Inventor · disambiguated record
Maria M. Portuondo
Also filed as: PORTUONDO MARIA M
25 granted patents·3 pending applications·1,043 citations·filing 1994–2010
97Inventor score
Files withPANDA PROJECT14SILICON BANDWIDTH INC7THE PANDA PROJECT3CRANE JR STANFORD W1QUANTUM LEAP PACKAGING INC1
Top patents by PatentIndex Score
28 records- 0195US5821457ASemiconductor die carrier having a dielectric epoxy between adjacent leadsPANDA PROJECT·Filed 1997·Granted Oct 13, 1998·230 cites·10 claims
- 0295US5543586AApparatus having inner layers supporting surface-mount componentsPANDA PROJECT·Filed 1994·Granted Aug 6, 1996·167 cites·22 claims
- 0393US5637019AElectrical interconnect system having insulative shrouds for preventing mismatingPANDA PROJECT·Filed 1994·Granted Jun 10, 1997·86 cites·18 claims
- 0489USD369923SComputer cabinetTHE PANDA PROJECT·Filed 1994·Granted May 21, 1996·34 cites·1 claims
- 0584US6577003B1Semiconductor chip carrier affording a high-density external interfaceSILICON BANDWIDTH INC·Filed 2000·Granted Jun 10, 2003·25 cites·29 claims
- 0683US5696027AMethod of manufacturing a semiconductor chip carrier affording a high-density external interfacePANDA PROJECT·Filed 1995·Granted Dec 9, 1997·46 cites·31 claims
- 0782USD363707SComputer cabinetTHE PANDA PROJECT·Filed 1994·Granted Oct 31, 1995·23 cites·1 claims
- 0881US7803020B2Backplane system having high-density electrical connectorsCRANE JR STANFORD W·Filed 2007·Granted Sep 28, 2010·9 cites·20 claims
- 0979US5541449ASemiconductor chip carrier affording a high-density external interfacePANDA PROJECT·Filed 1994·Granted Jul 30, 1996·40 cites·26 claims
- 1077US5659953AMethod of manufacturing an apparatus having inner layers supporting surface-mount componentsPANDA PROJECT·Filed 1995·Granted Aug 26, 1997·45 cites·26 claims
- 1174US5781408AComputer system having a motorized door mechanismPANDA PROJECT·Filed 1996·Granted Jul 14, 1998·60 cites·23 claims
- 1273US6073229AComputer system having a modular architecturePANDA PROJECT·Filed 1997·Granted Jun 6, 2000·22 cites·23 claims
- 1371US6339191B1Prefabricated semiconductor chip carrierSILICON BANDWIDTH INC·Filed 1994·Granted Jan 15, 2002·28 cites·150 claims
- 1470US6977432B2Prefabricated semiconductor chip carrierQUANTUM LEAP PACKAGING INC·Filed 2004·Granted Dec 20, 2005·11 cites·12 claims
- 1570US5822551APassive backplane capable of being configured to a variable data path width corresponding to a data size of the pluggable CPU boardPANDA PROJECT·Filed 1996·Granted Oct 13, 1998·38 cites·71 claims
- 1669US5819403AMethod of manufacturing a semiconductor chip carrierPANDA PROJECT·Filed 1995·Granted Oct 13, 1998·24 cites·78 claims
- 1769US5812797AComputer having a high density connector systemPANDA PROJECT·Filed 1996·Granted Sep 22, 1998·34 cites·8 claims
- 1867US6097086ASemiconductor chip carrier including an interconnect component interfaceSILICON BANDWIDTH INC·Filed 1999·Granted Aug 1, 2000·21 cites·21 claims
- 1966US5824950ALow profile semiconductor die carrierPANDA PROJECT·Filed 1995·Granted Oct 20, 1998·39 cites·32 claims
- 2062US7183646B2Semiconductor chip carrier affording a high-density external interfaceSILICON BANDWIDTH INC·Filed 2003·Granted Feb 27, 2007·6 cites·17 claims
- 2157US5576931AComputer with two fans and two air circulation areasPANDA PROJECT·Filed 1994·Granted Nov 19, 1996·27 cites·32 claims
- 2253US5892280ASemiconductor chip carrier affording a high-density external interfaceFiled 1997·Granted Apr 6, 1999·11 cites·29 claims
- 2353USD382254SComputer cabinetTHE PANDA PROJECT·Filed 1995·Granted Aug 12, 1997·8 cites·1 claims
- 2453US2010323536A1Backplane system having high-density electrical connectorsWOLPASS CAPITAL INV L L C·Filed 2010·Application pending·0 cites
- 2550US6828511B2Prefabricated semiconductor chip carrierSILICON BANDWIDTH INC·Filed 2001·Granted Dec 7, 2004·2 cites·9 claims
- 2650US2005280158A1Prefabricated semiconductor chip carrierSILICON BANDWIDTH INC·Filed 2005·Application pending·0 cites
- 2741US2006282593A1Backplane system having high-density electrical connectorsSILICON BANDWIDTH INC·Filed 2006·Application pending·0 cites
- 2839US5791947AContact beam for electrical interconnect componentPANDA PROJECT·Filed 1995·Granted Aug 11, 1998·7 cites·20 claims
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