Plating method

Abstract

A plating method can form a plated film having a uniform thickness over the entire surface, including the peripheral surface, of a substrate. The plating method includes: disposing an anode so as to face a conductive film, formed on a substrate, which serves as a cathode, and disposing an auxiliary cathode on an ring-shaped seal member for sealing a peripheral portion of the substrate; bringing the conductive film, the anode and the auxiliary cathode into contact with a plating solution; and supplying electric currents between the anode and the conductive film, and between the anode and the auxiliary cathode to carry out plating.

1 . A plating method comprising:
 disposing an anode so as to face a conductive film, formed on a substrate, which serves as a cathode, and disposing an auxiliary cathode on an ring-shaped seal member for sealing a peripheral portion of the substrate;   bringing the conductive film, the anode and the auxiliary cathode into contact with a plating solution; and   supplying electric currents between the anode and the conductive film, and between the anode and the auxiliary cathode to carry out plating.   
   
   
       2 . The plating method according to  claim 1 , further comprising disposing a high-resistance structure between the anode and the substrate. 
   
   
       3 . The plating method according to  claim 1 , further comprising controlling a voltage applied to between the anode and the auxiliary cathode, or an electric current flowing between the anode and the auxiliary cathode. 
   
   
       4 . The plating method according to  claim 1 ,further comprising removing a plated film formed on a surface of the auxiliary cathode by chemical etching with a cleaning agent. 
   
   
       5 . The plating method according to  claim 1 , further comprising removing a plated film formed on a surface of the auxiliary cathode by etching using the auxiliary cathode as an anode.