Backplane system having high-density electrical connectors

Abstract

A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane.

1 . A system, comprising:
 a connector between first and second backplanes, the connector including a plurality of contact components, at least one contact component of the plurality of contact components including:   an insulative portion having a plurality of sides; and   a plurality of conductive posts extending from the plurality of sides of the insulative portion, at least one of the plurality of conductive posts including a conductive contact portion.   
     
     
         2 . The system of  claim 1 , wherein the insulative portion further includes:
 an elongated portion having a rectangular cross-section; and   a tip portion adjacent to the elongated portion.   
     
     
         3 . The system of  claim 1 , wherein the connector further includes a plurality of receiving contact components, at least one receiving contact component of the plurality of receiving contact components including:
 a plurality of beams, at least one beam of the plurality of beams including:
 an interface portion extending in a first direction; and 
 a lead-in portion extending in a second direction different than the first direction. 
   
     
     
         4 . The system of  claim 3 , wherein the plurality of beams include at least four beams, and wherein first respective interface portions of a first set of at least two beams of the at least four beams are longer than second respective interface portions of a second set of at least two beams of the at least four beams. 
     
     
         5 . The system of  claim 1 , wherein the at least one of the plurality of conductive posts is formed of at least one of beryllium copper, phosphor bronze, brass, a copper alloy, tin, gold, or palladium. 
     
     
         6 . The system of  claim 1 , wherein the at least one of the plurality of conductive posts is formed of at least one of beryllium copper, phosphor bronze, brass, or a copper alloy, and wherein the at least one of the plurality of conductive posts is plated with at least one of tin, gold, palladium, or nickel. 
     
     
         7 . The system of  claim 1 , wherein the at least one of the plurality of conductive posts further includes a second surface portion different than the conductive contact portion, and wherein the conductive contact portion is plated and the second surface portion is unplated. 
     
     
         8 . The system of  claim 1 , wherein the insulative portion is formed of a liquid crystal polymer. 
     
     
         9 . The system of  claim 1 , wherein the connector provides a signal density of at least 300 contacts per linear inch between the first and second backplanes. 
     
     
         10 . A system, comprising:
 a backplane; and   a plurality of backplane connectors attached to the backplane configured for connection with a circuit board connector attached to a corresponding circuit board;   wherein at least one backplane connector of the plurality of backplane connectors comprises a plurality of contact pins arranged in at least one group of rows and columns, and wherein the at least one backplane connector and the circuit board connector form a high-density connector pair with a signal density of at least 100 contacts per linear inch between the corresponding circuit board and the backplane.   
     
     
         11 . The system of  claim 10 , wherein the at least one group includes pins extending along a surface of an insulator. 
     
     
         12 . The system of  claim 11 , wherein the pins of the at least one group are provided in an interleaved arrangement. 
     
     
         13 . The system of  claim 10 , wherein the plurality of contact pins comprise a flexible beam portion that flexes laterally in response to mating with a corresponding contact of the circuit board connector. 
     
     
         14 . The system of  claim 10 , wherein the backplane includes a wiring board, wherein the plurality of backplane connectors are mounted on the wiring board, wherein the plurality of contact pins comprise electrically conductive posts and the at least one backplane connector comprises a carrier holding the electrically conductive posts, and wherein the electrically conductive posts extend through holes in the carrier. 
     
     
         15 . A system, comprising:
 a backplane; and   a first connector attached to the backplane and configured for connection with a second connector attached to a circuit board;   wherein the first connector comprises a plurality of contact pins arranged in groups having rows and columns, and   wherein the first and second connectors form a high-density connector pair that provides a signal density of at least 100 contacts per linear inch between the circuit board and the backplane.   
     
     
         16 . The system of  claim 15 , wherein the plurality of contact pins of the first connector comprise a flexible beam portion that flexes laterally upon mating with a corresponding contact of the second connector. 
     
     
         17 . The system of  claim 15 , wherein the backplane includes a wiring board on which the first connector is mounted, wherein the plurality of contact pins comprise a plurality of electrically-conductive posts, wherein the first connector further comprises a plurality of holders for the plurality of electrically-conductive posts, wherein the plurality of electrically-conductive posts extend through a plurality of holes of the plurality of holders. 
     
     
         18 . The system of  claim 17 , wherein at least a portion of the plurality of electrically-conductive posts is plated with an electrically-conductive material. 
     
     
         19 . The system of  claim 17 , wherein at least one hole of the plurality of holes has sidewalls made at least partially of an insulative material that engages at least one corresponding post of the plurality of electrically-conductive posts. 
     
     
         20 . The system of  claim 17 , wherein at least one electrically-conductive post of the plurality of electrically-conductive posts includes a first portion extending from a respective holder of the plurality of holders in a direction away from the wiring board and a second portion extending from the respective holder toward the wiring board and wherein the second portion has an end surface that facilitates formation of a surface-mount connection to a surface of the wiring board, the end surface being perpendicular to a longitudinal axis of the at least one electrically-conductive post.