Inventor · disambiguated record
Jeng H. Hwang
Also filed as: HWANG JENG · HWANG JENG H · HWANG JENG-HUEY
25 granted patents·4 pending applications·1,025 citations·filing 1991–2007
97Inventor score
Top patents by PatentIndex Score
29 records- 0197US6692903B2Substrate cleaning apparatus and methodAPPLIED MATERIALS INC·Filed 2000·Granted Feb 17, 2004·414 cites·49 claims
- 0293US6270687B1RF plasma methodAPPLIED MATERIALS INC·Filed 2000·Granted Aug 7, 2001·42 cites·28 claims
- 0392US6071372ARF plasma etch reactor with internal inductive coil antenna and electrically conductive chamber wallsAPPLIED MATERIALS INC·Filed 1997·Granted Jun 6, 2000·69 cites·49 claims
- 0489US6821907B2Etching methods for a magnetic memory cell stackAPPLIED MATERIALS INC·Filed 2002·Granted Nov 23, 2004·36 cites·27 claims
- 0588US6482745B1Etching methods for anisotropic platinum profileAPPLIED MATERIALS INC·Filed 2000·Granted Nov 19, 2002·36 cites·117 claims
- 0687US6893893B2Method of preventing short circuits in magnetic film stacksAPPLIED MATERIALS INC·Filed 2002·Granted May 17, 2005·37 cites·35 claims
- 0786US6277251B1Apparatus and method for shielding a dielectric member to allow for stable power transmission into a plasma processing chamberAPPLIED MATERIALS INC·Filed 2000·Granted Aug 21, 2001·25 cites·23 claims
- 0884US6277762B1Method for removing redeposited veils from etched platinumAPPLIED MATERIALS INC·Filed 2000·Granted Aug 21, 2001·24 cites·83 claims
- 0983US6436838B1Method of patterning lead zirconium titanate and barium strontium titanateAPPLIED MATERIALS INC·Filed 2000·Granted Aug 20, 2002·48 cites·35 claims
- 1082US7186657B2Method for patterning HfO2-containing dielectricUNITED MICROELECTRONICS CORP·Filed 2005·Granted Mar 6, 2007·6 cites·9 claims
- 1181US6919168B2Masking methods and etching sequences for patterning electrodes of high density RAM capacitorsAPPLIED MATERIALS INC·Filed 2002·Granted Jul 19, 2005·31 cites·28 claims
- 1273US6323132B1Etching methods for anisotropic platinum profileAPPLIED MATERIALS INC·Filed 1999·Granted Nov 27, 2001·36 cites·27 claims
- 1373US5174856AMethod for removal of photoresist over metal which also removes or inactivates corrosion-forming materials remaining from previous metal etchAPPLIED MATERIALS INC·Filed 1991·Granted Dec 29, 1992·64 cites·20 claims
- 1472US6368517B1Method for preventing corrosion of a dielectric materialAPPLIED MATERIALS INC·Filed 1999·Granted Apr 9, 2002·41 cites·32 claims
- 1570US6541380B2Plasma etching process for metals and metal oxides, including metals and metal oxides inert to oxidationAPPLIED MATERIALS INC·Filed 2001·Granted Apr 1, 2003·13 cites·25 claims
- 1665US6579796B2Method of etching platinum using a silicon carbide maskAPPLIED MATERIALS INC·Filed 2001·Granted Jun 17, 2003·9 cites·43 claims
- 1764US6770567B2Method of reducing particulates in a plasma etch chamber during a metal etch processFiled 2001·Granted Aug 3, 2004·11 cites·29 claims
- 1863US6265318B1Iridium etchant methods for anisotropic profileAPPLIED MATERIALS INC·Filed 1999·Granted Jul 24, 2001·30 cites·140 claims
- 1962US6037264AMethod for removing redeposited veils from etched platinumAPPLIED MATERIALS INC·Filed 1999·Granted Mar 14, 2000·19 cites·54 claims
- 2057US6777342B2Method of plasma etching platinumFiled 2002·Granted Aug 17, 2004·4 cites·58 claims
- 2157US6087265AMethod for removing redeposited veils from etched platinumAPPLIED MATERIALS INC·Filed 1999·Granted Jul 11, 2000·16 cites·76 claims
- 2256US6749770B2Method of etching an anisotropic profile in platinumFiled 2001·Granted Jun 15, 2004·4 cites·19 claims
- 2356US6692648B2Method of plasma heating and etching a substrateAPPLIED MATERIALS INC·Filed 2000·Granted Feb 17, 2004·5 cites·25 claims
- 2454US6709609B2Plasma heating of a substrate with subsequent high temperature etchingAPPLIED MATERIALS INC·Filed 2000·Granted Mar 23, 2004·4 cites·30 claims
- 2553US2007117304A1Method for patterning hfo2-containing dielectricHWANG JENG-HUEY·Filed 2007·Application pending·0 cites
- 2646US6730561B2Method of forming a cup capacitorAPPLIED MATERIALS INC·Filed 2001·Granted May 4, 2004·1 cites·38 claims
- 2744US2006019451A1Method for patterning hfo2-containing dielectricHWANG JENG-HUEY·Filed 2004·Application pending·0 cites
- 2837US2001050267A1Method for allowing a stable power transmission into a plasma processing chamberFiled 2001·Application pending·0 cites
- 2932US2003013314A1Method of reducing particulates in a plasma etch chamber during a metal etch processFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →