·Filed 2004·Granted Mar 11, 2008·230 cites·23 claims
- 0495US7514353B2Contact metallization scheme using a barrier layer over a silicide layerAPPLIED MATERIALS INC·Filed 2006·Granted Apr 7, 2009·37 cites·33 claims
- 0595US7082345B2Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entitiesAPPLIED MATERIALS INC·Filed 2002·Granted Jul 25, 2006·100 cites·43 claims
- 0695US6913938B2Feedback control of plasma-enhanced chemical vapor deposition processesAPPLIED MATERIALS INC·Filed 2002·Granted Jul 5, 2005·115 cites·81 claims
- 0793US7247080B1Feedback controlled polishing processesAPPLIED MATERIALS INC·Filed 2006·Granted Jul 24, 2007·29 cites·7 claims
- 0893US7160739B2Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profilesAPPLIED MATERIALS INC·Filed 2001·Granted Jan 9, 2007·58 cites·28 claims
- 0992US7659203B2Electroless deposition process on a silicon contactAPPLIED MATERIALS INC·Filed 2006·Granted Feb 9, 2010·16 cites·41 claims
- 1092US7651934B2Process for electroless copper depositionAPPLIED MATERIALS INC·Filed 2006·Granted Jan 26, 2010·25 cites·41 claims
- 1192US7024268B1Feedback controlled polishing processesAPPLIED MATERIALS INC·Filed 2003·Granted Apr 4, 2006·43 cites·9 claims
- 1291US7654221B2Apparatus for electroless deposition of metals onto semiconductor substratesAPPLIED MATERIALS INC·Filed 2005·Granted Feb 2, 2010·18 cites·17 claims
- 1391US7337019B2Integration of fault detection with run-to-run controlAPPLIED MATERIALS INC·Filed 2002·Granted Feb 26, 2008·65 cites·75 claims
- 1490US8308858B2Electroless deposition process on a silicon contactSTEWART MICHAEL P·Filed 2010·Granted Nov 13, 2012·11 cites·16 claims
- 1590US7201936B2Method of feedback control of sub-atmospheric chemical vapor deposition processesAPPLIED MATERIALS INC·Filed 2002·Granted Apr 10, 2007·59 cites·31 claims
- 1690US6999836B2Method, system, and medium for handling misrepresentative metrology data within an advanced process control systemAPPLIED MATERIALS INC·Filed 2003·Granted Feb 14, 2006·60 cites·68 claims
- 1789US8070909B2Feedback control of chemical mechanical polishing device providing manipulation of removal rate profilesSHANMUGASUNDRAM ARULKUMAR P·Filed 2006·Granted Dec 6, 2011·13 cites·16 claims
- 1889US7827930B2Apparatus for electroless deposition of metals onto semiconductor substratesAPPLIED MATERIALS INC·Filed 2005·Granted Nov 9, 2010·17 cites·21 claims
- 1989US7047099B2Integrating tool, module, and fab level controlAPPLIED MATERIALS INC·Filed 2002·Granted May 16, 2006·45 cites·46 claims
- 2089US6413145B1System for polishing and cleaning substratesAPPLIED MATERIALS INC·Filed 2000·Granted Jul 2, 2002·38 cites·23 claims
- 2188US8005634B2Copper wiring module controlAPPLIED MATERIALS INC·Filed 2007·Granted Aug 23, 2011·11 cites·32 claims
- 2288US7256111B2Pretreatment for electroless depositionAPPLIED MATERIALS INC·Filed 2004·Granted Aug 14, 2007·40 cites·19 claims
- 2387US7966087B2Method, system and medium for controlling manufacture process having multivariate input parametersAPPLIED MATERIALS INC·Filed 2007·Granted Jun 21, 2011·10 cites·19 claims
- 2487US7223323B2Multi-chemistry plating systemAPPLIED MATERIALS INC·Filed 2003·Granted May 29, 2007·44 cites·1 claims
- 2586US8694145B2Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profilesSHANMUGASUNDRAM ARULKUMAR P·Filed 2011·Granted Apr 8, 2014·6 cites·20 claims
- 2686US7273813B2Wafer cleaning solution for cobalt electroless applicationAPPLIED MATERIALS INC·Filed 2005·Granted Sep 25, 2007·11 cites·12 claims
- 2785US7272459B2Method, system and medium for controlling manufacture process having multivariate input parametersAPPLIED MATERIALS INC·Filed 2003·Granted Sep 18, 2007·42 cites·23 claims
