Inventor · disambiguated record
Yasunobu Onishi
Also filed as: ONISHI YASUNOBU
40 granted patents·9 pending applications·1,685 citations·filing 1982–2011
98Inventor score
Top patents by PatentIndex Score
49 records- 0198US6025117AMethod of forming a pattern using polysilaneTOSHIBA KK·Filed 1997·Granted Feb 15, 2000·423 cites·4 claims
- 0297US4822716APolysilanes, Polysiloxanes and silicone resist materials containing these compoundsTOSHIBA KK·Filed 1986·Granted Apr 18, 1989·120 cites·5 claims
- 0396US5017453AA silicone resist materials containing a polysiloxane and a photo-sensitive agentTOSHIBA KK·Filed 1989·Granted May 21, 1991·81 cites·9 claims
- 0495US5198520APolysilanes, polysiloxanes and silicone resist materials containing these compoundsTOSHIBA KK·Filed 1991·Granted Mar 30, 1993·97 cites·8 claims
- 0593US6569595B1Method of forming a patternTOSHIBA KK·Filed 2000·Granted May 27, 2003·58 cites·10 claims
- 0693US6054254AComposition for underlying film and method of forming a pattern using the filmTOSHIBA KK·Filed 1998·Granted Apr 25, 2000·104 cites·10 claims
- 0791US5403695AResist for forming patterns comprising an acid generating compound and a polymer having acid decomposable groupsTOSHIBA KK·Filed 1992·Granted Apr 4, 1995·83 cites·16 claims
- 0889US5658706AResist composition for forming a pattern comprising a pyridinium compound as an additiveTOSHIBA KK·Filed 1994·Granted Aug 19, 1997·82 cites·7 claims
- 0989US4835193APhotopolymerizable epoxy resin compositionTOSHIBA KK·Filed 1987·Granted May 30, 1989·44 cites·16 claims
- 1088US5326675APattern forming method including the formation of an acidic coating layer on the radiation-sensitive layerTOSHIBA KK·Filed 1992·Granted Jul 5, 1994·49 cites·18 claims
- 1186US6576562B2Manufacturing method of semiconductor device using mask pattern having high etching resistanceTOSHIBA KK·Filed 2001·Granted Jun 10, 2003·36 cites·23 claims
- 1285US4495042APhoto-curable epoxy resin compositionTOKYO SHIBAURA ELECTRIC CO·Filed 1983·Granted Jan 22, 1985·38 cites·7 claims
- 1384US4988601APhotosensitive resin composition with o-quinone diazide and novolac resins prepared from mixed phenolic reactants to include 3,5-xylenol and 2,5-xylenolTOSHIBA KK·Filed 1988·Granted Jan 29, 1991·36 cites·5 claims
- 1481US4479860APhoto-curable epoxy resin compositionTOKYO SHIBAURA ELECTRIC CO·Filed 1983·Granted Oct 30, 1984·29 cites·8 claims
- 1580US5063134APhotosensitive compositionTOSHIBA KK·Filed 1990·Granted Nov 5, 1991·27 cites·16 claims
- 1679US5100768APhotosensitive compositionTOSHIBA KK·Filed 1990·Granted Mar 31, 1992·34 cites·12 claims
- 1778US6270948B1Method of forming patternTOSHIBA KK·Filed 1999·Granted Aug 7, 2001·54 cites·12 claims
- 1877US6806021B2Method for forming a pattern and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2002·Granted Oct 19, 2004·13 cites·21 claims
- 1975US4871646APolysilane compound and photosensitive compositionTOSHIBA KK·Filed 1988·Granted Oct 3, 1989·24 cites·16 claims
- 2074US7687227B2Resist pattern forming method and manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2005·Granted Mar 30, 2010·3 cites·17 claims
- 2174US5744281AResist composition for forming a pattern and method of forming a pattern wherein the composition 4-phenylpyridine as an additiveTOSHIBA KK·Filed 1997·Granted Apr 28, 1998·34 cites·6 claims
- 2272US7319944B2Method for a predicting a pattern shape by using an actual measured dissolution rate of a photosensitive resistTOSHIBA KK·Filed 2004·Granted Jan 15, 2008·11 cites·31 claims
- 2371US7198886B2Method for forming patternTOSHIBA KK·Filed 2005·Granted Apr 3, 2007·3 cites·11 claims
