Assignee

SEARLS DAMION

US·2 granted patents·10 citations·filing 2006–2008

Technology mixH05K2 H10W2 G06F1 H01L1 Y02P1 Y10T1

Top patents by PatentIndex Score

2 records

0181US8659909B2Method for reducing loadline impedance in a systemSEARLS DAMION·Filed 2006·Granted Feb 25, 2014·8 cites·8 claims
0259US10251273B2Mainboard assembly including a package overlying a die directly attached to the mainboardSEARLS DAMION·Filed 2008·Granted Apr 2, 2019·2 cites·12 claims

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