Inventor · disambiguated record
Kazuhiko Takada
Also filed as: TAKADA KAZUHIKO
68 granted patents·12 pending applications·764 citations·filing 1989–2024
99Inventor score
Top patents by PatentIndex Score
80 records- 0198US5004207AShock mounting structure and magnetic disk apparatusIBM·Filed 1989·Granted Apr 2, 1991·110 cites·5 claims
- 0294US6702898B2Deposited film forming apparatusCANON KK·Filed 2002·Granted Mar 9, 2004·43 cites·6 claims
- 0392US5669257AMethod of crimping terminal and apparatus for the sameYAZAKI CORP·Filed 1995·Granted Sep 23, 1997·42 cites·12 claims
- 0491US5317462ACover seal for magnetic disk enclosure having stepped mating surfacesIBM·Filed 1992·Granted May 31, 1994·63 cites·10 claims
- 0585US8304310B2Manufacture method of semiconductor deviceHASHIMOTO HIROSHI·Filed 2011·Granted Nov 6, 2012·6 cites·9 claims
- 0679US6662444B2Method and apparatus of manufacturing wiring harnessYAZAKI CORP·Filed 2001·Granted Dec 16, 2003·15 cites·2 claims
- 0777US7169699B2Semiconductor device having a guard ringFUJITSU LTD·Filed 2005·Granted Jan 30, 2007·6 cites·5 claims
- 0877US5611141AApparatus and method for wire crimpingYAZAKI CORP·Filed 1994·Granted Mar 18, 1997·33 cites·15 claims
- 0976US5913553AMethod of manufacturing a wiring harnessYAZAKI CORP·Filed 1997·Granted Jun 22, 1999·24 cites·1 claims
- 1076US5727409AMethod of controlling a terminal crimping apparatusYAZAKI CORP·Filed 1995·Granted Mar 17, 1998·34 cites·10 claims
- 1174US6649965B2Semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2002·Granted Nov 18, 2003·20 cites·18 claims
- 1274US6573453B2Wiring harness and manufacturing method of the sameYAZAKI CORP·Filed 2001·Granted Jun 3, 2003·22 cites·8 claims
- 1374US5709027AMethod of making a wire harness with press-fitting contacts and apparatus thereforYAZAKI CORP·Filed 1995·Granted Jan 20, 1998·28 cites·19 claims
- 1472US5646802ADisk drive with head suspensions mounted to actuator arm opposite sides to face respective upper and lower surfaces of diskIBM·Filed 1995·Granted Jul 8, 1997·20 cites·2 claims
- 1570US7870667B2Terminal crimping apparatus and method of crimping a terminalYAZAKI CORP·Filed 2007·Granted Jan 18, 2011·4 cites·15 claims
- 1670US6125532AMethod for manufacturing wire harnessYAZAKI CORP·Filed 1998·Granted Oct 3, 2000·23 cites·5 claims
- 1768US6949775B1Semiconductor device having a guard ringFUJITSU LTD·Filed 2000·Granted Sep 27, 2005·13 cites·5 claims
- 1868US6557569B2Method of manufacturing an electrophotographic photosensitive member including multiple liquid cleaning steps and machining stepCANON KK·Filed 2001·Granted May 6, 2003·9 cites·4 claims
- 1964US2024383007A1Sorting apparatus and sorting methodYAZAKI CORP·Filed 2024·Application pending·0 cites
- 2063US6615486B1Pressure welding device for wiringYAZAKI CORP·Filed 2000·Granted Sep 9, 2003·12 cites·8 claims
- 2162US6901657B2Wiring harness production apparatusYAZAKI CORP·Filed 2001·Granted Jun 7, 2005·9 cites·5 claims
- 2262US6318382B1Cleaning method and cleaning apparatus, and electrophotographic photosensitive member and cleaning method of electrophotographic photosensitive memberCANON KK·Filed 1999·Granted Nov 20, 2001·15 cites·25 claims
- 2362US6165274APlasma processing apparatus and methodCANON KK·Filed 1998·Granted Dec 26, 2000·15 cites·21 claims
- 2459US6946167B2Deposited film forming apparatus and deposited film forming methodCANON KK·Filed 2003·Granted Sep 20, 2005·2 cites·3 claims
- 2558US10050401B2Terminal insertion device and terminal insertion methodYAZAKI CORP·Filed 2015·Granted Aug 14, 2018·1 cites·6 claims
- 2658US6722021B2Crimping apparatusYAZAKI CORP·Filed 2001·Granted Apr 20, 2004·4 cites·3 claims
- 2758US6321759B1Method for cleaning a substrateCANON KK·Filed 1998·Granted Nov 27, 2001·15 cites·6 claims
- 2857US11027940B2Winding unit and spiral electric wire manufacturing methodYAZAKI CORP·Filed 2019·Granted Jun 8, 2021·0 cites·5 claims
- 2957US10854358B2Wire harness manufacturing method and wire harness manufacturing deviceYAZAKI CORP·Filed 2018·Granted Dec 1, 2020·1 cites·4 claims
- 3056US6650956B2Wiring harness checking methodYAZAKI CORP·Filed 2001·Granted Nov 18, 2003·10 cites·5 claims
- 3155US6360436B1Method of manufacturing wire harnessesYAZAKI CORP·Filed 1997·Granted Mar 26, 2002·13 cites·5 claims
- 3255US6269538B1Press fitting apparatus for manufacturing a wiring harnessYAZAKI CORP·Filed 1999·Granted Aug 7, 2001·11 cites·8 claims
- 3354US6578256B2Sub-harness and a sub-harness manufacturing apparatusYAZAKI CORP·Filed 2002·Granted Jun 17, 2003·5 cites·6 claims
- 3454US5771574AApparatus for manufacturing pressure-welded electrical harnesses and a method thereofYAZAKI CORP·Filed 1996·Granted Jun 30, 1998·16 cites·10 claims
- 3554US2023098980A1Terminal insertion deviceYAZAKI CORP·Filed 2022·Application pending·0 cites
- 3653US2010096684A1Semiconductor device and its manufacture methodFUJITSU MICROELECTRONICS LTD·Filed 2009·Application pending·0 cites
- 3753US2023097349A1Terminal insertion method and terminal insertion deviceYAZAKI CORP·Filed 2022·Application pending·0 cites
- 3852US8981476B2Semiconductor device with high breakdown voltage and manufacture thereofFUJITSU SEMICONDUCTOR LTD·Filed 2012·Granted Mar 17, 2015·0 cites·5 claims
- 3952US6649020B1Plasma processing apparatusCANON KK·Filed 2001·Granted Nov 18, 2003·3 cites·7 claims
- 4052US2023096446A1Terminal insertion deviceYAZAKI CORP·Filed 2022·Application pending·0 cites
- 4151US5697146AApparatus for crimping terminal to electrical wireYAZAKI CORP·Filed 1995·Granted Dec 16, 1997·16 cites·9 claims
- 4250US5791037AApparatus and method for wire crimpingYAZAKI CORP·Filed 1997·Granted Aug 11, 1998·11 cites·1 claims
- 4348US9520326B2Semiconductor device with high breakdown voltage and manufacture thereofFUJITSU SEMICONDUCTOR LTD·Filed 2015·Granted Dec 13, 2016·0 cites·5 claims
- 4448US8576411B2Component position measurement methodYAZAKI CORP·Filed 2013·Granted Nov 5, 2013·0 cites·2 claims
- 4548US6300225B1Plasma processing methodCANON KK·Filed 1999·Granted Oct 9, 2001·11 cites·20 claims
- 4647US10766733B2Electric wire processing apparatus, electric wire processing method, and electric wire holding structureYAZAKI CORP·Filed 2018·Granted Sep 8, 2020·0 cites·9 claims
- 4747US8772882B2Semiconductor device and method of manufacturing semiconductor deviceTAKADA KAZUHIKO·Filed 2012·Granted Jul 8, 2014·0 cites·3 claims
- 4847US2011061235A1Terminal crimping method of crimping a terminalYAZAKI CORP·Filed 2010·Application pending·0 cites
- 4946US5967399AElectric wire pressure welding apparatus and pressure welding methodYAZAKI CORP·Filed 1998·Granted Oct 19, 1999·12 cites·7 claims
- 5046US2005224864A1Semiconductor device and its manufacture methodFUJITSU LTD·Filed 2005·Application pending·0 cites
Showing the top 50 of 80 patent records by PatentIndex Score.
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