Electrolytic processing apparatus and method

Abstract

There is provided an electrolytic processing apparatus and method which can produce products having various specifications with enhanced productivity, thus reducing the production cost, and which can respond flexibly to the movement toward finer interconnects in semiconductor devices. An electrolytic processing apparatus according to the present invention includes: an electrolytic processing unit including a substrate holder for holding a substrate, and a counter electrode plate disposed opposite the substrate held by the substrate holder, said electrolytic processing unit carrying out electrolytic processing by filling the space between the substrate held by the substrate holder and the counter electrode plate with an electrolysis solution while feeding electricity; and a plurality of electrolysis solution supply facilities for supplying different types of electrolysis solutions; wherein the electrolytic processing unit is selectively connectable to one of the plurality of electrolysis solution supply facilities.

1 . An electrolytic processing apparatus comprising: 
 an electrolytic processing unit including a substrate holder for holding a substrate, and a counter electrode plate disposed opposite the substrate held by the substrate holder, said electrolytic processing unit carrying out electrolytic processing by filling the space between the substrate held by the substrate holder and the counter electrode plate with an electrolysis solution while feeding electricity; and    a plurality of electrolysis solution supply facilities for supplying different types of electrolysis solutions;    wherein the electrolytic processing unit is selectively connectable to one of the plurality of electrolysis solution supply facilities.    
     
     
         2 . The electrolytic processing apparatus according to  claim 1 , wherein the substrate is an interconnect substrate, and an electrolytic processing object on the substrate is copper or a metal containing copper.  
     
     
         3 . The electrolytic processing apparatus according to  claim 1 , further comprising: 
 an input device for inputting a signal for selection of one of the plurality of electrolysis solution supply facilities to be connected to the electrolytic processing unit.    
     
     
         4 . The electrolytic processing apparatus according to  claim 3 , wherein the substrate is an interconnect substrate, and an electrolytic processing object on the substrate is copper or a metal containing copper.  
     
     
         5 . An electrolytic processing apparatus comprising: 
 a transport device for transporting a substrate;    a plurality of electrolytic processing units each including a substrate holder for holding a substrate, and a counter electrode plate disposed opposite the substrate held by the substrate holder, each of said electrolytic processing units carrying out electrolytic processing by filling the space between the substrate held by the substrate holder and the counter electrode plate with an electrolysis solution while feeding electricity; and    a plurality of electrolysis solution supply facilities for supplying different types of electrolysis solutions;    wherein each of the electrolytic processing units is selectively connectable to one of the plurality of electrolysis solution supply facilities.    
     
     
         6 . The electrolytic processing apparatus according to  claim 5 , further comprising: 
 a cleaning unit for cleaning the substrate.    
     
     
         7 . The electrolytic processing apparatus according to  claim 5 , further comprising; 
 an input device for inputting a signal for selection of one of the plurality of electrolysis solution supply facilities to be connected to at least one of the electrolytic processing units.    
     
     
         8 . The electrolytic processing apparatus according to  claim 7 , further comprising: 
 a cleaning unit for cleaning the substrate.    
     
     
         9 . An electrolytic processing method comprising: 
 carrying out a first electrolytic processing by filling a space between a substrate and a counter electrode plate disposed opposite the substrate with a first electrolysis solution while feeding electricity; and    carrying out a second electrolytic processing by filling the space between the substrate and the counter electrode plate with a second electrolysis solution which is different from the first electrolysis solution while feeding electricity.    
     
     
         10 . The electrolytic processing method according to  claim 9 , wherein the first electrolysis solution is a copper pyrophosphate plating solution and the second electrolysis solution is a copper sulfate plating solution.  
     
     
         11 . The electrolytic processing method according to  claim 9 , further comprising: 
 cleaning the first electrolysis solution remaining on the substrate and drying the substrate after the first electrolytic processing.    
     
     
         12 . The electrolytic processing method according to  claim 11 , wherein the first electrolysis solution is a copper pyrophosphate plating solution and the second electrolysis solution is a copper sulfate plating solution.