Inventor · disambiguated record
Hsin-Jung Lo
Also filed as: LO HSIN-JUNG
31 granted patents·3 pending applications·541 citations·filing 2005–2024
97Inventor score
Top patents by PatentIndex Score
34 records- 0198US8456856B2Integrated circuit chip using top post-passivation technology and bottom structure technologyLIN MOU-SHIUNG·Filed 2010·Granted Jun 4, 2013·138 cites·20 claims
- 0296US8004092B2Semiconductor chip with post-passivation scheme formed over passivation layerMEGICA CORP·Filed 2008·Granted Aug 23, 2011·42 cites·42 claims
- 0396US7473999B2Semiconductor chip and process for forming the sameMEGICA CORP·Filed 2006·Granted Jan 6, 2009·40 cites·20 claims
- 0496US7397121B2Semiconductor chip with post-passivation scheme formed over passivation layerMEGICA CORP·Filed 2005·Granted Jul 8, 2008·49 cites·20 claims
- 0593US9612615B2Integrated circuit chip using top post-passivation technology and bottom structure technologyMEGICA CORP·Filed 2013·Granted Apr 4, 2017·15 cites·20 claims
- 0692US7947978B2Semiconductor chip with bond areaMEGICA CORP·Filed 2006·Granted May 24, 2011·27 cites·20 claims
- 0792US7452803B2Method for fabricating chip structureMEGICA CORP·Filed 2005·Granted Nov 18, 2008·20 cites·21 claims
- 0891US8368193B2Chip packageMEGICA CORP·Filed 2011·Granted Feb 5, 2013·6 cites·39 claims
- 0991US7960269B2Method for forming a double embossing structureMEGICA CORP·Filed 2006·Granted Jun 14, 2011·21 cites·23 claims
- 1090US8836146B2Chip package and method for fabricating the sameCHOU CHIEN-KANG·Filed 2007·Granted Sep 16, 2014·26 cites·48 claims
- 1190US8399989B2Metal pad or metal bump over pad exposed by passivation layerLIN MOU-SHIUNG·Filed 2006·Granted Mar 19, 2013·20 cites·40 claims
- 1290US8044475B2Chip packageMEGICA CORP·Filed 2009·Granted Oct 25, 2011·11 cites·53 claims
- 1389US12176278B23D chip package based on vertical-through-via connectorICOMETRUE CO LTD·Filed 2022·Granted Dec 24, 2024·1 cites·27 claims
- 1489US7964961B2Chip packageMEGICA CORP·Filed 2008·Granted Jun 21, 2011·16 cites·27 claims
- 1588US8319354B2Semiconductor chip with post-passivation scheme formed over passivation layerLIN MOU-SHIUNG·Filed 2011·Granted Nov 27, 2012·8 cites·33 claims
- 1686US7508059B2Stacked chip package with redistribution linesMEGICA CORP·Filed 2006·Granted Mar 24, 2009·12 cites·20 claims
- 1786US7495304B2Chip packageMEGICA CORP·Filed 2006·Granted Feb 24, 2009·7 cites·20 claims
- 1884US8148822B2Bonding pad on IC substrate and method for making the sameLIN MOU-SHIUNG·Filed 2006·Granted Apr 3, 2012·12 cites·32 claims
- 1983US8837872B2Waveguide structures for signal and/or power transmission in a semiconductor deviceYANG PING-JUNG·Filed 2011·Granted Sep 16, 2014·8 cites·20 claims
- 2083US8426958B2Stacked chip package with redistribution linesLIN MOU-SHIUNG·Filed 2011·Granted Apr 23, 2013·5 cites·26 claims
- 2183US7964973B2Chip structureMEGICA CORP·Filed 2008·Granted Jun 21, 2011·8 cites·64 claims
- 2282US7462558B2Method for fabricating a circuit componentMEGICA CORP·Filed 2008·Granted Dec 9, 2008·7 cites·21 claims
- 2381US8304766B2Semiconductor chip with a bonding pad having contact and test areasLIN MOU-SHIUNG·Filed 2011·Granted Nov 6, 2012·5 cites·21 claims
- 2481US8193636B2Chip assembly with interconnection by metal bumpLEE JIN-YUAN·Filed 2008·Granted Jun 5, 2012·10 cites·17 claims
- 2581US7973401B2Stacked chip package with redistribution linesMEGICA CORP·Filed 2008·Granted Jul 5, 2011·8 cites·23 claims
- 2678US7990037B2Carbon nanotube circuit component structureMEGICA CORP·Filed 2006·Granted Aug 2, 2011·6 cites·26 claims
- 2777US8232192B2Process of bonding circuitry componentsLIN MOU-SHIUNG·Filed 2005·Granted Jul 31, 2012·8 cites·67 claims
- 2877US8159074B2Chip structureLIN MOU-SHIUNG·Filed 2011·Granted Apr 17, 2012·3 cites·32 claims
- 2977US2025125241A13d chip package based on vertical-through-via connectorICOMETRUE CO LTD·Filed 2024·Application pending·0 cites
- 3062US8344524B2Wire bonding method for preventing polymer crackingMEGICA CORP·Filed 2006·Granted Jan 1, 2013·2 cites·20 claims
- 3152US7932172B2Semiconductor chip and process for forming the sameMEGICA CORP·Filed 2008·Granted Apr 26, 2011·0 cites·29 claims
- 3250US8692374B2Carbon nanotube circuit component structureLIN MOU-SHIUNG·Filed 2011·Granted Apr 8, 2014·0 cites·17 claims
- 3347US2011215469A1Method for forming a double embossing structureMEGICA CORP·Filed 2011·Application pending·0 cites
- 3439US2012193785A1Multichip PackagesLIN MOU-SHIUNG·Filed 2012·Application pending·0 cites
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