Assignee
MEGICA CORP
TW·162 granted patents·27 pending applications·3,062 citations·filing 2000–2013
Top patents by PatentIndex Score
189 records- 0199US7969006B2Integrated circuit chips with fine-line metal and over-passivation metalMEGICA CORP·Filed 2007·Granted Jun 28, 2011·96 cites·46 claims
- 0299US7902679B2Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bumpMEGICA CORP·Filed 2007·Granted Mar 8, 2011·111 cites·20 claims
- 0398US7465654B2Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structuresMEGICA CORP·Filed 2005·Granted Dec 16, 2008·60 cites·20 claims
- 0497US8021918B2Integrated circuit chips with fine-line metal and over-passivation metalMEGICA CORP·Filed 2007·Granted Sep 20, 2011·45 cites·34 claims
- 0596US8809951B2Chip packages having dual DMOS devices with power management integrated circuitsMEGICA CORP·Filed 2013·Granted Aug 19, 2014·22 cites·24 claims
- 0696US8004092B2Semiconductor chip with post-passivation scheme formed over passivation layerMEGICA CORP·Filed 2008·Granted Aug 23, 2011·42 cites·42 claims
- 0796US7863739B2Low fabrication cost, fine pitch and high reliability solder bumpMEGICA CORP·Filed 2007·Granted Jan 4, 2011·28 cites·48 claims
- 0896US7582556B2Circuitry component and method for forming the sameMEGICA CORP·Filed 2006·Granted Sep 1, 2009·40 cites·31 claims
- 0996US7582966B2Semiconductor chip and method for fabricating the sameMEGICA CORP·Filed 2007·Granted Sep 1, 2009·35 cites·20 claims
- 1096US7521812B2Method of wire bonding over active area of a semiconductor circuitMEGICA CORP·Filed 2007·Granted Apr 21, 2009·37 cites·13 claims
- 1196US7473999B2Semiconductor chip and process for forming the sameMEGICA CORP·Filed 2006·Granted Jan 6, 2009·40 cites·20 claims
- 1296US7468545B2Post passivation structure for a semiconductor device and packaging process for sameMEGICA CORP·Filed 2006·Granted Dec 23, 2008·40 cites·23 claims
- 1396US7397121B2Semiconductor chip with post-passivation scheme formed over passivation layerMEGICA CORP·Filed 2005·Granted Jul 8, 2008·49 cites·20 claims
- 1496US7247932B1Chip package with capacitorMEGICA CORP·Filed 2000·Granted Jul 24, 2007·67 cites·56 claims
- 1596US7242099B2Chip package with multiple chips connected by bumpsMEGICA CORP·Filed 2003·Granted Jul 10, 2007·175 cites·82 claims
- 1695US8021921B2Method of joining chips utilizing copper pillarMEGICA CORP·Filed 2008·Granted Sep 20, 2011·33 cites·20 claims
- 1795US7863654B2Top layers of metal for high performance IC'sMEGICA CORP·Filed 2008·Granted Jan 4, 2011·16 cites·25 claims
- 1895US7479450B2Post passivation interconnection schemes on top of the IC chipsMEGICA CORP·Filed 2007·Granted Jan 20, 2009·18 cites·20 claims
- 1995US7470927B2Semiconductor chip with coil element over passivation layerMEGICA CORP·Filed 2006·Granted Dec 30, 2008·30 cites·20 claims
- 2095US7446035B2Post passivation interconnection schemes on top of IC chipsMEGICA CORP·Filed 2007·Granted Nov 4, 2008·16 cites·20 claims
- 2195US7427560B2Top layers of metal for high performance IC'sMEGICA CORP·Filed 2007·Granted Sep 23, 2008·25 cites·18 claims
- 2295US7405149B1Post passivation method for semiconductor chip or waferMEGICA CORP·Filed 2002·Granted Jul 29, 2008·67 cites·31 claims
- 2395US7319277B2Chip structure with redistribution tracesMEGICA CORP·Filed 2005·Granted Jan 15, 2008·47 cites·12 claims
- 2495US7265047B2Post passivation interconnection schemes on top of the IC chipsMEGICA CORP·Filed 2005·Granted Sep 4, 2007·19 cites·19 claims
- 2594US8362588B2Semiconductor chip with coil element over passivation layerMEGICA CORP·Filed 2011·Granted Jan 29, 2013·14 cites·30 claims
- 2694US8004083B2Integrated circuit chips with fine-line metal and over-passivation metalMEGICA CORP·Filed 2007·Granted Aug 23, 2011·19 cites·24 claims
- 2794US7989954B2Integrated circuit chips with fine-line metal and over-passivation metalMEGICA CORP·Filed 2007·Granted Aug 2, 2011·21 cites·44 claims
- 2894US7919873B2Structure of high performance combo chip and processing methodMEGICA CORP·Filed 2008·Granted Apr 5, 2011·18 cites·32 claims
- 2994US7569422B2Chip package and method for fabricating the sameMEGICA CORP·Filed 2007·Granted Aug 4, 2009·23 cites·20 claims
- 3094US7420276B2Post passivation structure for semiconductor chip or waferMEGICA CORP·Filed 2004·Granted Sep 2, 2008·62 cites·14 claims
- 3194US7413929B2Integrated chip package structure using organic substrate and method of manufacturing the sameMEGICA CORP·Filed 2002·Granted Aug 19, 2008·62 cites·75 claims
- 3294US7351650B2Post passivation interconnection schemes on top of the IC chipsMEGICA CORP·Filed 2005·Granted Apr 1, 2008·15 cites·31 claims
- 3394US7271489B2Post passivation interconnection schemes on top of the IC chipsMEGICA CORP·Filed 2004·Granted Sep 18, 2007·69 cites·58 claims
- 3493US9612615B2Integrated circuit chip using top post-passivation technology and bottom structure technologyMEGICA CORP·Filed 2013·Granted Apr 4, 2017·15 cites·20 claims
- 3593US7868454B2High performance sub-system design and assemblyMEGICA CORP·Filed 2009·Granted Jan 11, 2011·15 cites·31 claims
- 3693US7535102B2High performance sub-system design and assemblyMEGICA CORP·Filed 2008·Granted May 19, 2009·20 cites·20 claims
- 3793US7355288B2Low fabrication cost, high performance, high reliability chip scale packageMEGICA CORP·Filed 2005·Granted Apr 8, 2008·20 cites·26 claims
- 3893US7338890B2Low fabrication cost, high performance, high reliability chip scale packageMEGICA CORP·Filed 2005·Granted Mar 4, 2008·23 cites·25 claims
- 3993US7208834B2Bonding structure with pillar and capMEGICA CORP·Filed 2004·Granted Apr 24, 2007·59 cites·32 claims
- 4092US8004088B2Post passivation interconnection schemes on top of IC chipMEGICA CORP·Filed 2007·Granted Aug 23, 2011·10 cites·20 claims
- 4192US7947978B2Semiconductor chip with bond areaMEGICA CORP·Filed 2006·Granted May 24, 2011·27 cites·20 claims
- 4292US7915161B2Post passivation interconnection schemes on top of IC chipMEGICA CORP·Filed 2007·Granted Mar 29, 2011·10 cites·35 claims
- 4392US7498196B2Structure and manufacturing method of chip scale packageMEGICA CORP·Filed 2001·Granted Mar 3, 2009·47 cites·141 claims
- 4492US7470997B2Wirebond pad for semiconductor chip or waferMEGICA CORP·Filed 2004·Granted Dec 30, 2008·66 cites·20 claims
- 4592US7459761B2High performance system-on-chip using post passivation processMEGICA CORP·Filed 2005·Granted Dec 2, 2008·24 cites·14 claims
- 4692US7452803B2Method for fabricating chip structureMEGICA CORP·Filed 2005·Granted Nov 18, 2008·20 cites·21 claims
- 4792US7271033B2Method for fabricating chip packageMEGICA CORP·Filed 2004·Granted Sep 18, 2007·53 cites·28 claims
- 4892US7230340B2Post passivation interconnection schemes on top of the IC chipsMEGICA CORP·Filed 2003·Granted Jun 12, 2007·67 cites·57 claims
- 4991US8618580B2Integrated circuit chips with fine-line metal and over-passivation metalMEGICA CORP·Filed 2013·Granted Dec 31, 2013·8 cites·11 claims
- 5091US8368193B2Chip packageMEGICA CORP·Filed 2011·Granted Feb 5, 2013·6 cites·39 claims
Showing the top 50 of 189 patent records by PatentIndex Score.
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