- 2882US7542132B2Raman spectroscopy as integrated chemical metrologyAPPLIED MATERIALS INC·Filed 2007·Granted Jun 2, 2009·7 cites·18 claims
- 2981US6625513B1Run-to-run control over semiconductor processing tool based upon mirror image targetAPPLIED MATERIALS INC·Filed 2000·Granted Sep 23, 2003·29 cites·12 claims
- 3080US7698012B2Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processingAPPLIED MATERIALS INC·Filed 2002·Granted Apr 13, 2010·19 cites·56 claims
- 3179US7205233B2Method for forming CoWRe alloys by electroless depositionAPPLIED MATERIALS INC·Filed 2003·Granted Apr 17, 2007·21 cites·29 claims
- 3275US6887124B2Method of polishing and cleaning substratesAPPLIED MATERIALS INC·Filed 2002·Granted May 3, 2005·14 cites·9 claims
- 3372US7534298B2Apparatus and method of detecting the electroless deposition endpointAPPLIED MATERIALS INC·Filed 2004·Granted May 19, 2009·10 cites·46 claims
- 3467US7910476B2Adhesion and minimizing oxidation on electroless CO alloy films for integration with low K inter-metal dielectric and etch stopAPPLIED MATERIALS INC·Filed 2008·Granted Mar 22, 2011·3 cites·23 claims
- 3563US6244931B1Buffer station on CMP systemAPPLIED MATERIALS INC·Filed 1999·Granted Jun 12, 2001·28 cites·15 claims
- 3662US7473339B2Slim cell platform plumbingAPPLIED MATERIALS INC·Filed 2004·Granted Jan 6, 2009·3 cites·9 claims
- 3762US6350188B1Drive system for a carrier head support structureAPPLIED MATERIALS INC·Filed 2000·Granted Feb 26, 2002·9 cites·19 claims
- 3861US7970588B2Method, system and medium for controlling manufacturing process using adaptive models based on empirical dataAPPLIED MATERIALS INC·Filed 2007·Granted Jun 28, 2011·2 cites·23 claims
- 3960US7668702B2Method, system and medium for controlling manufacturing process using adaptive models based on empirical dataAPPLIED MATERIALS INC·Filed 2003·Granted Feb 23, 2010·7 cites·31 claims
- 4053US7323058B2Apparatus for electroless deposition of metals onto semiconductor substratesAPPLIED MATERIALS INC·Filed 2004·Granted Jan 29, 2008·4 cites·25 claims
- 4149US2006246699A1Process for electroless copper deposition on a ruthenium seedWEIDMAN TIMOTHY W·Filed 2006·Application pending·0 cites
- 4249US2007169694A1Feedback control of sub-atmospheric chemical vapor deposition processesAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 4349US2006246683A1Integrated equipment set for forming a low K dielectric interconnect on a substrateAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 4449US2012315756A1Process for electroless copper deposition on a ruthenium seedWEIDMAN TIMOTHY W·Filed 2012·Application pending·0 cites
- 4548US2008121276A1Selective electroless deposition for solar cellsAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 4646US2007099417A1Adhesion and minimizing oxidation on electroless CO alloy films for integration with low K inter-metal dielectric and etch stopAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 4744US2007071888A1Method and apparatus for forming device features in an integrated electroless deposition systemSHANMUGASUNDRAM ARULKUMAR·Filed 2006·Application pending·0 cites
- 4842US2003199112A1Copper wiring module controlAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 4941US2004007325A1Integrated equipment set for forming a low K dielectric interconnect on a substrateAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 5041US2006003570A1Method and apparatus for electroless capping with vapor dryingSHANMUGASUNDRAM ARULKUMAR·Filed 2004·Application pending·0 cites
Showing the top 50 of 60 patent records by PatentIndex Score.
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