Holding unit, processing apparatus and holding method of substrates

Abstract

A holding unit for holding a substrate to enable a surface of the substrate to be processed. The unit comprises a vacuum suction member that comes into contact with a peripheral portion of the surface of the substrate and sucks the substrate. A processing apparatus holds the wafer stably and allows an edge, a bevel portion and/or a back surface of the wafer to be processed.

What is claimed is:  
     
         1 . A holding unit for holding a substrate which has two parallel surfaces to process the surfaces, comprising: 
 a vacuum suction member brought into contact with a peripheral portion of one of said surfaces of said substrate to suck said substrate.    
     
     
         2 . A holding unit of  claim 1 , wherein said vacuum suction member is shaped so that processing is applied to only a portion of said substrate to which such processing should be applied.  
     
     
         3 . A holding unit of  claim 1 , wherein said vacuum suction member has an annular groove formed therein, and which is open in the side facing said substrate.  
     
     
         4 . A holding unit of  claim 1 , wherein a material forming a portion of said vacuum suction member to be brought into contact with said substrate is a material having a hardness lower than that of said substrate.  
     
     
         5 . A processing apparatus for processing a substrate, comprising: 
 a holding unit of claims  1 ; and    a surface processing unit for processing a surface of the substrate held by said holding unit.    
     
     
         6 . A processing apparatus of  claim 5 , further comprising a unit for performing at least either one of cleaning or drying of the substrate.  
     
     
         7 . A processing apparatus of  claim 5 , further comprising a dipping bath for dipping the substrate held by said holding unit.  
     
     
         8 . A processing apparatus of  claim 5 , further comprising an evaluation unit for checking a condition of the substrate after processing and for determining a resultant condition achieved by said surface processing.  
     
     
         9 . A method for holding a substrate to process a surface of said substrate, said method comprising the steps of: 
 bringing a vacuum suction member into contact with a peripheral portion of one of the surfaces of said substrate, and    holding said substrate by sucking said substrate under a vacuum.