Pattern Forming Method and Method of Manufacturing Semiconductor Device

Abstract

A pattern forming method includes forming a photo resist film on a film to be processed, forming a protective film for protecting the photo resist film from an immersion liquid on the photo resist film by coating method, performing immersion exposure selectively to a region of part of the photo resist film via the immersion liquid, the immersion liquid being supplied onto the photo resist film, removing a residual substance including an affinitive part for the immersion liquid from the protective film after the forming the protective film and before the performing immersion exposure selectively to the region of part of the photo resist film, removing the protective film, and forming a pattern comprising the photo resist film by selectively removing an exposed region or a non-exposed region of the photo resist film.

1 - 4 . (canceled) 
     
     
         5 . A pattern forming method comprising:
 forming a photo resist film on a film to be processed;   performing immersion exposure selectively to a region of part of the photo resist film via an immersion liquid, the immersion liquid being supplied onto the photo resist film;   removing a residual substance including an affinitive part for the immersion liquid from the photo resist film after the forming the protective film and before the performing immersion exposure selectively to the region of part of the photo resist film; and   forming a pattern comprising the photo resist film by selectively removing an exposed region or a non-exposed region of the photo resist film.   
     
     
         6 . The pattern forming method according to  claim 5 , wherein the removing the residual substance is baking for the photo resist film, the baking is carried out after applying a first solvent whose boiling point is lower than that of a second solvent which is remained on the photo resist film, or baking for the photo resist film, the baking is carried during applying the first solvent whose boiling point is lower than that of the second solvent. 
     
     
         7 . The pattern forming method according to  claim 6 , wherein the applying the first solvent is applying a first atmosphere which is prepared by adding a solvent whose boiling point is lower than that of the second solvent into a second atmosphere having no affinity with the immersion liquid has. 
     
     
         8 . The pattern forming method according to  claim 6 , wherein the baking is carried out at a higher temperature than the boiling point of the first solvent. 
     
     
         9 - 17 . (canceled) 
     
     
         18 . A method of manufacturing a semiconductor device, comprising:
 forming a resist pattern on a substrate including a semiconductor substrate, the resist pattern being formed by pattern forming method of  claim 5 ; and   forming a pattern by etching the substrate using the resist pattern as a mask.   
     
     
         19 - 20 . (canceled)