Method for improved high current component interconnections

Abstract

A printed circuit board having at least one conductive region covered in solder paste has preformed solder elements placed on the solder paste in the conductive region. A component package is placed onto the printed circuit board over the conductive region and the solder is reflowed, forming a wide solder interconnection between the component and the conductive region of the printed circuit board.

1 - 21 . (canceled)  
   
   
       22 . A printed circuit board, comprising: 
 a plurality of conductive regions;    a layer of solder paste applied to the plurality of conductive regions; and    a plurality of solder balls placed onto the layer of solder paste in at least one of the plurality of conductive regions.    
   
   
       23 . The printed circuit board of  claim 22 , wherein the plurality of solder balls are located in a region where additional solder volume is desired.  
   
   
       24 . The printed circuit board of  claim 22 , further comprising at least one component package placed over at least one of the plurality of conductive regions containing a plurality of solder balls, wherein the component package contains component solder balls.  
   
   
       25 . The printed circuit board of  claim 24 , wherein each of the plurality of solder balls are located interstitial to the component solder balls.  
   
   
       26 . A printed circuit board, comprising: 
 a component attach region;    at least one signal pad formed in the component attach region, the at least one signal pad electrically coupled with at least one signal line;    at least one conductive plane formed in the component attach region;    a layer of solder paste applied to the at least one signal pad and the at least one conductive plane;    a stencil placed over the printed circuit board; and    a plurality of solder balls placed onto the layer of solder paste over the at least one conductive plane.    
   
   
       27 . The printed circuit board of  claim 26 , wherein the stencil contains a plurality of openings over the at least one conductive plane.  
   
   
       28 . The printed circuit board of  claim 26 , further comprising a solder mask.