Inventor · disambiguated record
Soichi Nadahara
Also filed as: NADAHARA SOICHI
31 granted patents·5 pending applications·711 citations·filing 1990–2017
97Inventor score
Top patents by PatentIndex Score
36 records- 0193US10153181B2Substrate treating apparatus and substrate treating methodSCREEN HOLDINGS CO LTD·Filed 2017·Granted Dec 11, 2018·10 cites·27 claims
- 0289US7055535B2Holding unit, processing apparatus and holding method of substratesEBARA CORP·Filed 2003·Granted Jun 6, 2006·38 cites·11 claims
- 0388US5989988ASemiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 1998·Granted Nov 23, 1999·76 cites·8 claims
- 0486US6543080B1Apparatus and method for cleaning semiconductor substrateEBARA CORP·Filed 2000·Granted Apr 8, 2003·35 cites·18 claims
- 0585US7057259B2Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from themTOSHIBA KK·Filed 2002·Granted Jun 6, 2006·35 cites·38 claims
- 0684US6431185B1Apparatus and method for cleaning a semiconductor substrateTOSHIBA KK·Filed 1999·Granted Aug 13, 2002·60 cites·11 claims
- 0783US6492271B1Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2000·Granted Dec 10, 2002·27 cites·25 claims
- 0883US6021789AWafer cleaning system with progressive megasonic waveIBM·Filed 1998·Granted Feb 8, 2000·66 cites·18 claims
- 0977US7913346B2Substrate treatment apparatus and substrate treatment methodDAINIPPON SCREEN MFG·Filed 2006·Granted Mar 29, 2011·6 cites·9 claims
- 1077US7700381B2Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from themKABUSHIKIA KAISHA TOSHIBA·Filed 2006·Granted Apr 20, 2010·9 cites·1 claims
- 1176US7253500B2Semiconductor wafer and a method for manufacturing a semiconductor waferTOSHIBA KK·Filed 2005·Granted Aug 7, 2007·5 cites·5 claims
- 1276US6286524B1Wafer drying apparatus and method with residual particle removability enhancementTOSHIBA KK·Filed 1999·Granted Sep 11, 2001·46 cites·6 claims
- 1376US5098852AMethod of manufacturing a semiconductor device by mega-electron volt ion implantationTOSHIBA KK·Filed 1990·Granted Mar 24, 1992·69 cites·12 claims
- 1474US6667238B1Polishing method and apparatusEBARA CORP·Filed 2000·Granted Dec 23, 2003·15 cites·13 claims
- 1574US5360748AMethod of manufacturing a semiconductor deviceTOSHIBA KK·Filed 1993·Granted Nov 1, 1994·53 cites·11 claims
- 1672US7776756B1Etching apparatus, a method of controlling an etching solution, and a method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 2007·Granted Aug 17, 2010·3 cites·7 claims
- 1772US6436723B1Etching method and etching apparatus method for manufacturing semiconductor device and semiconductor deviceTOSHIBA KK·Filed 1999·Granted Aug 20, 2002·34 cites·12 claims
- 1870US6333274B2Method of manufacturing a semiconductor device including a seamless shallow trench isolation stepTOSHIBA KK·Filed 1998·Granted Dec 25, 2001·39 cites·4 claims
- 1969US6645876B2Etching for manufacture of semiconductor devicesTOSHIBA KK·Filed 2001·Granted Nov 11, 2003·12 cites·23 claims
- 2065US7015566B2Semiconductor wafer and a method for manufacturing a semiconductor waferTOSHIBA KK·Filed 2003·Granted Mar 21, 2006·9 cites·13 claims
- 2162US7101259B2Polishing method and apparatusTOSHIBA KK·Filed 2003·Granted Sep 5, 2006·7 cites·15 claims
- 2261US7268053B2Semiconductor wafer and a method for manufacturing a semiconductor waferTOSHIBA KK·Filed 2005·Granted Sep 11, 2007·1 cites·9 claims
- 2360US6190955B1Fabrication of trench capacitors using disposable hard maskIBM·Filed 1998·Granted Feb 20, 2001·25 cites·19 claims
- 2458US6673163B2Apparatus and method for cleaning a semiconductor substrateTOSHIBA KK·Filed 2002·Granted Jan 6, 2004·5 cites·15 claims
- 2557US7305275B2Material supply system in semiconductor device manufacturing plantEBARA CORP·Filed 2003·Granted Dec 4, 2007·6 cites·16 claims
- 2657US6679950B2Cleaning method and cleanerEBARA CORP·Filed 2001·Granted Jan 20, 2004·5 cites·18 claims
- 2753US7267742B2Etching apparatus, a method of controlling an etching solution, and a method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 2004·Granted Sep 11, 2007·3 cites·8 claims
- 2843US5815942AVapor drying system and methodTOSHIBA KK·Filed 1996·Granted Oct 6, 1998·7 cites·20 claims
- 2942US6639317B2Semiconductor device in trenchTOSHIBA KK·Filed 2002·Granted Oct 28, 2003·0 cites·2 claims
- 3040US2002050322A1Holding unit, processing apparatus and holding method of substratesFiled 2001·Application pending·0 cites
- 3139US2019141988A1Perfusion device for liver graft, and liver removal method and liver transplantation method using the deviceSCREEN HOLDINGS CO LTD·Filed 2017·Application pending·0 cites
- 3239US2008083501A1Substrate processing apparatusARAI KENICHIRO·Filed 2007·Application pending·0 cites
- 3339US2004221880A1Substrate treating apparatusTOSHIBA KK·Filed 2004·Application pending·0 cites
- 3438US2002003304A1Semiconductor device having multilevel interconnectionTOSHIBA KK·Filed 2001·Application pending·0 cites
- 3535US6159303ALiquid displacement apparatus and liquid displacement methodTOSHIBA KK·Filed 1998·Granted Dec 12, 2000·4 cites·19 claims
- 3631US6059887AProcess for cleaning the interior of semiconductor substratePUREX CO LTD·Filed 1998·Granted May 9, 2000·1 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →