Inventor · disambiguated record
Mike Ravkin
Also filed as: RAVKIN MIKE
50 granted patents·12 pending applications·935 citations·filing 1999–2016
98Inventor score
Top patents by PatentIndex Score
62 records- 0196US6488040B1Capillary proximity heads for single wafer cleaning and dryingLAM RES CORP·Filed 2000·Granted Dec 3, 2002·178 cites·29 claims
- 0295US6616772B2Methods for wafer proximity cleaning and dryingLAM RES CORP·Filed 2002·Granted Sep 9, 2003·110 cites·16 claims
- 0395US6594847B1Single wafer residue, thin film removal and cleanLAM RES CORP·Filed 2000·Granted Jul 22, 2003·112 cites·18 claims
- 0495US6361414B1Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization processLAM RES CORP·Filed 2000·Granted Mar 26, 2002·83 cites·20 claims
- 0592US7234477B2Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfacesLAM RES CORP·Filed 2002·Granted Jun 26, 2007·55 cites·30 claims
- 0691US7632376B1Method and apparatus for atomic layer deposition (ALD) in a proximity systemLAM RES CORP·Filed 2005·Granted Dec 15, 2009·15 cites·23 claims
- 0791US7069937B2Vertical proximity processorLAM RES CORP·Filed 2003·Granted Jul 4, 2006·49 cites·8 claims
- 0891US6435952B1Apparatus and method for qualifying a chemical mechanical planarization processLAM RES CORP·Filed 2000·Granted Aug 20, 2002·36 cites·13 claims
- 0989US7153400B2Apparatus and method for depositing and planarizing thin films of semiconductor wafersLAM RES CORP·Filed 2003·Granted Dec 26, 2006·33 cites·12 claims
- 1088US10720343B2Method and apparatus for processing wafer-shaped articlesLAM RES AG·Filed 2016·Granted Jul 21, 2020·5 cites·21 claims
- 1186US6622335B1Drip manifold for uniform chemical deliveryLAM RES CORP·Filed 2000·Granted Sep 23, 2003·32 cites·22 claims
- 1285US7799141B2Method and system for using a two-phases substrate cleaning compoundLAM RES CORP·Filed 2006·Granted Sep 21, 2010·8 cites·24 claims
- 1383US7997288B2Single phase proximity head having a controlled meniscus for treating a substrateLAM RES CORP·Filed 2007·Granted Aug 16, 2011·8 cites·16 claims
- 1481US7387689B2Methods for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfacesLAM RES CORP·Filed 2007·Granted Jun 17, 2008·6 cites·20 claims
- 1581US6375540B1End-point detection system for chemical mechanical posing applicationsLAM RES CORP·Filed 2000·Granted Apr 23, 2002·17 cites·12 claims
- 1680US7947157B2Apparatus and method for depositing and planarizing thin films of semiconductor wafersLAM RES CORP·Filed 2006·Granted May 24, 2011·5 cites·15 claims
- 1780US7703462B2Reduction of entrance and exit marks left by a substrate-processing meniscusLAM RES CORP·Filed 2006·Granted Apr 27, 2010·4 cites·13 claims
- 1879US8671959B2Method and apparatus for cleaning a substrate using non-newtonian fluidsDE LARIOS JOHN M·Filed 2011·Granted Mar 18, 2014·4 cites·7 claims
- 1979US6858091B2Method for controlling galvanic corrosion effects on a single-wafer cleaning systemLAM RES CORP·Filed 2001·Granted Feb 22, 2005·19 cites·20 claims
- 2078US8043441B2Method and apparatus for cleaning a substrate using non-Newtonian fluidsLAM RES CORP·Filed 2005·Granted Oct 25, 2011·4 cites·7 claims
- 2178US7946303B2Carrier for reducing entrance and/or exit marks left by a substrate-processing meniscusLAM RES CORP·Filed 2006·Granted May 24, 2011·4 cites·23 claims
- 2278US6543084B2Wafer scrubbing brush coreLAM RES CORP·Filed 2001·Granted Apr 8, 2003·20 cites·5 claims
- 2373US7591613B2Method and apparatus for transporting a substrate using non-newtonian fluidLAM RES CORP·Filed 2008·Granted Sep 22, 2009·3 cites·13 claims
- 2472US8242067B2Two-phase substrate cleaning materialKOROLIK MIKHAIL·Filed 2010·Granted Aug 14, 2012·2 cites·18 claims
- 2572US7464719B2Multi-menisci processing apparatusLAM RES CORP·Filed 2006·Granted Dec 16, 2008·3 cites·10 claims
- 2670US6240588B1Wafer scrubbing brush coreLAM RES CORP·Filed 1999·Granted Jun 5, 2001·34 cites·20 claims
- 2768US7416370B2Method and apparatus for transporting a substrate using non-Newtonian fluidLAM RES CORP·Filed 2005·Granted Aug 26, 2008·2 cites·10 claims
- 2867US7029369B2End-point detection apparatusLAM RES CORP·Filed 2003·Granted Apr 18, 2006·8 cites·16 claims
- 2967US6611326B1System and apparatus for evaluating the effectiveness of wafer drying operationsLAM RES CORP·Filed 2000·Granted Aug 26, 2003·7 cites·28 claims
- 3066US7350315B2Edge wheel dry manifoldLAM RES CORP·Filed 2003·Granted Apr 1, 2008·11 cites·21 claims
- 3163US8997684B2Prevention of particle adders when contacting a liquid meniscus over a substrateMAGNI ENRICO·Filed 2011·Granted Apr 7, 2015·2 cites·14 claims
- 3263US7264007B2Method and apparatus for cleaning a substrate using megasonic powerLAM RES CORP·Filed 2003·Granted Sep 4, 2007·4 cites·12 claims
- 3363US6521050B1Methods for evaluating advanced wafer drying techniquesLAM RES CORP·Filed 2000·Granted Feb 18, 2003·9 cites·25 claims
- 3461US6726530B2End-point detection system for chemical mechanical polishing applicationsLAM RES CORP·Filed 2002·Granted Apr 27, 2004·6 cites·13 claims
- 3561US2014332037A1Controls of Ambient Environment During Wafer Drying Using Proximity HeadLAM RES CORP·Filed 2014·Application pending·0 cites
- 3658US7939139B2Methods for atomic layer deposition (ALD) using a proximity meniscusLAM RES CORP·Filed 2009·Granted May 10, 2011·0 cites·13 claims
- 3758US2009320884A1Controls of ambient environment during wafer drying using proximity headKOROLIK MIKHAIL·Filed 2009·Application pending·0 cites
- 3856US8623152B2Reduction of entrance and exit marks left by a substrate-processing meniscusO'DONNELL ROBERT·Filed 2012·Granted Jan 7, 2014·0 cites·10 claims
- 3955US8535451B2Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquidsDE LARIOS JOHN M·Filed 2008·Granted Sep 17, 2013·0 cites·20 claims
- 4055US2014158167A1Method and apparatus for cleaning a substrate using non-newtonian fluidsLAM RES CORP·Filed 2014·Application pending·0 cites
- 4154US6679763B2Apparatus and method for qualifying a chemical mechanical planarization processLAM RES CORP·Filed 2002·Granted Jan 20, 2004·4 cites·20 claims
- 4254US6537381B1Method for cleaning and treating a semiconductor wafer after chemical mechanical polishingLAM RES CORP·Filed 1999·Granted Mar 25, 2003·19 cites·15 claims
- 4353US8534303B2Carrier for reducing entrance and/or exit marks left by a substrate-processing meniscusO'DONNELL ROBERT·Filed 2011·Granted Sep 17, 2013·0 cites·20 claims
- 4453US7897213B2Methods for contained chemical surface treatmentLAM RES CORP·Filed 2007·Granted Mar 1, 2011·0 cites·22 claims
- 4552US8105441B2Carrier for reducing entrance and/or exit marks left by a substrate-processing meniscusO'DONNELL ROBERT·Filed 2011·Granted Jan 31, 2012·0 cites·20 claims
- 4651US8317932B2Reduction of entrance and exit marks left by a substrate-processing meniscusO'DONNELL ROBERT·Filed 2010·Granted Nov 27, 2012·0 cites·10 claims
- 4750US8590550B2Apparatus for cleaning contaminants from substrateKOROLIK MIKHAIL·Filed 2010·Granted Nov 26, 2013·0 cites·17 claims
- 4850US2011155563A1Apparatus and method for depositing and planarizing thin films of semiconductor wafersLAM RES CORP·Filed 2011·Application pending·0 cites
- 4949US7614411B2Controls of ambient environment during wafer drying using proximity headLAM RES CORP·Filed 2004·Granted Nov 10, 2009·2 cites·15 claims
- 5048US7780825B2Substrate gripper with integrated electrical contactsLAM RES CORP·Filed 2007·Granted Aug 24, 2010·0 cites·20 claims
Showing the top 50 of 62 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →