Inventor · disambiguated record
Natsuki Makino
Also filed as: MAKINO NATSUKI
16 granted patents·11 pending applications·250 citations·filing 2000–2019
93Inventor score
Top patents by PatentIndex Score
27 records- 0197US6632335B2Plating apparatusEBARA CORP·Filed 2000·Granted Oct 14, 2003·114 cites·77 claims
- 0295US10486285B2Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding methodEBARA CORP·Filed 2017·Granted Nov 26, 2019·9 cites·10 claims
- 0393US9358662B2Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding methodEBARA CORP·Filed 2014·Granted Jun 7, 2016·9 cites·21 claims
- 0492US8795032B2Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding methodMIYAZAKI MITSURU·Filed 2009·Granted Aug 5, 2014·22 cites·14 claims
- 0592US6689257B2Substrate processing apparatus and substrate plating apparatusEBARA CORP·Filed 2001·Granted Feb 10, 2004·54 cites·12 claims
- 0680US11426834B2Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding methodEBARA CORP·Filed 2019·Granted Aug 30, 2022·1 cites·2 claims
- 0777US8038136B2Hand having rocking mechanism and substrate delivering device having the sameYASKAWA DENKI SEISAKUSHO KK·Filed 2009·Granted Oct 18, 2011·6 cites·7 claims
- 0875US7901550B2Plating apparatusEBARA CORP·Filed 2007·Granted Mar 8, 2011·5 cites·3 claims
- 0972US8742568B2Circuit board, semiconductor device, process for manufacturing circuit board and process for manufacturing semiconductor deviceKONDO MASAYOSHI·Filed 2011·Granted Jun 3, 2014·4 cites·10 claims
- 1068US7387717B2Method of performing electrolytic treatment on a conductive layer of a substrateEBARA CORP·Filed 2003·Granted Jun 17, 2008·3 cites·13 claims
- 1168US7208074B2Substrate processing apparatus and substrate plating apparatusEBARA CORP·Filed 2003·Granted Apr 24, 2007·9 cites·3 claims
- 1263US6767437B2Electroplating apparatus and electroplating methodTOSHIBA KK·Filed 2001·Granted Jul 27, 2004·3 cites·14 claims
- 1362US6746589B2Plating method and plating apparatusEBARA CORP·Filed 2001·Granted Jun 8, 2004·9 cites·16 claims
- 1461US9687957B2Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding methodEBARA CORP·Filed 2014·Granted Jun 27, 2017·0 cites·29 claims
- 1557US2008251385A1Plating apparatusKUNISAWA JUNJI·Filed 2008·Application pending·0 cites
- 1657US2008296165A1Plating apparatusKUNISAWA JUNJI·Filed 2008·Application pending·0 cites
- 1750US2008035171A1Cleaning method and cleaning apparatus for porous memberKANDA HIROYUKI·Filed 2007·Application pending·0 cites
- 1848US2005155865A1Electrolytic processing apparatus and methodFiled 2004·Application pending·0 cites
- 1948US2005023149A1Plating apparatus, plating method and substrate processing apparatusFiled 2004·Application pending·0 cites
- 2046US7442282B2Electrolytic processing apparatus and methodEBARA CORP·Filed 2003·Granted Oct 28, 2008·0 cites·21 claims
- 2144US7374646B2Electrolytic processing apparatus and substrate processing methodEBARA CORP·Filed 2004·Granted May 20, 2008·2 cites·2 claims
- 2244US2009095634A1Plating methodMAKINO NATSUKI·Filed 2007·Application pending·0 cites
- 2344US2006027452A1Substrate processing apparatus and substrate plating apparatusMISHIMA KOJI·Filed 2005·Application pending·0 cites
- 2443US2007034526A1Electrolytic processing apparatus and methodMAKINO NATSUKI·Filed 2005·Application pending·0 cites
- 2541US2004195106A1Plating method and plating apparatusFiled 2004·Application pending·0 cites
- 2636US2001024691A1Semiconductor substrate processing apparatus and methodFiled 2001·Application pending·0 cites
- 2734US2002033339A1Plating apparatus and plating method for substrateFiled 2001·Application pending·0 cites
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