- 2471US5580702AMethod for forming resist patternsTOSHIBA KK·Filed 1994·Granted Dec 3, 1996·31 cites·18 claims
- 2569US7026099B2Pattern forming method and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2003·Granted Apr 11, 2006·12 cites·18 claims
- 2666USRE35821EPattern forming method including the formation of an acidic coating layer on the radiation-sensitive layerTOSHIBA KK·Filed 1996·Granted Jun 9, 1998·23 cites·1 claims
- 2764US5279921APattern formation resist and pattern formation methodTOSHIBA KK·Filed 1991·Granted Jan 18, 1994·25 cites·10 claims
- 2862US6703181B1Photosensitive composition having uniform concentration distribution of components and pattern formation method using the sameTOSHIBA KK·Filed 1996·Granted Mar 9, 2004·17 cites·24 claims
- 2962US6420271B2Method of forming a patternTOSHIBA KK·Filed 2001·Granted Jul 16, 2002·8 cites·20 claims
- 3058US4666951APhoto-curable epoxy resin compositionTOKYO SHIBAURA ELECTRIC CO·Filed 1984·Granted May 19, 1987·15 cites·9 claims
- 3157US5889678ATopography simulation methodTOSHIBA KK·Filed 1997·Granted Mar 30, 1999·32 cites·10 claims
- 3257US4828958APhotosensitive composition and method of forming a resist pattern with copolymer of polyvinyl phenolTOSHIBA KK·Filed 1987·Granted May 9, 1989·12 cites·26 claims
- 3352US7968272B2Semiconductor device manufacturing method to form resist patternTOSHIBA KK·Filed 2006·Granted Jun 28, 2011·0 cites·4 claims
- 3452US7794922B2Pattern forming method and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2006·Granted Sep 14, 2010·0 cites·4 claims
- 3550US2011229826A1Semiconductor device manufacturing method to form resist pattern, and substrate processing apparatusKAWAMURA DAISUKE·Filed 2011·Application pending·0 cites
- 3649US2011039214A1Pattern Forming Method and Method of Manufacturing Semiconductor DeviceTOSHIBA KK·Filed 2010·Application pending·0 cites
- 3747US6225033B1Method of forming a resist patternTOSHIBA KK·Filed 1999·Granted May 1, 2001·9 cites·14 claims
- 3846US5994007APattern forming method utilizing first insulative and then conductive overlayer and underlayerTOSHIBA KK·Filed 1998·Granted Nov 30, 1999·9 cites·20 claims
- 3944US7300884B2Pattern forming method, underlayer film forming composition, and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2005·Granted Nov 27, 2007·0 cites·16 claims
- 4043US2005153245A1Method for forming a pattern and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2004·Application pending·0 cites
- 4142US2006127815A1Pattern forming method and method of manufacturing semiconductor deviceSATO YASUHIKO·Filed 2005·Application pending·0 cites
- 4240US2005214695A1Pattern forming method and method for manufacturing semiconductor deviceKATO HIROKAZU·Filed 2005·Application pending·0 cites
- 4340US2006194449A1Resist pattern forming method and method of manufacturing semiconductor deviceTAKEISHI TOMOYUKI·Filed 2006·Application pending·0 cites
- 4439US2002061453A1Method for forming patternTOSHIBA KK·Filed 2001·Application pending·0 cites
- 4536US5091282AAlkali soluble phenol polymer photosensitive compositionTOSHIBA KK·Filed 1990·Granted Feb 25, 1992·4 cites·18 claims
- 4636US4476290APhotocurable silicon compound compositionTOKYO SHIBAURA ELECTRIC CO·Filed 1983·Granted Oct 9, 1984·4 cites·7 claims
- 4736US2006008746A1Method for manufacturing semiconductor deviceONISHI YASUNOBU·Filed 2005·Application pending·0 cites
- 4834US2004265745A1Pattern forming methodFiled 2004·Application pending·0 cites
- 4931US4465752AOrganic photoconductive compositions for use in electrophotographyTOKYO SHIBAURA ELECTRIC CO·Filed 1982·Granted Aug 14, 1984·1 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →