Inventor · disambiguated record
Sadao Nakashima
Also filed as: NAKASHIMA SADAO
13 granted patents·6 pending applications·693 citations·filing 1995–2011
92Inventor score
Files withHITACHI INT ELECTRIC INC9KOMATSU DENSHI KINZOKU KK3SASAKI TAKAFUMI2FUKUDA MASANAO1KURIBAYASHI KOEI1
Top patents by PatentIndex Score
19 records- 0198US7865070B2Heat treating apparatusHITACHI INT ELECTRIC INC·Filed 2005·Granted Jan 4, 2011·521 cites·24 claims
- 0285US9074284B2Heat treatment apparatusFUKUDA MASANAO·Filed 2010·Granted Jul 7, 2015·7 cites·12 claims
- 0376US8409352B2Method of manufacturing semiconductor device, method of manufacturing substrate and substrate processing apparatusKURIBAYASHI KOEI·Filed 2011·Granted Apr 2, 2013·6 cites·13 claims
- 0474US5658809ASOI substrate and method of producing the sameKOMATSU DENSHI KINZOKU KK·Filed 1995·Granted Aug 19, 1997·46 cites·9 claims
- 0571US5918136ASOI substrate and method of producing the sameKOMATSU DENSHI KINZOKU KK·Filed 1997·Granted Jun 29, 1999·39 cites·2 claims
- 0669US8679989B2Method of manufacturing semiconductor device including removal of deposits from process chamber and supply portionNAKASHIMA SADAO·Filed 2007·Granted Mar 25, 2014·2 cites·20 claims
- 0767US8246749B2Substrate processing apparatus and semiconductor device producing methodWANG JIE·Filed 2006·Granted Aug 21, 2012·2 cites·18 claims
- 0866US5989981AMethod of manufacturing SOI substrateNIPPON TELEGRAPH & TELEPHONE·Filed 1997·Granted Nov 23, 1999·36 cites·12 claims
- 0962US5665613AMethod of making semiconductor device having SIMOX structureKOMATSU DENSHI KINZOKU KK·Filed 1995·Granted Sep 9, 1997·31 cites·5 claims
- 1057US2009061651A1Substrate processing apparatus and method for manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2008·Application pending·0 cites
- 1156US2009186489A1Thermal treatment apparatus, method for manufacturing semiconductor device, and method for manufacturing substrateHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 1253US7667301B2Thermal treatment apparatus, method for manufacturing semiconductor device, and method for manufacturing substrateHITACHI INT ELECTRIC INC·Filed 2003·Granted Feb 23, 2010·3 cites·7 claims
- 1347US2010148415A1Thermal treatment apparatus, method for manufacturing semiconductor device, and method for manufacturing substrateHITACHI INT ELECTRIC INC·Filed 2010·Application pending·0 cites
- 1446US2008268644A1Manufacturing method of semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2008·Application pending·0 cites
- 1543US7901206B2Heat-treating apparatus and method of producing substratesHITACHI INT ELECTRIC INC·Filed 2006·Granted Mar 8, 2011·0 cites·14 claims
- 1639US2007275570A1Heat Treatment ApparatusHITACHI INT ELECTRIC INC·Filed 2005·Application pending·0 cites
- 1738US8889533B2Method of manufacturing semiconductor device, method of manufacturing substrate and substrate processing apparatusSASAKI TAKAFUMI·Filed 2011·Granted Nov 18, 2014·0 cites·16 claims
- 1837US2003170583A1Heat treatment apparatus and a method for fabricating substratesHITACHI INT ELECTRIC INC·Filed 2003·Application pending·0 cites
- 1936US8450220B2Substrate processing apparatus , method of manufacturing semiconductor device, and method of manufacturing substrateSASAKI TAKAFUMI·Filed 2010·Granted May 28, 2013·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →