Inventor · disambiguated record
Damion Searls
Also filed as: SEARLS DAMION · SEARLS DAMION T
47 granted patents·13 pending applications·823 citations·filing 1999–2021
98Inventor score
Top patents by PatentIndex Score
60 records- 0198US6550531B1Vapor chamber active heat sinkINTEL CORP·Filed 2000·Granted Apr 22, 2003·106 cites·4 claims
- 0294US6856016B2Method and apparatus using nanotubes for cooling and grounding dieINTEL CORP·Filed 2002·Granted Feb 15, 2005·94 cites·23 claims
- 0394US6327145B1Heat sink with integrated fluid circulation pumpINTEL CORP·Filed 2000·Granted Dec 4, 2001·100 cites·23 claims
- 0489US6752204B2Iodine-containing thermal interface materialINTEL CORP·Filed 2001·Granted Jun 22, 2004·43 cites·20 claims
- 0584US7886809B2Apparatus and method for passive phase change thermal managementINTEL CORP·Filed 2007·Granted Feb 15, 2011·9 cites·17 claims
- 0684US7158111B1Flexible displayINTEL CORP·Filed 2000·Granted Jan 2, 2007·23 cites·26 claims
- 0784US6486589B1Circuit card assembly having controlled vibrational propertiesINTEL CORP·Filed 2000·Granted Nov 26, 2002·33 cites·13 claims
- 0883US6713871B2Surface mount solder method and apparatus for decoupling capacitance and process of makingINTEL CORP·Filed 2002·Granted Mar 30, 2004·45 cites·25 claims
- 0982US6672370B2Apparatus and method for passive phase change thermal managementINTEL CORP·Filed 2000·Granted Jan 6, 2004·26 cites·9 claims
- 1081US8659909B2Method for reducing loadline impedance in a systemSEARLS DAMION·Filed 2006·Granted Feb 25, 2014·8 cites·8 claims
- 1181US6730860B2Electronic assembly and a method of constructing an electronic assemblyINTEL CORP·Filed 2001·Granted May 4, 2004·23 cites·12 claims
- 1280US7122891B2Ceramic embedded wireless antennaINTEL CORP·Filed 2003·Granted Oct 17, 2006·32 cites·16 claims
- 1380US6580608B1Method and apparatus for thermally controlling multiple electronic componentsINTEL CORP·Filed 2001·Granted Jun 17, 2003·35 cites·25 claims
- 1477US7316265B2Method for passive phase change thermal managementINTEL CORP·Filed 2003·Granted Jan 8, 2008·18 cites·19 claims
- 1577US6752635B1Comb-shaped land grid array (LGA) socket contact for improved power deliveryINTEL CORP·Filed 2003·Granted Jun 22, 2004·21 cites·19 claims
- 1676US6903271B2Electronic assembly with thermally separated supportINTEL CORP·Filed 2003·Granted Jun 7, 2005·18 cites·23 claims
- 1771US6774310B1Surface mount connector leadINTEL CORP·Filed 2000·Granted Aug 10, 2004·9 cites·22 claims
- 1871US6747873B1Channeled heat dissipation device and a method of fabricationINTEL CORP·Filed 2003·Granted Jun 8, 2004·15 cites·8 claims
- 1971US6649937B2Semiconductor device with components embedded in backside diamond layerINTEL CORP·Filed 2002·Granted Nov 18, 2003·14 cites·17 claims
- 2068US6731221B1Electrically modifiable product labelingINTEL CORP·Filed 1999·Granted May 4, 2004·34 cites·5 claims
- 2164US6906921B2Channeled heat dissipation device and a method of fabricationINTEL CORP·Filed 2004·Granted Jun 14, 2005·10 cites·5 claims
- 2264US6627822B2Electronic assembly with separate power and signal connectionsINTEL CORP·Filed 2001·Granted Sep 30, 2003·10 cites·30 claims
- 2364US6614657B2Heat sink for cooling an electronic component of a computerINTEL CORP·Filed 2001·Granted Sep 2, 2003·12 cites·22 claims
- 2463US7495318B2Apparatus and method for improving AC coupling on circuit boardsINTEL CORP·Filed 2005·Granted Feb 24, 2009·2 cites·2 claims
- 2563US6793505B2Ganged land grid array socket contacts for improved power deliveryINTEL CORP·Filed 2002·Granted Sep 21, 2004·11 cites·10 claims
- 2662US7230317B2Capacitor placement for integrated circuit packagesINTEL CORP·Filed 2004·Granted Jun 12, 2007·11 cites·21 claims
- 2762US6359372B1Circuit card assembly having controlled expansion propertiesINTEL CORP·Filed 2000·Granted Mar 19, 2002·9 cites·17 claims
- 2861US9478488B2Reducing loadline impedance in a systemINTEL CORP·Filed 2014·Granted Oct 25, 2016·0 cites·4 claims
- 2961US7145782B2Reducing loadline impedance in a systemINTEL CORP·Filed 2004·Granted Dec 5, 2006·6 cites·24 claims
- 3059US10251273B2Mainboard assembly including a package overlying a die directly attached to the mainboardSEARLS DAMION·Filed 2008·Granted Apr 2, 2019·2 cites·12 claims
- 3159US7517732B2Thin semiconductor device packageINTEL CORP·Filed 2006·Granted Apr 14, 2009·1 cites·9 claims
- 3258US12442712B2Liquid cooling system leak detection improvementsINTEL CORP·Filed 2020·Granted Oct 14, 2025·0 cites·15 claims
- 3357US7135758B2Surface mount solder method and apparatus for decoupling capacitance and process of makingINTEL CORP·Filed 2004·Granted Nov 14, 2006·5 cites·16 claims
- 3457US6797085B1Metallurgically enhanced heat sinkINTEL CORP·Filed 2000·Granted Sep 28, 2004·3 cites·14 claims
- 3554US7638884B2Thin semiconductor device packageINTEL CORP·Filed 2009·Granted Dec 29, 2009·0 cites·14 claims
- 3654US6996899B2Electronic assembly and a method of constructing an electronic assemblyINTEL CORP·Filed 2003·Granted Feb 14, 2006·4 cites·4 claims
- 3752US10555417B2Mainboard assembly including a package overlying a die directly attached to the mainboardINTEL CORP·Filed 2019·Granted Feb 4, 2020·0 cites·15 claims
- 3852US7538440B2Method for improved high current component interconnectionsINTEL CORP·Filed 2003·Granted May 26, 2009·3 cites·4 claims
- 3952US6913999B2Semiconductor device with components embedded in backside diamond layerINTEL CORP·Filed 2003·Granted Jul 5, 2005·4 cites·17 claims
- 4052US6884087B2Socket with multiple contact pad area socket contactsINTEL CORP·Filed 2003·Granted Apr 26, 2005·7 cites·15 claims
- 4152US6775122B1Circuit board with added impedanceINTEL CORP·Filed 1999·Granted Aug 10, 2004·14 cites·20 claims
- 4252US2007125833A1Method for improved high current component interconnectionsAMIR DUDI I·Filed 2007·Application pending·0 cites
- 4351US2009310320A1Low profile solder grid array technology for printed circuit board surface mount componentsROTH WESTON·Filed 2008·Application pending·0 cites
- 4451US2012224331A1Low profile solder grid array technology for printed circuit board surface mount componentsROTH WESTON·Filed 2012·Application pending·0 cites
- 4550US6905979B2Apparatus and method for improving AC coupling on circuit boardsINTEL CORP·Filed 2002·Granted Jun 14, 2005·3 cites·15 claims
- 4649US7791585B2Method of fabricating flexible displayINTEL CORP·Filed 2006·Granted Sep 7, 2010·0 cites·19 claims
- 4749US2005225953A1Method for improved high current component interconnectionsAMIR DUDI I·Filed 2005·Application pending·0 cites
- 4845US2009051004A1Surface Mount Components Joined Between a Package Substrate and a Printed Circuit BoardROTH WESTON C·Filed 2007·Application pending·0 cites
- 4943US7255492B2Electro-optic surface mount light pipe and connectorINTEL CORP·Filed 2004·Granted Aug 14, 2007·0 cites·7 claims
- 5043US6793503B2Ganged land grid array socket contacts for improved power deliveryINTEL CORP·Filed 2003·Granted Sep 21, 2004·0 cites·6 claims
Showing the top 50 of 60 patent records by PatentIndex Score.
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